Prosecution Insights
Last updated: April 19, 2026
Application No. 18/559,745

ADHESIVE SHEET FOR REAR SURFACE GRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND BASE MATERIAL SHEET

Non-Final OA §102§103
Filed
Nov 08, 2023
Examiner
HO, ANTHONY
Art Unit
2817
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Denka Company Limited
OA Round
1 (Non-Final)
91%
Grant Probability
Favorable
1-2
OA Rounds
2y 5m
To Grant
93%
With Interview

Examiner Intelligence

Grants 91% — above average
91%
Career Allow Rate
1007 granted / 1110 resolved
+22.7% vs TC avg
Minimal +2% lift
Without
With
+2.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
38 currently pending
Career history
1148
Total Applications
across all art units

Statute-Specific Performance

§101
2.3%
-37.7% vs TC avg
§103
31.8%
-8.2% vs TC avg
§102
40.5%
+0.5% vs TC avg
§112
16.1%
-23.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1110 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Information Disclosure Statement The information disclosure statement (IDS) submitted on November 8, 2023 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. The information disclosure statement (IDS) submitted on October 2, 2024 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. The information disclosure statement (IDS) submitted on August 13, 2025 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1, 4, and 7 is/are rejected under 35 U.S.C. 102(a)(1) as anticipated by or, in the alternative, under 35 U.S.C. 103 as obvious over Okuchi et al (JP 2013-211439). In re claim 1, Okuchi et al discloses an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer (i.e. 1a and 1b); and an adhesive layer (i.e. 2) provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer (i.e. see at least Figures 1 and 2); the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer so that the convex part of the semiconductor wafer is placed in the opening part (i.e. see at least Figure 4); the adhesive layer (i.e. 2) is configured so that the convex part is protected by the base material layer with the semiconductor wafer (i.e. 4) adhered to the adhesive layer; the base material layer comprises a cushion layer (i.e. 1a) and a surface treatment layer (i.e. 1b) provided thereon; the adhesive layer (i.e. 2) is provided on the surface treatment layer; the surface treatment layer is formed of an acrylic resin composition containing an acrylic resin (i.e. see at least paragraphs 0017-0030); the acrylic resin is cross-linked by light irradiation or heating (i.e. see at least paragraphs 0038-0041); and the adhesive layer is formed of an acrylic resin composition containing an acrylic resin (i.e. see at least paragraphs 0017-0030). Furthermore, the claimed invention is a product-by-process claim and even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. The patentability of a product does not depend on its method of production. If the product in the product-by-process claim is the same as or obvious from a product of the prior art, the claim is unpatentable even though the prior product was made by a different process." In re Thorpe, 777F.2d 695, 698, 227 USPQ 964, 966 (Fed. Cir. 1985). In re claim 7, Okuchi et al discloses a base material sheet, comprising: a cushion layer (i.e. 1a); and a surface treatment layer (i.e. 1b) provided thereon, wherein: the surface treatment layer is formed of an acrylic resin composition containing an acrylic resin (i.e. see at least paragraphs 0017-0030); and the acrylic resin is cross-linked by light irradiation or heating (i.e. see at least paragraphs 0038-0041). Furthermore, the claimed invention is a product-by-process claim and even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. The patentability of a product does not depend on its method of production. If the product in the product-by-process claim is the same as or obvious from a product of the prior art, the claim is unpatentable even though the prior product was made by a different process." In re Thorpe, 777F.2d 695, 698, 227 USPQ 964, 966 (Fed. Cir. 1985). In re claim 4, the claimed invention is a product-by-process claim and even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. The patentability of a product does not depend on its method of production. If the product in the product-by-process claim is the same as or obvious from a product of the prior art, the claim is unpatentable even though the prior product was made by a different process." In re Thorpe, 777F.2d 695, 698, 227 USPQ 964, 966 (Fed. Cir. 1985). Allowable Subject Matter Claims 2, 3, 5, 6, and 8 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANTHONY HO whose telephone number is (571)270-1432. The examiner can normally be reached 9AM - 5PM, Monday-Friday. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Marlon Fletcher can be reached at 571-272-2063. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ANTHONY HO/Primary Examiner, Art Unit 2817
Read full office action

Prosecution Timeline

Nov 08, 2023
Application Filed
Jan 24, 2026
Non-Final Rejection — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12604478
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
2y 5m to grant Granted Apr 14, 2026
Patent 12593662
ELECTRONIC DEVICE FOR DETECTING DEFECT IN SEMICONDUCTOR PACKAGE AND OPERATING METHOD THEREOF
2y 5m to grant Granted Mar 31, 2026
Patent 12575309
PRODUCTION METHOD FOR PATTERNED ORGANIC FILM, PRODUCTION APPARATUS FOR PATTERNED ORGANIC FILM, ORGANIC SEMICONDUCTOR DEVICE PRODUCED BY SAME, AND INTEGRATED CIRCUIT INCLUDING ORGANIC SEMICONDUCTOR DEVICE
2y 5m to grant Granted Mar 10, 2026
Patent 12575267
DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS
2y 5m to grant Granted Mar 10, 2026
Patent 12568758
LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME
2y 5m to grant Granted Mar 03, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
91%
Grant Probability
93%
With Interview (+2.3%)
2y 5m
Median Time to Grant
Low
PTA Risk
Based on 1110 resolved cases by this examiner. Grant probability derived from career allow rate.

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