CTNF 18/544,997 CTNF 74721 DETAILED ACTION Notice of Pre-AIA or AIA Status 07-03-aia AIA 15-10-aia The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA. Election/Restrictions Applicant’s response in the reply filed on 4/10/26 is acknowledged. The Examiner found that claims 1-11 were able to be examined together without a burdensome search and hereby withdraws the election of species requirement with respect to only Species 1 and 2 (claims 1-11). Applicant’s arguments with traverse only addressed Species 1 and 2 and claims 1-11. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement pertaining to claims 12-20, and the traversal is considered moot since claims 1-11 are examined below, the election has been treated as an election without traverse (MPEP § 818.01(a)). Claim Rejections - 35 USC § 102 07-07-aia AIA 07-07 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – 07-08-aia AIA (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. 07-15-aia AIA Claim(s) 1-3, 5-7, 8, 11 is/are rejected under 35 U.S.C. 102 a1 as being anticipated by Chang et al (2006/0279000) . 1. An electronic device, comprising: a semiconductor die [0002] having a semiconductor surface layer (Fig.4A (41) and [0029]); a metallization structure (Fig.4A (42) and [0029]) on a side of the semiconductor surface layer (Fig.4A (41) and [0029]) and including a conductive feature (Fig.3A (421) and [0029]); a conductive terminal (Fig.4E (46/44) and [0031/0035- applicant’s own spec says the seed layer is part of the conductive terminal]) having a metal post (Fig.4E (46) and [0035]), the conductive terminal (Fig.4E (46/44) and [0031/0035]) having a first side contacting a side of the conductive feature (Fig.3A (421) and [0029]); and a solder cap (Fig.4H-4I (47/47’) on a second side of the conductive terminal (Fig.4E (46/44) and [0031/0035]). 2. The electronic device of claim 1, wherein the metal post includes copper [0033]. 3. The electronic device of claim 2, wherein the solder cap includes copper, tin and silver [0035]. 5. The electronic device of claim 2, wherein the conductive terminal (Fig.4E (44) and [0031]) includes a copper layer [0031] that extends between the metal post (Fig.4E (46) and [0035]) and the conductive feature (Fig.3A (421) and [0029]) of the metallization structure (Fig.4A (42) and [0029]). 6. The electronic device of claim 1, wherein the solder cap includes copper, tin and silver [0035]. 8. The electronic device of claim 1, wherein the conductive terminal (Fig.4E (44) and [0031]) includes a copper layer [0031] that extends between the metal post (Fig.4E (46) and [0035]) and the conductive feature (Fig.3A (421) and [0029]) of the metallization structure (Fig.4A (42) and [0029]). 11. The electronic device of claim 1, wherein the second side of the conductive terminal is soldered to a lead frame or substrate [0002] . Claim Rejections - 35 USC § 102 07-07-aia AIA 07-07 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – 07-08-aia AIA (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. 07-15-aia AIA Claim(s) 1, 2, 4, 7, 9-11 is/are rejected under 35 U.S.C. 102 a1 as being anticipated by Chang et al (2022/0375826) . 1. An electronic device, comprising: a semiconductor die (Fig.7 (150) and [0042]) having a semiconductor surface layer (Fig.7 (152) and [0042]); a metallization structure (Fig.7 (160) and [0045]) on a side of the semiconductor surface layer (Fig.7 (152) and [0042]) and including a conductive feature (Fig.7 (162) and [0045]); a conductive terminal (Fig.7 (166) and [0045-0047]) having a metal post (Fig.7 (166) and [0045]), the conductive terminal (Fig.7 (166) and [0045-0047]) having a first side contacting a side of the conductive feature (Fig.7 (162) and [0045]); and a solder cap (Fig.7 (170) and [0046]) on a second side of the conductive terminal (Fig.7 (166) and [0045-0047]). 2. The electronic device of claim 1, wherein the metal post (Fig.7 (166) and [0045]) includes copper [0045]. 4. The electronic device of claim 2, wherein the conductive feature (Fig.1 (131) and [0023]) of the metallization structure (Fig.7 (160) and [0045]) includes aluminum [0023/0021]. 7. The electronic device of claim 1, wherein the conductive feature (Fig.7 (162) and [0045]) of the metallization structure (Fig.7 (160) and [0044]) includes aluminum [0045]. 9. The electronic device of claim 1, wherein the semiconductor surface layer includes gallium nitride [0042]. 10. The electronic device of claim 1, further comprising a polyimide layer (Fig.7 (168) and [0048]) on a portion of the conductive feature (Fig.7 (162) and [0045]) of the metallization structure (Fig.7 (160) and [0045]), the polyimide layer (Fig.7 (168) and [0048]) contacting a portion of the metal post (Fig.7 (166) and [0045]). 11. The electronic device of claim 1, wherein the second side of the conductive terminal is soldered to a lead frame or substrate (Fig.16) . Conclusion 07-96 AIA The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Hsu (US 8101866), Hayashi et al (US 6192579) and Austria et al US 20260083026; US 20260068728) teach similar capped solder bumps . Any inquiry concerning this communication or earlier communications from the examiner should be directed to LAURA M MENZ whose telephone number is (571)272-1697. The examiner can normally be reached Monday-Friday 7:00-3:30. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven Gauthier can be reached at 571-270-0373. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /LAURA M MENZ/Primary Examiner, Art Unit 2813 5/28/26 Application/Control Number: 18/544,997 Page 2 Art Unit: 2813 Application/Control Number: 18/544,997 Page 3 Art Unit: 2813 Application/Control Number: 18/544,997 Page 4 Art Unit: 2813 Application/Control Number: 18/544,997 Page 5 Art Unit: 2813 Application/Control Number: 18/544,997 Page 6 Art Unit: 2813
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