DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group III in the reply filed on 02/26/2026 is acknowledged.
Drawings
The drawings are objected to because many numerals in Figs. 3K and 2L are pointed to wrong regions. Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 29 and 34 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 29 recites the limitation "the patterned photosensitive polymer layer" in the first line of the claim. There is insufficient antecedent basis for this limitation in the claim.
Claim 34 recites the limitation "the photosensitive polymer layer" in the second line of the claim. There is insufficient antecedent basis for this limitation in the claim.
Allowable Subject Matter
Claims 15-28 and 30-33 are allowed.
The following is a statement of reasons for the indication of allowable subject matter: The prior art of record does not teach or suggest, singularly or in combination, at least the limitations of "forming a polymer layer over the wire-bond pad and the flip-chip bond pad; etching the polymer layer to expose a first electrically conducting surface of the wire-bond pad and an intermediate electrically conducting surface of the flip-chip bond pad; forming a patterned mask that masks the first electrically conducting surface of the wire-bond pad and exposes the intermediate electrically conducting surface of the flip-chip bond pad; depositing a first electrically conducting material over the patterned mask to thereby form a flip-chip bump over the intermediate electrically conducting surface of the flip-chip bond pad such that the flip-chip bump comprises a second electrically conducting surface; and removing the patterned mask" as recited in claim 15, "forming a polymer layer over the second passivation layer; etching the polymer layer to expose the first electrically conducting surface and the intermediate electrically conducting surface; forming a patterned mask that masks the first electrically conducting surface and exposes the intermediate electrically conducting surface; and depositing an electrically conducting material over the patterned mask to form a flip-chip bump over the intermediate electrically conducting surface, the flip-chip bump comprising a second electrically conducting surface" as recited in claim 21, "forming a polymer layer over the wire-bond pad and the flip-chip bond pad; lithographically patterning the polymer layer to form openings exposing a first electrically conducting surface of the wire-bond pad and an intermediate electrically conducting surface of the flip-chip bond pad; curing the patterned polymer layer; depositing an under-bump metallurgy layer over the patterned polymer layer, the first electrically conducting surface, and the intermediate electrically conducting surface; forming a patterned photoresist over the under-bump metallurgy layer that masks the first electrically conducting surface and exposes the intermediate electrically conducting surface; depositing a conductive material over the patterned photoresist to form a flip-chip bump over the intermediate electrically conducting surface, the flip-chip bump comprising a second electrically conducting surface; removing the patterned photoresist; and etching exposed portions of the under-bump metallurgy layer" as recited in claim 28.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Niwa et al. (US 2023/0411269 A1) teach a wiring board 20 having the flip chip pads 21a and 21d and the wiring bonding pad 21e.
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/HSIN YI HSIEH/Primary Examiner, Art Unit 2899 6/16/2026
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