Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2812 2814 4100
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18393092 | INTEGRATED CIRCUIT INCLUDING SWITCH CELL AREA | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18369474 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18667892 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18646853 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18758707 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18656946 | DISPLAY DEVICE COMPRISING COVER LAYER AND COVER LAYER FOR DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18440823 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18458242 | PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGNATED (PPG) SUBSTRATE(S) TO SUPPORT HIGH DENSITY BUMP AND WIRE BOND CONNECTIONS, AND RELATED HYBRID INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Final Rejection | QUALCOMM Incorporated |
| 17128618 | THREE-DIMENSIONAL NAND MEMORY DEVICE WITH SPLIT CHANNEL GATES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18304638 | PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18774077 | SINGLE-WAFER GATE OXIDE MODULE FOR MOBILITY IMPROVEMENT IN SIC MOSFETS | Non-Final OA | Applied Materials, Inc. |
| 17894756 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18365455 | SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 17899891 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| 18780420 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18668706 | HIGH-DENSITY STACKED CAPACITOR AND METHOD | Non-Final OA | GlobalFoundries U.S. Inc. |
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