Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
4 pending office actions • 2 art units • 3 examiners • 0 of 4 (0%) have an AI response strategy ready • 4 patents granted in the last 365 days
TAMURA Corporation is currently managing 4 pending office actions within the Semiconductors, Circuits & Optics technology area. These matters are distributed across 3 distinct examiners and 2 distinct art units, indicating some level of administrative dispersion. This distribution suggests that the company's semiconductor technology may span different specialized classifications, requiring review from multiple groups at the patent office. Managing 2 distinct art units involves navigating different examination standards and timelines.
FARAZDAGHI, ARMAN MAHMOOD is the busiest examiner for the portfolio, overseeing 2 pending office actions. This means the remaining pending actions are split among the other 2 distinct examiners involved in the company's prosecution. Because the busiest examiner is responsible for 2 of the 4 pending office actions, they hold a significant portion of the company's current workload. For the practitioner, this indicates a mix of concentrated and distributed prosecution, where one examiner handles a larger share of the active matters while others manage the rest.
Based on the USPTO statutory response window for each pending office action. 1 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 1 (25%) |
| §102 only | 2 (50%) |
| Multi-statute (no §101) | 1 (25%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| FARAZDAGHI, ARMAN MAHMOOD | 2 | — | — |
| CHAN, TSZFUNG JACKIE | 1 | 75.6% | +18.9% |
| NGUYEN, KHIEM D | 1 | 85.8% | +12.5% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17941020 | SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE | NGUYEN, KHIEM D | 15d |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18174310 | COIL COMPONENT AND MANUFACTURING METHOD OF THE COIL COMPONENT | CHAN, TSZFUNG JACKIE | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17941020 | SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE | NGUYEN, KHIEM D | 15d |
| 18174310 | COIL COMPONENT AND MANUFACTURING METHOD OF THE COIL COMPONENT | CHAN, TSZFUNG JACKIE | — |
| Art Unit | Apps |
|---|---|
| 2837 | 1 |
| 2892 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18605575 | POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, AND PRINTED CIRCUIT BOARD | FARAZDAGHI, ARMAN MAHMOOD | — | §102 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18605619 | POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, AND PRINTED CIRCUIT BOARD | FARAZDAGHI, ARMAN MAHMOOD | — | §102 | Non-Final OA | — | Pending | Mar 14, 2024 |
| 18174310 | COIL COMPONENT AND MANUFACTURING METHOD OF THE COIL COMPONENT | CHAN, TSZFUNG JACKIE | 2837 | §103§112 | Final Rejection | — | Pending | Feb 24, 2023 |
| 17941020 | SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE | NGUYEN, KHIEM D | 2892 | §103 | Final Rejection | 15d | Pending | Sep 09, 2022 |
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