Last updated: July 17, 2026

Application No. 18/589,254

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE

Non-Final OA

Filed

Feb 27, 2024

Priority

Mar 01, 2023 — JP 2023-030650

Examiner

ONUTA, TIBERIU DAN

Art Unit

4100

Tech Center

4100

Assignee

KIOXIA Corporation

OA Round

1 (Non-Final)

Interview Optional

— +24.4% interview lift. Examiner has a relatively high allowance rate (76%); +24.4% interview lift. A written response may suffice.

Based on 83 resolved cases, 2023–2026

Examiner Intelligence

ONUTA, TIBERIU DAN View full profile →

Grants 76% — above average

Career Allowance Rate

63 granted / 83 resolved

+15.9% vs TC avg

Strong +24% interview lift

Without

With

+24.4%

Interview Lift

resolved cases with interview

Typical timeline

3y 4m

Avg Prosecution

26 currently pending

Career history

120

Total Applications

across all art units

Statute-Specific Performance

§103

92.6%

+52.6% vs TC avg

§102

5.8%

-34.2% vs TC avg

§112

1.2%

-38.8% vs TC avg

Black line = Tech Center average estimate • Based on career data from 83 resolved cases

Prosecution Timeline

Feb 27, 2024

Application Filed

May 07, 2026

Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

17/630,383

Patent 12677676

COMPOSITION FOR REMOVING PHOTORESIST

4y 5m to grant Granted Jul 07, 2026

17/642,810

Patent 12677525

LIGHT EMITTING DEVICE, DISPLAY SUBSTRATE AND DISPLAY DEVICE

4y 3m to grant Granted Jul 07, 2026

18/150,510

Patent 12677690

CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS

3y 6m to grant Granted Jul 07, 2026

17/958,952

Patent 12672563

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

3y 9m to grant Granted Jun 30, 2026

17/652,877

Patent 12666924

SOLDER BUMP FORMATION USING WAFER WITH RING

4y 3m to grant Granted Jun 23, 2026

Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.

Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2

Expected OA Rounds

76%

Grant Probability

99%

With Interview (+24.4%)

3y 4m (~12m remaining)

Median Time to Grant

Low

PTA Risk

Based on 83 resolved cases by this examiner. Grant probability derived from career allowance rate.