Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2891 3616
This examiner grants 74% of resolved cases
Dmitriy Yemelyanov works in Tech Center 3600 and Art Unit 2891. The examiner has 572 resolved cases. The allowance rate is 74.3 percent, and the median days to allowance is 960. These metrics provide a clear picture of the expected outcomes and the duration of the prosecution process. The 960 day median represents the typical period from filing to the grant of a patent for applications assigned to this examiner.
The interview lift for this examiner is 19.2 percent. This indicates that interviews are associated with a higher probability of allowance. For the 572 resolved cases, the 19.2 percent lift and the 74.3 percent allowance rate suggest that practitioners should use interviews as a key tool. Engaging in oral advocacy may help navigate the 960 day median prosecution timeline more effectively for applications in Art Unit 2891.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18608838 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD, |
| 18681307 | THIN FILM TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF, COMPOSITE ETCHING SOLUTION AND ARRAY SUBSTRATE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18818017 | LIGHT EMITTING ELEMENT, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18412691 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18409811 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18527071 | FLEXIBLE DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18591169 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18155681 | QUANTUM WELL-BASED LED STRUCTURE ENHANCED WITH SIDEWALL HOLE INJECTION | Final Rejection | Google LLC |
| 17539685 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | Final Rejection | CreeLED, Inc. |
| 17539678 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | Non-Final OA | CreeLED, Inc. |
| 18518416 | SEMICONDUCTOR PACKAGE STRUCTURES | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18287918 | LIGHT-EMITTING APPARATUS AND ELECTRONIC DEVICE | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18687167 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18398848 | CROSS-COUPLE CONSTRUCT WITH SHIFTED GATE CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18479005 | INTEGRATED CIRCUIT DEVICE WITH LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR AND ZENER DIODE | Non-Final OA | Texas Instruments Incorporated |
| 18789172 | SEMICONDUCTOR DEVICE STRUCTURE WITH HYBRID FINS | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18435685 | SEMICONDUCTOR STRUCTURE WITH BLOCKING FEATURES FORMED WITHIN BASE EPITAXY LAYERS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18401853 | PACKAGE STRUCTURE, DIE STRUCTURE AND METHOD FOR FORMING THE PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18397522 | Transparent Conductive Oxide Layer With Ohmic Contact On n-type AlInGaP for LEDs and MicroLEDs | Non-Final OA | Lumileds LLC |
| 18412390 | DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATION OF DUAL SIDE MOLD MODULES | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 18839132 | SOLID-STATE IMAGING ELEMENT | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 17902463 | HIGH-ELECTRON-MOBILITY TRANSISTOR | Final Rejection | GlobalFoundries U.S. Inc. |
| 18431726 | MICRO-ELECTROMECHANICAL SYSTEM (MEMS) MIRROR COMB DRIVE | Non-Final OA | Lumentum Operations LLC |
| 18388233 | NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC DEVICE INCLUDING MEMORY DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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