SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
—
+10.6% interview lift. Interview already conducted in this application's prosecution history. This examiner has a 84% grant rate with +10.6% interview lift. Since an interview has already been tried, recommend written response with narrowed claims based on precedent claim evolution patterns.