Tech Center 2800 • Art Units: 2800 2815 2817
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18398912 | SEMICONDUCTOR DEVICE INCLUDING OXIDE SEMICONDUCTOR LAYER AND ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18293783 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18622823 | POWER SEMICONDUCTOR DEVICE, METHOD FOR PREPARING POWER SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18599374 | FIELD EFFECT TRANSISTOR, PREPARATION METHOD THEREOF, AND ELECTRONIC CIRCUIT | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18183505 | MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE | Non-Final OA | Intel Corporation |
| 18697985 | Semiconductor Device and Manufacturing Method Therefor | Non-Final OA | NTT, Inc. |
| 18527890 | METHOD OF MANUFACTURING A SILICON BIPOLAR JUNCTION TRANSISTOR, AND A BJT | Non-Final OA | NXP B.V. |
| 18401287 | INTEGRATED CIRCUIT DEVICE WITH ZENER DIODE WITH REDUCED LEAKAGE AND/OR INCREASED BREAKDOWN VOLTAGE | Non-Final OA | Texas Instruments Incorporated |
| 18433487 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18538036 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18490919 | SEMICONDUCTOR DEVICES WITH GATE EXTENSIONS AND METHODS OF FABRICATING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18521864 | NANOMOLDING OF ELECTRICAL INTERCONNECTS | Non-Final OA | Cornell University |
| 18430542 | POWER SEMICONDUCTOR DEVICES INCLUDING INTEGRATED POLYSILICON DEVICES | Non-Final OA | Wolfspeed, Inc. |
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