Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2898
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18605312 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18605564 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18384687 | DISPLAY APPARATUS WITH IMPROVED ADHESION CHARACTERISTICS IN NON-ACTIVE AREA | Final Rejection | LG DISPLAY CO., LTD. |
| 18605524 | PACKAGE COMPRISING INTEGRATED DEVICES AND WIRE BONDS COUPLED TO INTEGRATED DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 17743913 | EMBEDDED ROUTING LAYER FOR INLINE CIRCUIT EDIT | Non-Final OA | Intel Corporation |
| 17708299 | METHODS AND SYSTEMS FOR FILLING A GAP | Non-Final OA | ASM IP Holding, B.V. |
| 18194571 | DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18337963 | Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Copper Redistribution Layer Scheme | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18177979 | PATTERN FORMING METHOD, TEMPLATE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Final Rejection | Kioxia Corporation |
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