DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1 and 4 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by U.S. Patent Pub. No. 2007/0119371 to Ma et al.
Regarding claim 1, Ma et al. disclose a gas baffle plate capable of being provided below a gas supply line (e.g. Fig. 1, 820, 720) formed in a chamber in which a process is performed (i.e. capable of being performed) on the substrate, the gas baffle comprising: a baffle plate (see, e.g., Fig. 5A-B, 500) configured to dispense (i.e. capable of dispensing) a process gas supplied from the gas supply line; and a plurality of slit-shaped openings (510), each extending in a straight line radially from a central portion of the baffle plate toward an edge portion of the baffle to pass (i.e. capable of passing) the process gas, wherein a pair of sidewalls defining each of the plurality of slit-shaped openings are inclined (e.g. substantially obliquely) at a predetermined angle with respect to the baffle plate (i.e. with respect to a substantially horizontal top or bottom surface of the baffle plate) in a circumferential direction of the baffle plate to disperse (i.e. capable of dispersing) the process gas.
With respect to claim 4, in Ma et al., the baffle plate includes a first surface facing the supply line, and a second surface located on an opposite side of the first surface, and a protrusion (522) is formed on a central portion of the first surface.
Claim(s) 1 and 4-9 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by U.S. Patent Pub. No. 5,950,925 to Fukunaga et al.
Regarding claim 1: Fukunaga et al. disclose a gas baffle plate capable of being provided below a gas supply line formed in a chamber in which a process is performed on the substrate, the gas baffle comprising: a baffle plate (see, e.g., Figs. 2-4A, 92) configured to disperse (i.e. capable of dispersing) a process gas capable of being supplied from the gas supply line (horizontal portion connected to 98 at “arrow” in Fig. 1); and a plurality of slit-shaped openings (90), each extending in a straight line radially from a central portion of the baffle plate toward an edge portion of the baffle (i.e. capable of passing) the process gas, wherein a pair of sidewalls defining each of the plurality of slit-shaped openings are inclined at a predetermined angle (e.g., approximately 90 degrees) with respect to the baffle plate (i.e. a substantially horizontal top or bottom surface of the baffle plate) in a circumferential direction of the baffle plate to disperse the process gas.
With respect to claim 4, in Fukunaga et al., the baffle plate includes a first surface facing the supply line, and a second surface located on an opposite side of the first surface, and a protrusion (extending wall portion of 98) is formed on a central portion of the first surface.
With respect to claim 5, in Fukunaga et al., a through hole (inner volume of 98) is formed in the protrusion (e.g. in order to supply gas).
With respect to claim 6, in Fukunaga et al., the gas baffle may further comprise a guide (e.g. inner wall of protrusion surrounding through hole).
Regarding claim 7: Fukunaga et al. disclose a substrate processing apparatus comprising: a chamber (see, e.g., Fig. 1, “vessel”) including a chamber body (e.g. 12 and 14) with an open top providing a processing space (10) for a substrate (W), and a lid (86) configured to seal the open top of the chamber body; a gas supply line (horizontal portion connected through vertical 98 at “arrow” in Fig. 1 and horizontal portion connected through 96 at “arrow” and vertical 96 and 70 ) configured to supply a process gas into the chamber; a gas baffle (see, e.g., Figs. 2-4A, 92) formed in the chamber and provided below the gas supply line to disperse (i.e. capable of dispersing) the process gas; and a showerhead (60) provided in the processing space and configured to supply (i.e. capable of supplying) the process gas to the substrate, wherein the gas baffle includes a baffle plate (92) and a plurality of slit-shaped openings (90) each extending in a straight line radially from a central portion of the baffle plate toward and edge portion of the baffle plate to pass the process gas, wherein a pair of sidewalls defining each of the plurality of slit-shaped openings are inclined at a predetermined angle (e.g., approximately 90 degrees) with respect to the baffle plate (i.e. a substantially horizontal top or bottom surface of the baffle plate) in a circumferential direction of the baffle plate to disperse the process gas.
With respect to claim 8, in Fukunaga et al., the gas supply line is formed in the lid, and the gas baffle is provided between the lid and the showerhead below the gas supply line. See, e.g., Fig. 2.
With respect to claim 9, in Fukunaga et al., the baffle plate includes a first surface facing the gas supply line, and a second surface located on an opposite side of the first surface, and a protrusion (extending wall portion of 98) is formed on a central portion of the first surface.
Claim(s) 1 and 4-9 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated U.S. Patent Pub. No. 2006/0086319 to Kasai et al.
Regarding claim 1: in e.g., Figs. 3 and 5A-5B, Kasai et al. disclose a gas baffle (205) capable of being provided below a gas supply line formed in a chamber in which a process is performed on a substrate; the gas baffle comprising: a baffle plate (e.g., solid portions of 205B) configured to disperse (i.e. capable of dispersing) a process gas supplied from the gas supply line; and a plurality of slit-shaped openings (opening portions between solid portions, not numbered) extending in a straight line radially from a central portion (i.e. inner portion) of the baffle plate toward an edge portion (i.e. outer portion) of the baffle plate to pass (e.g. capable of passing) the process gas, wherein a pair of sidewalls defining each of the plurality of slit shaped openings are inclined at a predetermined angle (e.g., approximately, 90 degrees), with respect to the baffle plate (i.e. with respect to a substantially horizontal top or bottom surface of the baffle plate) in a circumferential direction of the baffle plate to disperse the process gas.
With respect to claim 4, in Kasai et al., the baffle plate includes a first surface facing the supply line, and a second surface located on an opposite side of the first surface, and a protrusion (205A) is formed on a central portion of the first surface (i.e. extending from a central portion of the first surface).
With respect to claim 5, in Kasai et al., a through hole is formed in the protrusion. See Fig. 5A.
With respect to claim 6, in Kasai et al., the gas baffle further comprises a guide (i.e. inner wall of 205A) configured to guide (i.e. capable of guiding) a flow of gas inside the through hole.
Regarding claim 7: Kasai et al. disclose a substrate processing apparatus comprising: a chamber (see, e.g., Fig. 3, 100) including a chamber body (101) with an open top providing a processing space (100a) for a substrate (Wf), and a lid (102) configured to seal the open top of the chamber body; a gas supply line (206) configured to supply (i.e. capable of supplying) a process gas into the chamber; a gas baffle (205) formed in the chamber and provided below the gas supply line configured to disperse (i.e. capable of dispersing) the process gas; and a showerhead (201) provided in the processing space and configured to supply (i.e. capable of supplying) the process gas to the substrate, wherein the gas baffle includes a baffle plate (e.g., solid portions of 205B), and a plurality of slit-shaped openings (opening portions between solid portions, not numbered) extending in a straight line radially from a central portion (i.e. inner portion) of the baffle plate toward an edge portion (i.e. outer portion) of the baffle plate to pass (e.g. capable of passing) the process gas, wherein a pair of sidewalls defining each of the plurality of slit shaped openings are inclined at a predetermined angle (e.g., approximately 90 degrees), with respect to the baffle plate (i.e. with respect to a substantially horizontal top or bottom surface of the baffle plate) in a circumferential direction of the baffle plate to disperse the process gas.
With respect to claim 8, in Kasai et al., the gas supply line is formed in the lid, see, e.g., Fig. 4, and the gas baffle is provided between the lid and the showerhead below the gas supply line.
With respect to claim 9, in Kasai et al., the baffle plate includes a first surface facing the supply line, and a second surface located on an opposite side of the first surface, and a protrusion (205A) is formed on a central portion of the first surface (i.e. extending from a central portion of the first surface).
Response to Arguments
Applicant’s arguments with respect to claim(s) 1 and 4-9 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument, except as addressed below.
With respect to previously relied upon reference, Kasai et al., Applicant has argued that newly recited features are not disclosed. Examiner disagrees. See modified rejections above which address the amended claim language.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. KR 20120133822 and U.S. Patent Pub. No. 2010/0310772 disclose gas baffles with inclined openings. USP Pub 2005/0011447 teaches that a hole cross-section can be selected in order to affect the distribution of gas pressure at the exit of a gas delivery assembly (e.g. baffle/showerhead). US Patent 4,825,809; USP Pub 2010/0276084 also teach holes of a baffle/showerhead with varying cross-sections, as well as a central protrusion. USP Pub. 2012/0237696 discloses a baffle having a plurality of slit-shaped openings extending in a straight line radially from a central portion of the baffle plate toward an edge portion of the baffle plate to pass a process gas..
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KARLA MOORE whose telephone number is (571)272-1440. The examiner can normally be reached Monday-Friday, 9am-6pm EST.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, PARVIZ HASSANZADEH can be reached at (571) 272-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/KARLA A MOORE/Primary Examiner, Art Unit 1716