Prosecution Insights
Last updated: October 02, 2026
Application No. 18/589,156

SEMICONDUCTOR DEVICE

Final Rejection §102
Filed
Feb 27, 2024
Priority
Apr 18, 2023 — JP 2023-067564
Examiner
CAMPBELL, SHAUN M
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Fuji Electric Co., Ltd.
OA Round
2 (Final)
73%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
81%
With Interview

Examiner Intelligence

Grants 73% — above average
73%
Career Allowance Rate
770 granted / 1058 resolved
+4.8% vs TC avg
Moderate +9% lift
Without
With
+8.6%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
31 currently pending
Career history
1089
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
56.5%
+16.5% vs TC avg
§102
25.2%
-14.8% vs TC avg
§112
12.9%
-27.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1058 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . DETAILED ACTION Amendment, received 7/7/2026, has been entered. Claims 1-7 are presented for examination. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-7 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Onodera et al. (US Pub. No. 2022/0320049 A1), hereafter referred to as Onodera. As to claim 1, Onodera discloses a semiconductor device (figs 1-7 and fig 20, 1A), comprising: a substrate (fig 9, 10) including a semiconductor element (40) provided on a mounting face of the substrate (surface of 10), the substrate having one side and another side that are opposite to each other in a first direction (X-direction) parallel to the mounting face (fig 7, left side and right side of substrate 10); and a first main terminal (51A) and a second main terminal (51B) that are located at the one side of the substrate (right side of 10), the first main terminal and the second main terminal facing each other in a second direction (Y-direction) parallel to the mounting face and orthogonal to the first direction (fig 7, 51A and 51B face each other in the second direction), wherein the first main terminal (51A) includes a first external connection portion (51a) connected to an external conductor (84A), and a first narrow portion (51b) connecting the first external connection portion (51a) to the substrate (10) in the second direction, the first narrow portion having a width smaller than a width of the first external connection portion (width of 51b is narrower than 51a), the second main terminal (51B) includes a second external connection portion (51a) connected to an external conductor (84B), and a second narrow portion (51b) connecting the second external connection portion (51a) to the substrate (10) in the second direction, the second narrow portion having a width smaller than a width of the second external connection portion (width of 51b is narrower than 51a), in the second direction, a center of the first narrow portion is located closer to the second main terminal than is a center of the first external connection portion (see annotated figure 7 below), in the second direction, a center of the second narrow portion is located closer to the first main terminal than is a center of the second external connection portion (see annotated fig 7 below), and an entirety of the first narrow portion is located, in the second direction (y-direction), between two opposite ends of the first external connection portion (see annotated fig 7 below), and an entirety of the second narrow portion is located, in the second direction (y-direction), between two opposite ends of the second external connection portion (see annotated fig 7 below). PNG media_image1.png 753 1482 media_image1.png Greyscale PNG media_image2.png 501 960 media_image2.png Greyscale As to claim 2, Onodera discloses the semiconductor device according to claim 1 (paragraphs above), wherein the first narrow portion (51b) of the first main terminal (51A) is connected to one side of the first main terminal in the second direction at an end thereof that is closer to the second main terminal than is a center thereof (51b of 51A shown closer to 51B then center line shown in annotated figure 7 above), and the second narrow portion (51b) of the second main terminal (51B is connected to one side of the second main terminal in the second direction at an end thereof that is closer to the first main terminal than is a center thereof (51b of 51B shown closer to 51A then center line shown in annotated figure 7 above). As to claim 3, Onodera discloses the semiconductor device according to claim 2 (paragraphs above), wherein a surface of the first main terminal parallel to the first direction and a surface of the second main terminal parallel to the first direction, which face each other, are each flat (surfaces of 51A and 51B facing each other are shown as flat). As to claim 4, Onodera discloses the semiconductor device according to claim 1 (paragraphs above), wherein the first main terminal and the second main terminal have a line-symmetric shape with respect to a line in the first direction (fig 7, 51A and 51B; [0071]). As to claim 5, Onodera discloses the semiconductor device according to claim 1 (paragraphs above), wherein the width of the first narrow portion in the second direction is equal to or less than half of the width of the first external connection portion in the second direction (fig 7, width of 51b is less than half of the width of 51a for 51A), and the width of the second narrow portion in the second direction is equal to or less than half of the width of the second external connection portion in the second direction (fig 7, width of 51b is less than half of the width of 51a for 51B). As to claim 6, Onodera discloses the semiconductor device according to claim 5 (paragraphs above), wherein the entirety of the first narrow portion is located closer to the second main terminal than is the center of the first external connection portion in the second direction (51b closer to 51B than center line of 51a of 51A shown in annotated figure 7 above), and the entirety of the second narrow portion is located closer to the first main terminal than is the center of the second external connection portion in the second direction (51b closer to 51A than center line of 51a of 51B shown in annotated figure 7 above). As to claim 7, Onodera discloses the semiconductor device according to claim 1 (paragraphs above), a third main terminal (52A) located on the other side of the substrate (10) opposite in the first direction to the one side of the substrate where the first main terminal (51A) and the second main terminal (51B) are disposed, wherein the third main terminal (52A) includes a third external connection portion (52a) connected to an external conductor (85A) and a third narrow portion (52b) connected to the third external connection portion (52a) and to the substrate (10), the third narrow portion (52b) having a width in the second direction smaller than a width of the third external connection portion (52a), and a position of the third narrow portion (52b) in the second direction overlaps in the first direction a position of a gap between the first main terminal (51A) and the second main terminal (51B) in the second direction (see annotated figure 7 below). PNG media_image3.png 563 1277 media_image3.png Greyscale Response to Arguments Applicant's arguments filed 7/7/2026 have been fully considered but they are not persuasive. Applicant argued that Onodera does not disclose the amended claim limitation. Specifically, that the end portion of connection portion 51b protrudes beyond the corresponding end of exposed portion 51a in the Y-direction. Examiner agrees that the entirety of the narrow portion 51b pointed to in the last office action is not between the two opposite ends of the external connection portion. However, as newly presented in this office action, the entirety of the narrow portion now pointed to in the annotated figure 7 and figure 20 is located between the two opposite ends of the external connection portion, while also meeting the limitations with respect to the center of the narrow portions relative to the center of the external connection portions. Pertinent Art The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US Pub. No. 2024/0421132A1; US Pub. No. 2023/0369183 A1; US Pub. No. 2021/0407875A1; and US Pub. No. 2021/0305147A1. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHAUN M CAMPBELL whose telephone number is (571)270-3830. The examiner can normally be reached on MWFS: 7:30-6pm Thurs 1-2pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Purvis, Sue can be reached at (571)272-1236. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SHAUN M CAMPBELL/Primary Examiner, Art Unit 2893 8/16/2026
Read full office action

Prosecution Timeline

Feb 27, 2024
Application Filed
Apr 09, 2026
Non-Final Rejection mailed — §102
Jul 07, 2026
Response Filed
Aug 19, 2026
Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12745492
LIGHT-EMITTING DIODE PACKAGES WITH SELECTIVELY PLACED LIGHT-ALTERING MATERIALS AND RELATED METHODS
4y 7m to grant Granted Sep 22, 2026
Patent 12740489
METHOD FOR TRANSFERRING AN OPTOELECTRONIC DEVICE
2y 5m to grant Granted Sep 15, 2026
Patent 12733376
DISPLAY DEVICE
3y 5m to grant Granted Sep 08, 2026
Patent 12733545
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
3y 6m to grant Granted Sep 08, 2026
Patent 12727237
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
4y 2m to grant Granted Sep 01, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

3-4
Expected OA Rounds
73%
Grant Probability
81%
With Interview (+8.6%)
2y 6m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 1058 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month