Prosecution Insights
Last updated: May 29, 2026
Application No. 18/535,882

ELECTRONIC CIRCUIT WITH MOS TRANSISTORS AND MANUFACTURING METHOD

Non-Final OA §102§103
Filed
Dec 11, 2023
Priority
Dec 22, 2022 — FR 2214263
Examiner
AU, BAC H
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
STMicroelectronics
OA Round
1 (Non-Final)
81%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 81% — above average
81%
Career Allowance Rate
668 granted / 825 resolved
+13.0% vs TC avg
Moderate +11% lift
Without
With
+10.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
21 currently pending
Career history
852
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
80.9%
+40.9% vs TC avg
§102
11.4%
-28.6% vs TC avg
§112
1.5%
-38.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 825 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I invention, claims 1-10, 17-20, and newly added claims 21-26, in the reply filed on April 1, 2026, is acknowledged. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-4, 9, 17, and 19-20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Bu et al. (U.S. Pub. 2008/0308872) [Hereafter “Bu”]. Regarding claims 1-4 and 9, Bu [Fig.11] discloses an electronic circuit, comprising a plurality of transistors including: at least one first MOS transistor of a first conductivity type arranged inside and on top of at least one first active area [200] of a semiconductor substrate [8]; at least one second MOS transistor of the second conductivity type arranged inside and on top of at least one second active area [100] of the semiconductor substrate; each first active area [200] being delimited by a first insulating region [20] which is recessed with respect to a first surface of the semiconductor substrate by a first depth; and each second active area [100] being delimited by a second insulating region [20] which is flush with the first surface of the semiconductor substrate [Fig.11], or which is recessed with respect to the first surface of the semiconductor substrate by a second depth smaller than the first depth; wherein the first surface of the semiconductor substrate is topped with gate regions of the at least one first MOS transistor and of the at least one second MOS transistor, each gate region being insulated from the semiconductor substrate by a gate insulator layer [40A/40B]; wherein the at least one first and one second insulating regions [20] are shallow trench insulations [Para.54]; wherein the at least one first and one second insulating regions [region 20 between active areas 100 and 200] are adjacent to each other; wherein the semiconductor substrate [8] includes silicon [Para.53] and the at least one first and one second insulating regions [20] include silicon oxide [Para.82]. Regarding claims 17 and 19-20, Bu [Fig.11] discloses an integrated circuit, comprising: a semiconductor substrate [8] including a first active area [200] and a second active area [100]; a first transistor of a first conductivity type at the first active region [Para.54]; a second transistor of a second conductivity type at the second active area [Para.54]; and a trench insulation [20] defining a boundary between the first active area and the second active area and including a top surface with a step such that a first portion of the top surface of the trench insulation next to the first active area [200] is lower than a second portion of the top surface of the trench insulation than to next to the second active area [100] [Fig.11]; wherein the top surface of the trench insulation [20] is below a top surface of the semiconductor substrate near the first active area [200], wherein the top surface of the trench insulation is substantially coplanar with the top surface of the semiconductor substrate near the second active area [100]; wherein the trench insulation [20] is silicon oxide [Para.82]. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 5 is/are rejected under 35 U.S.C. 103 as being unpatentable over Bu et al. (U.S. Pub. 2008/0308872). Regarding claim 5, Bu discloses the insulating region [20] having a first depth and a second depth [region 20 between active areas 100 and 200], but fails to explicitly disclose wherein the first depth is greater than or equal to 120 Å, and the second depth is smaller than 120 Å. However, it would have been obvious to provide the depths as claimed, since it has been held that applying a known technique to a known process in order to yield predictable results would have been obvious. Further, it would have been obvious to try one of the known methods with a reasonable expectation of success. KSR International Co. v. Teleflex Inc., 82 USPQ2d 1385 (2007). Claim(s) 6-7 and 10 is/are rejected under 35 U.S.C. 103 as being unpatentable over Bu et al. (U.S. Pub. 2008/0308872) in view of Okano (U.S. Pub. 2017/0062423). Regarding claims 6-7, Bu fails to explicitly disclose the limitations of the claims. However, Okana [Fig.14] discloses an electronic circuit wherein the gate region of at least one transistor among the plurality of transistors includes at least one counter-doping area [11; N-well] of a conductivity type opposite to the conductivity type of said at least one transistor [PT; PMOS], said at least one counter-doping area being positioned and sized to attenuate the hump effect of said at least one transistor, said at least one counter-doping area being positioned at the level of an overlapping area between the gate region [20] and the active area of said at least one transistor [Fig.14]; wherein the at least one transistor is the at least one first MOS transistor. It would have been obvious to include the claimed limitations, since it has been held that applying a known technique to a known process in order to yield predictable results would have been obvious. Further, it would have been obvious to try one of the known methods with a reasonable expectation of success. KSR International Co. v. Teleflex Inc., 82 USPQ2d 1385 (2007). Regarding claim 10, Bu fails to explicitly disclose wherein the electronic circuit is contained in an electrically erasable and programmable non-volatile memory. However, Okano [Para.26] discloses wherein the electronic circuit is contained in an electrically erasable and programmable non-volatile memory. It would have been obvious to include wherein the electronic circuit is contained in an electrically erasable and programmable non-volatile memory, since it has been held that applying a known technique to a known process in order to yield predictable results would have been obvious. Further, it would have been obvious to try one of the known methods with a reasonable expectation of success. KSR International Co. v. Teleflex Inc., 82 USPQ2d 1385 (2007). Allowable Subject Matter Claims 21-26 are allowed. The following is an examiner’s statement of reasons for allowance: Prior art does not fairly disclose or make obvious the claimed device/method taken as a whole, and specifically, the limitations of a first trench insulation in a semiconductor substrate delimiting a first active area of the semiconductor substrate; a second trench insulation in the semiconductor substrate delimiting a second active area of the semiconductor substrate; a first MOS transistor of a first conductivity type at the first active region; and a second MOS transistor of a second conductivity type at the second active region; wherein a top surface of the first trench insulation is recessed to a first depth below a top surface of the semiconductor substrate; and wherein a top surface of the second trench insulation is recessed to a second depth below the top surface of the semiconductor substrate. Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.” Claims 8 and 18 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: Prior art does not fairly disclose or make obvious the claimed device/method taken as a whole, and specifically, the limitations of [Claim 8] wherein the first conductivity type is type N, each first MOS transistor being an NMOS transistor, and the second conductivity type is type P, each second MOS transistor being a PMOS transistor. [Claim 18] wherein the first transistor is an NMOS transistor and the second transistor is a PMOS transistor. Bu discloses the opposite transistor types being the first and the second transistors compared to the claimed requirements. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. The cited prior art is considered analogous art and discloses at least some of the claimed subject matter of the current invention. However, the prior art does not fairly disclose or make obvious the claimed device/method taken as a whole for the allowable claims as indicated above. Any inquiry concerning this communication or earlier communications from the examiner should be directed to BAC H AU whose telephone number is (571)272-8795. The examiner can normally be reached M-F 9:00AM-6:00PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Leonard Chang can be reached at 571-270-3691. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /BAC H AU/Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Dec 11, 2023
Application Filed
Apr 23, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
81%
Grant Probability
92%
With Interview (+10.8%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 825 resolved cases by this examiner. Grant probability derived from career allowance rate.

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