Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2812 2814 4100
This examiner grants 77% of resolved cases
Tiberiu Dan Onuta serves in Art Unit 2812 of Tech Center 4100 and has overseen 93 resolved cases. He has an allowance rate of 77.4% and a median time to allowance of 1240 days. These 93 cases show a successful but slow prosecution path.
The interview lift is 23.6%, which provides a substantial boost to the 77.4% baseline. This 23.6% increase suggests that direct communication is very effective for this examiner. Practitioners should use the 23.6% lift to navigate the 1240-day pendency and secure a grant.
The 77.4% allowance rate is a strong starting point. The 23.6% lift makes the interview an essential part of the strategy. This data from 93 cases suggests that Onuta is very responsive to verbal clarification.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18659417 | SCHOTTKY-BARRIER PHOTODETECTOR WITH GERMANIUM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18393092 | INTEGRATED CIRCUIT INCLUDING SWITCH CELL AREA | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18464091 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18758707 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18440823 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18667892 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18887371 | METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURALITY OF FINS AND POWER SEMICONDUCTOR COMPONENT PRODUCED THEREFROM | Non-Final OA | Robert Bosch GmbH |
| 17958452 | ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Innolux Corporation |
| 18791432 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18900247 | HIGH-BANDWIDTH THREE-DIMENSIONAL STACKED MEMORY WITH A BASE DIE ENABLING COMPUTE LOGIC WITHOUT MEMORY POWER GRID RESTRICTIONS | Non-Final OA | QUALCOMM Incorporated |
| 18458242 | PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGNATED (PPG) SUBSTRATE(S) TO SUPPORT HIGH DENSITY BUMP AND WIRE BOND CONNECTIONS, AND RELATED HYBRID INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Final Rejection | QUALCOMM Incorporated |
| 17855568 | SINX BASED SURFACE FINISH ARCHITECTURE | Final Rejection | Intel Corporation |
| 17128618 | THREE-DIMENSIONAL NAND MEMORY DEVICE WITH SPLIT CHANNEL GATES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18282196 | LIGHT-EMITTING DEVICE AND DISPLAY DEVICE | Non-Final OA | KYOCERA Corporation |
| 17740279 | MODULAR QUANTUM CHIP DESIGN WITH OVERLAPPING CONNECTION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17894756 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 17411431 | BCD IC WITH GATE ETCH AND SELF-ALIGNED IMPLANT INTEGRATION | Final Rejection | Texas Instruments Incorporated |
| 18669914 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18737615 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18412209 | DEPOSITION APPARATUS WITH DETECTION SYSTEM AND METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18523531 | CHARGE PUMP CIRCUITS WITH BACKSIDE FLY CAPACITORS AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18304638 | PACKAGE INCLUDING BACKSIDE CONNECTOR AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18944317 | METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17899891 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| 18780420 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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