Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2829 2893
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18488645 | QUBIT CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18370263 | SEMICONDUCTOR DEVICE WITH LOWER CONTACT AND LOWER POWER STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO, LTD. |
| 18493569 | Display Device and Method for Manufacturing the Same | Non-Final OA | LG Display Co., Ltd. |
| 18125017 | LIGHT EMITTING DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 17958475 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18288444 | DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18116410 | MICRO LED, MICRO LED PANEL AND MICRO LED CHIP | Non-Final OA | JADE BIRD DISPLAY (SHANGHAI) LIMITED |
| 18311763 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18142831 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17808058 | PHOTOSENSITIVE RESIN COMPOSITION, DISPLAY PANEL MANUFACTURED USING SAME, AND METHOD OF MANUFACTURING DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18335332 | CHIP PACKAGE AND CHIP PACKAGE PREPARATION METHOD | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18159724 | OPTICAL FILTER ARRAY, MOBILE TERMINAL, AND DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18511210 | DISPLAY PANEL AND DISPLAY TERMINAL | Non-Final OA | HKC CORPORATION LIMITED |
| 17930497 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 17357722 | UNIVERSAL HYBRID BONDING SURFACE LAYER USING AN ADAPTABLE INTERCONNECT LAYER FOR INTERFACE DISAGGREGATION | Final Rejection | Intel Corporation |
| 18451149 | DISPLAY DEVICE | Final Rejection | Japan Display Inc. |
| 18488916 | SYNAPTIC ARRAY STRUCTURE BASED ON CMOS INTEGRATION TECHNOLOGY AND METHOD OF FABRICATING THE SYNAPTIC ARRAY STRUCTURE | Non-Final OA | Seoul National University R&DB FOUNDATION |
| 18513873 | SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL) | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18543694 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18529960 | SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES AND SEMICONDUCTOR APPARATUS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18252963 | Integrated Electronic Component | Non-Final OA | NTT, Inc. |
| 18370125 | WIDE BANDGAP TRANSISTOR LAYOUT WITH STAGGERED GATE ELECTRODE FINGERS | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18573511 | PASSIVATED CONTACT BATTERY AND PREPARATION PROCESS THEREFOR | Non-Final OA | TONGWEI SOLAR (MEISHAN) CO., LTD. |
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