DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Amendment
Applicant's arguments with respect to claims 1 – 7 have been considered but are moot in view of the new ground(s) of rejection.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 – 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Nakao et al. (WO 2012/176246).
Regarding claim 1, in Figure 6, Nakao discloses a manufacturing method of a circuit board including an annular land portion (2nd land 14) around a through hole (2nd through-hole 12) through which a terminal (2nd lead portion 20) that is an object of a soldering penetrates, and that is soldered on the land portion by a soldering process with a solder supply (40), the manufacturing method comprising: previously forming a preliminary solder (42, 44; solder 42 and solder fillet 44 formed in and on the 1st through-hole 12 are formed before the solder 42 and solder fillet 44 are formed in and on the 2nd through-hole 12) at a position (solder fillet 44 of the 1st through-hole is formed on the left side of the 2nd through-hole 12) opposite to a supply position of the solder (supply unit 40 is on the right side of the 2nd through-hole 12; Figure 6) in the land portion, the position and the supply position being on opposite sides of the through hole before the soldering process (Figure 6).
Regarding claim 2, Nakao discloses wherein the land portion is formed into an ellipse shape; and the preliminary solder is formed in a region which is on the side opposite to the supply position of the solder with respect to the through hole, and which includes a first end portion in a major axis direction of the ellipse shape (Figure 6).
Regarding claim 3, Nakao discloses wherein the preliminary solder is formed in a second region including a second end portion in the major axis direction of the ellipse shape (Figure 6).
Regarding claim 4, Nakao discloses wherein the preliminary solder is formed to include a portion farthest from the supply position of the solder in the land portion (Figure 6).
Regarding claim 5, Nakao discloses wherein the circuit board includes a plurality of annular land portions of a first land portion having a relatively large area, and a second land portion having a relatively small area; in the first land portion, the preliminary solder is previously formed at the position opposite to the supply position of the solder with respect to the through hole; and in the second land portion, the preliminary solder is previously formed at a position on a supply position side of the solder with respect to the through hole (Figure 6).
Regarding claim 6, Nakao discloses wherein the soldering process is a laser soldering (Figure 6).
Regarding claim 7, Nakao discloses wherein the solder is printed and formed on a portion which is an object of a reflow soldering, and a forming region of the preliminary solder in the circuit board; an electronic component is mounted on the portion which is the object of the reflow soldering; and the soldering process is performed to the terminal disposed in the through hole (Figure 6).
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST.
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TREMESHA W. BURNS
Primary Examiner
Art Unit 2847
/TREMESHA W BURNS/Primary Examiner, Art Unit 2847
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