Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2891
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18535231 | SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18389018 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18222296 | LED MODULE, METHOD OF MANUFACTURING THE SAME, AND LED DISPLAY APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO,. LTD. |
| 18400339 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18543388 | DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17841178 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18155681 | QUANTUM WELL-BASED LED STRUCTURE ENHANCED WITH SIDEWALL HOLE INJECTION | Non-Final OA | Google LLC |
| 18505668 | DEVICE PERFORMANCE DIVERSIFICATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17853910 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18518416 | SEMICONDUCTOR PACKAGE STRUCTURES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 17694330 | FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT | Non-Final OA | NXP B.V. |
| 18531858 | LENSES FORMED BY ADDITIVE MANUFACTURING FOR LIGHT-EMITTING DIODE PACKAGES | Non-Final OA | CreeLED, Inc. |
| 18543360 | LIGHT EMITTING STRUCTURE FOR VEHICLE WINDOW | Non-Final OA | GM Global Technology Operations LLC |
| 17902463 | HIGH-ELECTRON-MOBILITY TRANSISTOR | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18221963 | Light Emitting Module and Light Emitting System Including the Same | Non-Final OA | Seoul Viosys Co., Ltd. |
| 17909807 | EPITAXIAL PROCESSING OF SINGLE-CRYSTALLINE FILMS ON AMORPHOUS SUBSTRATES | Final Rejection | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| 18523906 | SEMICONDUCTOR PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGES, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGING SUBSTRATE | Non-Final OA | Absolics Inc. |
| 18263356 | DISPLAY PANEL | Non-Final OA | TCL TECHNOLOGY GROUP CORPORATION |
| 18122118 | RESISTIVE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | DB HITEK CO., LTD. |
| 18390943 | GATE-SOURCE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ASYMMETRIC TRENCH MOSFET AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD. |
| 18388233 | NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC DEVICE INCLUDING MEMORY DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18534863 | STRUCTURE WITH FERROELECTRIC MEMORY STACKS HAVING DIFFERENT SWITCHING VOLTAGES AND RELATED METHODS | Non-Final OA | GlobalFoundries Dresden Module One Limited Liability Company & Co. KG |
| 18516347 | System And Methods Using An Inline Surface Engineering Source | Non-Final OA | Varian Semiconductor Equipment Associates, Inc. |
| 17987564 | SCHOTTKY BARRIER DIODE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
| 18216575 | SEMICONDUCTOR EPITAXY STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND LED CHIP | Non-Final OA | XIAMEN CHANGELIGHT CO., LTD. |
| 18044811 | LED DEVICE | Non-Final OA | PORO TECHNOLOGIES LTD |
| 17926505 | LIGHT EMITTING DEVICE ARRAY | Non-Final OA | PLESSEY SEMICONDUCTORS LIMITED |
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