Tech Center 2800 • Art Units: 2822 2898
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18405372 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515797 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18384687 | DISPLAY APPARATUS WITH IMPROVED ADHESION CHARACTERISTICS IN NON-ACTIVE AREA | Non-Final OA | LG DISPLAY CO., LTD. |
| 18656780 | MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18050030 | INTEGRATED CIRCUIT, MANUFACTURING METHOD, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18532617 | LOWERING GATE ASPECT RATIO ON STI REGION | Non-Final OA | International Business Machines Corporation |
| 18733512 | SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18524533 | METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18356388 | WAFER THINNING METHOD HAVING FEEDBACK CONTROL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18348868 | SELECTIVE SIN CAPPING ON METAL GATE FOR METAL OXIDATION PREVENTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18337963 | Embedding Metal-Insulator-Metal Structure In Silicon Oxide In A Copper Redistribution Layer Scheme | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | Non-Final OA | Intel Corporation |
| 17743948 | INLINE CIRCUIT EDIT | Final Rejection | Intel Corporation |
| 18177979 | PATTERN FORMING METHOD, TEMPLATE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18404516 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18348211 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18232718 | Contact Structure For Semiconductor Device | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18523734 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Renesas Electronics Corporation |
| 18504526 | HYBRID BONDING WITH SELECTIVELY FORMED DIELECTRIC MATERIAL | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
| 18504895 | ASSEMBLY OF INTEGRATED CIRCUIT WAFERS | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18364487 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17680377 | STRUCTURE FOR ALIGNMENT MEASUREMENT MARK AND METHOD FOR ALIGNMENT MEASUREMENT | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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