Attorney’s Docket Number: 2400428
Filing Date: 03/14/2024
Claimed Priority Date: N/A
Applicants: Lan et al.
Examiner: Aneesa Baig
DETAILED ACTION
This Office action responds to the election filed on 07/22/2026
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s elections without traverse of Group I Invention, directed to a package structure, corresponding to claims 1-24, in the reply filed on 07/22/2026, is acknowledged.
With regards to the species restriction between Species 1-2, examiner agrees with the applicants reasoning, leaving the species restriction withdrawn.
Accordingly, pending in this application are claims 1-24, with claims 25-30 stand withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected Group Invention, there being no allowable generic or linking claim.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-5 are rejected under 35 U.S.C. 102 (a)(1) as anticipated by Li et al (CN 110752163 A, Hereinafter Li).
Regarding Claim 1, LI (e.g., 3b-3e, 4a-4b ) shows all aspects of the instant invention, including, a multi-chip package comprising:
a first chiplet including power amplifier (PA) circuitry (elements 302, Fig 4a/4b);
a second chiplet including low-noise amplifier (LNA) circuitry (elements 302, Fig 4a/4b);
an electromagnetic interference (EMI) shield between the first chiplet and the second chiplet (303); and
a mold compound at least partially encapsulating the first chiplet, the second chiplet, and the EMI shield (mold 304).
Regarding Claim 2, Li shows a filter chiplet ( 302 to the farthest right in Fig 3e “element 302 may include filter chip”)
Regarding Claim 3, Li shows a switch chiplet ( 302 to the farthest right in Fig 3e “element 302 may include a switch”)
Regarding Claim 4, Li shows the EMI shield includes a plurality of conductive structures (Fig 4a, 4031).
Regarding Claim 5, Li shows the EMI shield is a single conductive structure (Fig 4a, 4032).
Claims 11-13, 19 are rejected under 35 U.S.C. 102 (a)(1) as anticipated by Harada et al (US 20210329778 A1, Hereinafter Harada).
Regarding Claim 11, Harada (e.g., Fig 2, 6, embodiment 1A and features references prior [0104]-[0105]) shows all aspects of the invention, including, a packaged integrated circuit device comprising:
a first chiplet including power amplifier (PA) circuitry (11);
a second chiplet including low-noise amplifier (LNA) circuitry (12); and
a third chiplet (55) including:
radio frequency (RF) circuitry (control circuit 55 receives RF signals [0065]);
first contacts on a first surface, wherein a first subset of the first contacts are electrically connected to the first chiplet and a second subset of the first contacts are electrically connected to the second chiplet (Fig 6 shows bumps between 11 and 12 and 55);
second contacts on a second surface, the second contacts configured to electrically connect to off package components (bottom surface of 55, or third electronic component has bumps, connected to external connection terminals 150); and
conductors electrically connecting one or more of the first contacts to one or more of the second contacts ([0086]-[0101]).
Regarding Claim 12, Harada shows the device may include a filter chiplet (filter 64 [0124])
Regarding Claim 13, Harada shows the device may include a switch chiplet (switch 53 [0124])
Regarding Claim 19, Harada shows all three chiplets enclosed in a mold (94)
Claims 22,23 are rejected under 35 U.S.C. 102 (a)(2) as anticipated by Franson et al (US 20260088500 A1, Hereinafter Franson).
Regarding Claim 22, Franson (Fig 5B/5C, [0005]-[0047)] shows all aspects of the invention, including, a stacked integrated circuit device comprising:
a multichip package stacked with a radio frequency (RF) interposer chiplet, the multichip package comprising (e.g., Fig 5B/5C shows a multichip package with RF chiplet including conductive traces 564, 325” phase shifter chip receives RF signals [0045]) :
a first chiplet including first circuitry (amplifier chip 530);
a second chiplet including second circuitry (amplifier chip 122); and
a mold compound at least partially encapsulating the first chiplet and the second chiplet (Molding material 126); and
the RF interposer chiplet comprising:
RF circuitry (phase shifter chip receives RF signals [0045]); and
first contacts, on a first surface, electrically connected to the first chiplet and the second chiplet of the multichip package (metal pillars 150j, 150k).
Regarding Claim 23, Franson (Fig 5B/5C, [0005]-[0047)] shows wherein the multichip package includes an electromagnetic interference (EMI) shield (radiation shield 505 [0041]) between the first chiplet (530) and the second chiplet (122).
Allowable Subject Matter
Claims 6-10, 14-18,19-21, 24 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANEESA RIAZ BAIG whose telephone number is (571)272-0249. The examiner can normally be reached Monday-Friday 8am-5pm EST.
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/ANEESA RIAZ BAIG/
Examiner, Art Unit 2814
/WAEL M FAHMY/Supervisory Patent Examiner, Art Unit 2814
