Prosecution Insights
Last updated: August 06, 2026
Application No. 18/605,619

POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, AND PRINTED CIRCUIT BOARD

Non-Final OA §102
Filed
Mar 14, 2024
Priority
Mar 27, 2023 — JP 2023-050565
Examiner
FARAZDAGHI, ARMAN MAHMOOD
Art Unit
Tech Center
Assignee
TAMURA Corporation
OA Round
1 (Non-Final)
Grant Probability
Favorable
1-2
OA Rounds

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Specification The use of the terms “Versamine" and "Priamine”, which are a trade names or marks used in commerce, has been noted in this application. The terms should be accompanied by the generic terminology; furthermore the terms should be capitalized wherever it appears or, where appropriate, include a proper symbol indicating use in commerce such as ™, SM , or ® following the terms. Although the use of trade names and marks used in commerce (i.e., trademarks, service marks, certification marks, and collective marks) are permissible in patent applications, the proprietary nature of the marks should be respected and every effort made to prevent their use in any manner which might adversely affect their validity as commercial marks. Examiner notes “Priamine” and “Versamine” in paragraphs 30 and 48 seem to have an attempted “®” for the registered trademarks but are shown as “(R)”. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1 - 6 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Yoshiki et al. (JP-2021147610 A, machine translation), hereafter referred to as Yoshiki. Regarding Claim 1, Yoshiki teaches the formation of a polyimide by imidizing a polyamic acid. Polyamic acid is advantageous due to its excellent solubility ([0086]-[0087], lines 615-621, 637-641, pgs. 25-26). In the alternative, the polymer may be only partially imidized ([0091], line 668, pg. 27). The product of partial imidization reads on the claimed polyamic acid. The polyamic acid is obtained via reaction between a tetracarboxylic acid dianhydride and a diamine component ([0010], lines 60-61, pg. 4), where the diamine component can be comprised of a dimer diamine ([0014], lines 98-103, pg. 5) and a diamine having a fluorene skeleton ([0067], lines 495-500, pg. 20). In one example taught, Yoshiki reacts the tetracarboxylic dianhydride 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), a dimer diamine (trade name Priamine 1074, see pg. 2, [0066], lines 484-491), and bisaniline fluorene (BAFL, also known as 9,9-Bis(4-aminophenyl)fluorene) with N-methyl-2-pyrrolidone (NMP) and xylene to produce polyamic acid ([0086], [0163], lines 615-621, 1406-1408, pgs. 25,51). Altogether, the example reads on a tetracarboxylic dianhydride and two diamines, comprised of a dimer diamine and a diamine with a fluorene skeleton. Regarding Claim 2, Yoshiki teaches the reaction described above to obtain the polyamic acid according to Claim 1, wherein the diamine having a fluorene skeleton is BAFL, which has a matching structure to the claimed diamine with a fluorene skeleton (0067, 0163, lines 495-500, 1406-1408, pg. 20, 51). Regarding Claim 3, Yoshiki teaches the previously described reaction using NMP as an organic solvent (0086, 0163, lines 618-621, 1406-1408, pgs. 25,51). Regarding Claim 4, Yoshiki teaches a polyimide obtained by imidizing the polyamic acid obtained by the reaction described above, which is heat imidized with additional xylene (0163, lines 1409-1411, pg. 51). Regarding Claim 5, Yoshiki discloses a film comprised of the polyimide mentioned above, applied in a coating to and then peeled off of a substrate such as PET (product used in example 1: HY-S05) as a film 25 microns thick (0119, 167, lines 969-972, 1420-1425, pgs. 37, 53-54) Regarding Claim 6, Yoshiki discloses previously discussed polyimide film can be used in copper clad laminates and as an adhesive insulation in multilayer circuit boards as adhesive layer 20 in Figures 7 and 8 (0146, 180, lines 1229-1234, 1486-1489, pgs. 45, 56). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Radu et al. (US 20240317940 A1) teaches a polyimide resin with one or more tetracarboxylic acid component residues; (b) one or more diamine component residues for use in electronics. Yushi et al. (JP 2023041626 A) teaches a polyimide resin with one or more tetracarboxylic acid component residues; multiple diamine component residues including a dimer diamine and one with a fluorene skeleton. Ebisawa (JP 2022190618 A) teaches polyamic acid and polyimide resin using dimer and/or fluorene skeleton diamines and a tetracarboxylic dianhydride for photolithographic processing. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ARMAN M. FARAZDAGHI whose telephone number is (571) 270-5813. The examiner can normally be reached Monday - Friday, 8:30 am - 5:00 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Robert Jones can be reached at (571) 270-7733. The fax phone number for the organization where this application or proceeding is assigned is (571) 273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /A.M.F./ Examiner, Art Unit 1762 /ROBERT S JONES JR/Supervisory Patent Examiner, Art Unit 1762
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Prosecution Timeline

Mar 14, 2024
Application Filed
Jul 30, 2026
Non-Final Rejection mailed — §102 (current)

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