DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-6 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Mikami et al (US 2023/0041195 A1).
As to claim 1, Mikami discloses An additive for a composite plating solution, comprising non-conductive fine particles (Example 1 [0059] cationic colloidal silica), nickel ions ([0058] nickel chloride), and water ([0058] “dissolved in water”).
As to claim 2, the recitation is drawn towards the “for…” phrase of the preamble if instant claim 1 interpreted under MPEP 2111.02 III thus not further limiting the composition as claimed due to the open claim language of “comprising”.
As to claim 3, Mikami further discloses wherein the non-conductive fine particles are silica which is silicon dioxide ([0059]).
As to claim 4, Mikami further discloses nickel chloride hydrate ([0058]).
As to claim 5, Mikami further discloses explicitly a surface imparting agent ([0059] Al3+) and a surfactant ([0044]-[0045], [0058] “4 g/L of [(3-sulfopropoxy)-polyethoxy-polyisopropoxy]-beta-naphtylether]potassium salt (the total number of moles of EO and PO added was 17 mol, the same applies hereinafter)”).
As to claim 6, Mikami further discloses A method for preventing solidification of a precipitate of non-conductive fine particles in an additive for a composite plating solution, comprising: incorporating nickel ions in an additive for a composite plating solution containing non-conductive fine particles and water. (Example 1 [0059] cationic colloidal silica), nickel ions ([0058] nickel chloride), and water ([0058] “dissolved in water”).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to LOUIS J RUFO whose telephone number is (571)270-7716. The examiner can normally be reached Monday to Friday, 9 am to 5 pm.
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/LOUIS J RUFO/Primary Examiner, Art Unit 1795
