Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2815 2817
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18373048 | DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EMITTING DIODE AND SUBSTRATE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18523240 | DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18558198 | SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18278073 | INORGANIC/ORGANIC HYBRID COMPLEMENTARY SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | DAICEL CORPORATION |
| 18483994 | ANNEAL CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 18390765 | LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18091209 | TRANSFER-FREE 2D FET AND FEFET DEVICE FABRICATION BY 2D MATERIAL GROWTH IN SUPERLATTICE WITH NITRIDES | Non-Final OA | Intel Corporation |
| 18088541 | INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH | Non-Final OA | Intel Corporation |
| 18557252 | VERTICAL TRANSISTORS AND METHOD FOR PRODUCING THE SAME | Non-Final OA | Robert Bosch GmbH |
| 18515152 | SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18490919 | SEMICONDUCTOR DEVICES WITH GATE EXTENSIONS AND METHODS OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18518399 | FABRICATING FILLING STRUCTURES IN THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18527890 | METHOD OF MANUFACTURING A SILICON BIPOLAR JUNCTION TRANSISTOR, AND A BJT | Non-Final OA | NXP B.V. |
| 18558196 | MANUFACTURING METHOD OF DISPLAY PANEL AND SPLICED DISPLAY PANEL | Non-Final OA | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18557250 | APPARATUSES FOR MEASURING GAP BETWEEN A SUBSTRATE SUPPORT PLANE AND GAS DISTRIBUTION DEVICE | Non-Final OA | Lam Research Corporation |
| 18516192 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18570270 | UNIDIRECTIONAL TRANSIENT VOLTAGE SUPPRESSION DIODE AND MANUFACTURING PROCESS | Non-Final OA | WILL SEMICONDUCTOR (SHANGHAI) CO. LTD. |
| 18311907 | THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18490524 | ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18569679 | SEMICONDUCTOR MODULE | Non-Final OA | Hitachi Power Semiconductor Device, Ltd. |
| 18570055 | PLANAR INP-BASED SINGLE PHOTON AVALANCHE DIODE AND USE THEREOF | Non-Final OA | CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD. |
| 18527697 | METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL INTERFACE MATERIAL FORMED THEREFROM, AND AN INTEGRATED CIRCUIT FORMED THEREFROM | Non-Final OA | Arieca Inc. |
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