Tech Center 2600 • Art Units: 2628 2664 2672 2673 2695 2699
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18661872 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18619512 | SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18275905 | INFORMATION PROCESSING DEVICE AND METHOD, AND PROGRAM | Final Rejection | Sony Group Corporation |
| 18320020 | DEEP TRENCH CAPACITORS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
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