Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18369474 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18464091 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18155988 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 17411431 | BCD IC WITH GATE ETCH AND SELF-ALIGNED IMPLANT INTEGRATION | Non-Final OA | Texas Instruments Incorporated |
| 18474374 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17692371 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18000569 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18457793 | WRAP AROUND BACKSIDE CONTACT FOR S/D WITH BACKSIDE TRENCH EPI AND BSPDN | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17958452 | ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Innolux Corporation |
| 18474548 | IMAGE DISPLAY DEVICE AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE | Non-Final OA | NICHIA CORPORATION |
| 17482275 | FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH HETEROGENEOUS APPLICATIONS | Non-Final OA | Intel Corporation |
| 18458242 | PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGNATED (PPG) SUBSTRATE(S) TO SUPPORT HIGH DENSITY BUMP AND WIRE BOND CONNECTIONS, AND RELATED HYBRID INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18282196 | LIGHT-EMITTING DEVICE AND DISPLAY DEVICE | Non-Final OA | KYOCERA Corporation |
| 17894756 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18097931 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 17128618 | THREE-DIMENSIONAL NAND MEMORY DEVICE WITH SPLIT CHANNEL GATES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18151714 | Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resulting Structures | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18311779 | METHOD OF MANUFACTURING AN INTERCONNECTION STRUCTURE OF AN INTEGRATED CIRCUIT | Final Rejection | STMicroelectronics (Crolles 2) SAS |
| 18492977 | COMPOSITE ENCAPSULATION MATERIAL AND OPTICAL DEVICE OF THE SAME | Non-Final OA | Lextar Electronics Corporation |
| 18079610 | THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION | Final Rejection | STMicroelectronics Pte Ltd |
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