Prosecution Insights
Last updated: October 02, 2026

Examiner: AU, BAC H

Tech Center 2800 • Art Units: 2822 2898

This examiner grants 81% of resolved cases

Analysis

Bac H Au is an examiner in Tech Center 2800 and Art Unit 2822 with 842 resolved cases. The examiner has an allowance rate of 80.9 percent. This rate is paired with a median days to allowance of 880, which provides a baseline for expected pendency.

Practitioners should note the interview lift of 11.1 percent. The volume of cases provides a basis for understanding the examination style within this art unit. The combination of the previously mentioned allowance rate and 880 median days to allowance suggests that many applications reach a resolution.

For those navigating Art Unit 2822, the 11.1 percent interview lift offers a way to further increase the probability of success. Direct communication with the examiner may help clarify technical issues that remain after the initial examination. The data indicates that the prosecution process typically concludes within the timeframe established by the median days to allowance.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

80.9%
Allow Rate
+12.9% vs TC avg
867
Total Applications
+11.0%
Interview Lift
881
Avg Prosecution Days
Based on 845 resolved cases, 2023–2026

Rejection Statute Breakdown

0.4%
§101 Eligibility
27.9%
§102 Novelty
50.9%
§103 Obviousness
12.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18605564 DISPLAY DEVICE Non-Final OA LG DISPLAY CO., LTD.
18384687 DISPLAY APPARATUS WITH IMPROVED ADHESION CHARACTERISTICS IN NON-ACTIVE AREA Final Rejection LG DISPLAY CO., LTD.
18605524 PACKAGE COMPRISING INTEGRATED DEVICES AND WIRE BONDS COUPLED TO INTEGRATED DEVICES Non-Final OA QUALCOMM Incorporated
18091270 IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS Final Rejection Intel Corporation
17743913 EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT Non-Final OA Intel Corporation
17708299 METHODS AND SYSTEMS FOR FILLING A GAP Non-Final OA ASM IP Holding, B.V.
18585802 DOUBLE LAYER MEMS DEVICES Non-Final OA Murata Manufacturing Co., Ltd.
18348211 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Non-Final OA SK hynix Inc.
18177979 PATTERN FORMING METHOD, TEMPLATE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Final Rejection Kioxia Corporation
18733512 SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18232718 Contact Structure For Semiconductor Device Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
18605500 SEMICONDUCTOR DEVICE HAVING CONNECTION WIRING TO WHICH WIRE IS CONNECTED Non-Final OA FUJI ELECTRIC CO., LTD.
18605325 LIGHT RECEIVING ELEMENT Non-Final OA AIO CORE CO., LTD.

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