DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 10/14/2025 has been entered.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-3, 5-8, 10, and 12 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Chaji et al. (US 2016/0218143 A1).
Regarding claim 1, Chaji discloses a method to transfer multiple micro thin film devices, the method comprising:
forming micro thin film devices (1503 and 1504 in Fig. 21) on a cartridge substrate (1501);
forming a housing (2101) for each micro thin film device,
holding the micro thin film devices with an anchor (2102 in Fig. 22);
a side wall of the housing is covered with a first release layer (1502 in Fig. 22); and
transferring the micro thin film devices to a system backplane (1506 in Fig. 25).
Regarding claim 2, Chaji discloses the method of claim 1, as discussed above. Chaji further discloses wherein the micro thin film devices are bonded to a system substrate (1506 in Fig. 25) and separated from the cartridge substrate through a second release layer (1507)
Regarding claim 3, Chaji discloses the method of claim 2, as discussed above. Chaji further discloses wherein the second release layer is mechanical and the bonding is electrical (the second release structure is a mechanical feature and it provides an electrical connection (i.e., bond) between the components).
Regarding claim 5, Chaji discloses the method of claim 1, as discussed above. Chaji further discloses wherein post processing is performed after the transfer (¶ 0126).
Regarding claim 6, Chaji discloses the method of claim 5, as discussed above. Chaji further discloses wherein the post processing is planarization using a planarization layer (“black matrix” in ¶ 0126 which is a planarization layer (¶ 0149).
Regarding claim 7, Chaji discloses the method of claim 6, as discussed above. Chaji further discloses wherein the planarization layer is a polymer (¶ 0149).
Regarding claim 8, Chaji discloses the method of claim 7, as discussed above. Chaji further discloses wherein the planarization layer is black matrix (¶ 0149).
Regarding claim 10, Chaji discloses the method of claim 1, as discussed above. Chaji further discloses wherein there are more than one bank structures (structures of 2701 on either side of the micro thin film devices in Fig. 31) formed on a first electrode (3001) and inside each bank structure a different micro thin film device is formed (see Fig. 31).
Regarding claim 12, Chaji discloses the method of claim 10, as discussed above. Chaji further discloses wherein the first electrode and a second electrode are patterned to provide individual control for each micro thin [film] device.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHRISTOPHER A CULBERT whose telephone number is (571)272-4893. The examiner can normally be reached M-F 9-5.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Benitez can be reached at (571) 270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/CHRISTOPHER A CULBERT/ Examiner, Art Unit 2815
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