Prosecution Insights
Last updated: July 17, 2026
Application No. 18/582,100

POSITION DETECTION SYSTEM AND OPERATING METHOD THEREOF

Non-Final OA §102
Filed
Feb 20, 2024
Priority
Feb 01, 2024 — CN 202420258970.0
Examiner
LEE, DOUGLAS
Art Unit
1714
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Tsmc China Company Limited
OA Round
1 (Non-Final)
45%
Grant Probability
Moderate
1-2
OA Rounds
1y 1m
Est. Remaining
59%
With Interview

Examiner Intelligence

Grants 45% of resolved cases
45%
Career Allowance Rate
300 granted / 668 resolved
-20.1% vs TC avg
Moderate +14% lift
Without
With
+13.7%
Interview Lift
resolved cases with interview
Typical timeline
3y 6m
Avg Prosecution
35 currently pending
Career history
699
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
93.8%
+53.8% vs TC avg
§102
0.7%
-39.3% vs TC avg
§112
1.9%
-38.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 668 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group II, Species A in the reply filed on December 1, 2025 and April 28, 2026 is acknowledged. Claims 11-15, 21-29 and 36-41 are pending, claims 1-10, 16-20 and 30-35 having been cancelled and claims 36-41 having been newly added. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 11, 12, 21, 27-29, 36 and 41 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by KR2003-0092258A to Kim et al. (see machine translation). As to claim 11, Kim discloses a method comprising: moving a lateral arm, with a nozzle, in a developing chamber from a first position to a second position around a wafer chuck in the developing chamber (see Kim paragraphs [11]-[13], [17]), wherein from a top view, the nozzle does not overlap the wafer chuck in the first position (see Kim Fig. 2, ref.#20, paragraph [22] where the nozzle does not overlap the wafer chuck in the groove or home position) and the nozzle overlaps the wafer chuck in the second position (see Kim Fig. 2, ref.#22, paragraph [22] where the nozzle overlaps the wafer chuck in the center position); detecting the lateral arm from the first position and the second position through a position detection system (see Kim Fig. 3, paragraphs [24], [27]); determining whether the lateral arm has a position shift at the first position of the second position through the position detection system (see Kim paragraphs [27]-[28]); and issuing a warning when the lateral arm has the position shift (see Kim paragraphs [17], [27], [28]). As to claim 12, Kim discloses that the step of moving the lateral arm comprises rotating the lateral arm in the developing chamber based on a vertical axis from the first position to the second position (see Kim Figs. 3 and 5 disclosing that the nozzle arm is rotated about a vertical axis from the first position to the second position). As to claim 21, Kim discloses a method comprising: placing a semiconductor substrate in a developing chamber (see Kim paragraphs [11]-[13], [17]); rotating a rinse arm, with a rinse nozzle, about a vertical axis; moving the rinse arm from a first position to a second position around a wafer chuck wherein, in a top view, the rinse nozzle does not overlap the wafer chuck at the first position and overlaps the wafer chuck at the second position (see Kim Fig. 2, ref.#20, paragraph [22] where the nozzle does not overlap the wafer chuck in the groove or home position; Fig. 2, ref.#22, paragraph [22] where the nozzle overlaps the wafer chuck in the center position; paragraphs [22], [27] disclosing the movement of the nozzle); detecting, by a position detection system, respective positions of the rinse arm at the first and the second position (see Kim Fig. 3, paragraphs [24], [27]); determining, based on a predetermined acceptance threshold, comprising at least one of a signal-range threshold and a time-duration threshold, whether a position shift is present; and when the predetermined acceptance threshold is satisfied, performing a rinse process on the semiconductor substrate, and when the predetermined acceptance threshold is not satisfied, issuing a warning and inhibiting the rinse process (see Kim paragraphs [17], [27], [28] disclosing use of a predetermined acceptance threshold with a time-duration to determine whether a position shift is present and issuing a waring and inhibiting the rinse process if the predetermined acceptance threshold is not satisfied). As to claim 27, Kim discloses that the detecting the positions of the rinse arm is performed in real time (see Kim paragraphs [17], [27], [28]). As to claims 28 and 29, since Kim discloses that the time it takes for the nozzle arm to move between a set rotational distance between the two points is detected and the predetermined acceptance threshold comprises a predetermined time between the two set points and the predetermined acceptance threshold is not satisfied when the detected time between the two set points falls outside the predetermined range (see Kim paragraphs [17], [27], [28]), Kim is understood as also disclosing the detection of the rotational speed and predetermined speed range since Kim is detecting how fast the nozzle is moving between two set points. As to claim 36, Kim discloses a method comprising: placing a substrate in a developing chamber (see Kim paragraphs [11]-[13], [17]); rotating a rinse arm, with a rinse nozzle, about a vertical axis; moving the rinse arm from a first position to a second position around a wafer chuck wherein, in a top view, the rinse nozzle does not overlap the wafer chuck at the first position and overlaps the wafer chuck at the second position (see Kim Fig. 2, ref.#20, paragraph [22] where the nozzle does not overlap the wafer chuck in the groove or home position; Fig. 2, ref.#22, paragraph [22] where the nozzle overlaps the wafer chuck in the center position; paragraphs [22], [27] disclosing the movement of the nozzle); detecting, by a position detection system, respective positions of the rinse arm at the first and the second position based on whether a light path of a through-beam sensor is interrupted by a light-blocking element coupled to the rinse arm (see Kim Figs. 2 and 3, paragraphs [24], [27] where Kim discloses that the position detectors can be photocouplers and that the protrusions 30 and 32, which are coupled to the rinse arm, are inserted into the photocouplers 20 and 22, respectively, in order to block the through-beam and detect the position of the rinse arm); comparing a detection result of the position detection system with a predetermined acceptance threshold comprising at least one of a signal-state threshold and a time-duration threshold, and enabling a rinse process when the detection result satisfies the predetermined acceptance threshold and issuing an alarm and halting operations of the developing chamber when the detection result does not satisfy the predetermined acceptance threshold (see Kim paragraphs [17], [27], [28] disclosing use of a predetermined acceptance threshold with a time-duration to determine whether a position shift is present and issuing a waring and inhibiting the rinse process if the predetermined acceptance threshold is not satisfied). As to claim 41, Kim discloses that the detecting the positions of the rinse arm is performed in real time (see Kim paragraphs [17], [27], [28]). Relevant Prior Art The following is also considered as relevant prior art: WO2020-039762A1 to Naohara et al. discloses a similar method of detecting the positional shift of a nozzle using a camera (see Naohara machine translation paragraphs [0095]-[0096], [0110]). KR2022-0044659A to Matsuura et al. discloses a similar method of detecting the positional shift of a nozzle using a camera to compare images (see Matsuura paragraphs [0047]-[0054]). Allowable Subject Matter Claims 13-15, 22-26 and 37-40 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The closest prior art is KR2003-0092258A to Kim et al. The cited prior art does not disclose a jig positioned below the lateral arm, the jig having a rounding trench therein, a first light transmitter installed on a first sidewall of the rounding trench and around the first position; a first light receiver installed on a second sidewall of the rounding trench opposite to the first sidewall and around the first position, wherein the first light receiver is corresponding to the first light transmitter, and a light-blocking element mounted on the lateral arm, the light-blocking element downwardly extending from the lateral arm toward the rounding trench. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to DOUGLAS LEE whose telephone number is (571)270-3296. The examiner can normally be reached M-F 7:30-4:30pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Kaj Olsen can be reached at 571-272-1344. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DOUGLAS LEE/Primary Examiner, Art Unit 1714
Read full office action

Prosecution Timeline

Feb 20, 2024
Application Filed
Jul 09, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685061
APPARATUS AND METHOD FOR REMOVAL OF OXIDE AND CARBON FROM SEMICONDUCTOR FILMS IN A SINGLE PROCESSING CHAMBER
3y 11m to grant Granted Jul 14, 2026
Patent 12667633
AQUEOUS OZONE FLOOR DISINFECTION SYSTEM
2y 2m to grant Granted Jun 30, 2026
Patent 12660909
MULTIPURPOSE CLEANING TOOL
2y 5m to grant Granted Jun 23, 2026
Patent 12653367
CLEANING BASE AND CLEANING SYSTEM
2y 5m to grant Granted Jun 16, 2026
Patent 12637775
HYBRID DESCALING SYSTEM WITH ACID INJECTION
2y 2m to grant Granted May 26, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
45%
Grant Probability
59%
With Interview (+13.7%)
3y 6m (~1y 1m remaining)
Median Time to Grant
Low
PTA Risk
Based on 668 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month