Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2815 2817
This examiner grants 91% of resolved cases
Anthony Ho serves in Tech Center 2800 and Art Unit 2800, where he has overseen 1163 resolved cases. His allowance rate is 90.9%, which is very high and suggests a favorable environment for applicants. The median days to allowance is 842, indicating a relatively fast and efficient path to grant. These figures, derived from a large sample of 1163 resolved cases, reflect a consistent and applicant friendly approach to examination.
The interview lift pct of 2.6% is quite low, which is common when the baseline allowance rate is as high as 90.9%. This suggests that interviews are rarely necessary to secure an allowance, as most cases are resolved successfully through written communication. Given the 842 median days to allowance, practitioners can expect a streamlined process. The robust data from 1163 resolved cases makes these metrics a highly reliable resource for planning prosecution in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18644210 | WAFER BONDING METHOD INCLUDING REMOVING TRANSPARENT OR TRANSLUCENT MATERIAL | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18293783 | DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18653246 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18622823 | POWER SEMICONDUCTOR DEVICE, METHOD FOR PREPARING POWER SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18183505 | MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE | Non-Final OA | Intel Corporation |
| 18789635 | CONTACT STRUCTURES IN THREE-DIMENSIONAL SEMICONDUCTIVE DEVICES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18697985 | Semiconductor Device and Manufacturing Method Therefor | Non-Final OA | NTT, Inc. |
| 18418419 | SEMICONDUCTOR PACKAGE STRUCTURE, METHOD OF FORMING THE SAME AND SEMICONDUCTOR PACKAGE ASSEMBLY HAVING THE SAME | Non-Final OA | MEDIATEK INC. |
| 18647473 | HETEROGENEOUS HYBRID BONDING | Non-Final OA | International Business Machines Corporation |
| 18591892 | HIGH VOLTAGE SEMICONDUCTOR DEVICE WITH DATA TRANSMISSION FROM A HIGH VOLTAGE DOMAIN TO A LOW VOLTAGE DOMAIN | Non-Final OA | Infineon Technologies Austria AG |
| 18401287 | INTEGRATED CIRCUIT DEVICE WITH ZENER DIODE WITH REDUCED LEAKAGE AND/OR INCREASED BREAKDOWN VOLTAGE | Non-Final OA | Texas Instruments Incorporated |
| 18667981 | METHODS OF FORMING PHOTONIC DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18558196 | MANUFACTURING METHOD OF DISPLAY PANEL AND SPLICED DISPLAY PANEL | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18430542 | POWER SEMICONDUCTOR DEVICES INCLUDING INTEGRATED POLYSILICON DEVICES | Non-Final OA | Wolfspeed, Inc. |
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