Prosecution Insights
Last updated: April 19, 2026
Application No. 18/629,076

PRINTED CIRCUIT BOARD TRACE WITH FORMATIONS

Non-Final OA §102
Filed
Apr 08, 2024
Examiner
NORRIS, JEREMY C
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Cisco Technology Inc.
OA Round
1 (Non-Final)
86%
Grant Probability
Favorable
1-2
OA Rounds
2y 5m
To Grant
91%
With Interview

Examiner Intelligence

Grants 86% — above average
86%
Career Allow Rate
840 granted / 973 resolved
+18.3% vs TC avg
Minimal +4% lift
Without
With
+4.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
23 currently pending
Career history
996
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
40.7%
+0.7% vs TC avg
§102
53.1%
+13.1% vs TC avg
§112
4.6%
-35.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 973 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1, 2, 7, and 8 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2021/0144842 A1 (Liu). Liu discloses, referring primarily to figure 1, an apparatus comprising: a layer of a printed circuit board (1); and a trace (2) routed along the layer of the printed circuit board, wherein the trace comprises a bend partially formed by a linear segment extending parallel to an axis, the linear segment includes a first side and a second side, opposite the first side, that each extend parallel to the axis, the linear segment includes a cutout (21) formed into the first side toward the second side, and an end of the cutout overlaps with the second side along the axis [claim 1], wherein an additional end of the cutout (22), offset from the end of the cutout along the axis, overlaps with the second side along the axis [claim 2], wherein the cutout terminates prior to the second side [claim 7], wherein the trace comprises an outer segment that is outside of the bend, and the linear segment extends from the outer segment and parallel to the axis in a direction transverse to extension of the outer segment (figure 1) [claim 8]. Claim(s) 1, 2, 7, 8, 9, and 12-14 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by US 2024/0407093 A1 (Dsilva). Dsilva discloses, referring primarily to figure 4, an apparatus comprising: a layer of a printed circuit board; and a trace (410) routed along the layer of the printed circuit board, wherein the trace comprises a bend partially formed by a linear segment extending parallel to an axis, the linear segment includes a first side and a second side, opposite the first side, that each extend parallel to the axis, the linear segment includes a cutout (480) formed into the first side toward the second side, and an end of the cutout overlaps with the second side along the axis [claim 1], wherein an additional end of the cutout, offset from the end of the cutout along the axis, overlaps with the second side along the axis [claim 2], wherein the cutout terminates prior to the second side [claim 7], wherein the trace comprises an outer segment that is outside of the bend, and the linear segment extends from the outer segment and parallel to the axis in a direction transverse to extension of the outer segment [claim 8]. Alternately, Dsilva discloses, an apparatus comprising: a layer of a printed circuit board; a first trace (440B) routed along the layer of the printed circuit board; and a second trace (440A) routed along the layer of the printed circuit board, wherein the second trace comprises a bend at least partially formed by a segment (410), wherein the second trace comprises an extension (420) extending from the segment toward the first trace [claim 9], wherein the first trace and the second trace are a differential pair ([0033]) [claim 12], wherein the first trace extends linearly along the bend of the second trace [claim 13], wherein the segment of the second trace is absent of a cutout [claim 14]. Claim(s) 1-20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2023/0156913 A1 (Nishio). Nishio discloses, referring primarily to figure 4, an apparatus comprising: a layer of a printed circuit board; and a trace (22) routed along the layer of the printed circuit board, wherein the trace comprises a bend partially formed by a linear segment (22b) extending parallel to an axis, the linear segment includes a first side and a second side, opposite the first side, that each extend parallel to the axis, the linear segment includes a cutout (222) formed into the first side toward the second side, and an end of the cutout overlaps with the second side along the axis [claim 1], wherein an additional end of the cutout, offset from the end of the cutout along the axis, overlaps with the second side along the axis [claim 2], wherein the trace comprises an extension extending from the second side of the trace (left end) [claim 3], wherein the extension is offset from each end of the cutout [claim 4], further comprising an additional trace (24) routed adjacent to the trace, wherein the extension extends between the trace and the additional trace [claim 5], wherein the extension overlaps with the cutout along the axis [claim 6], wherein the cutout terminates prior to the second side [claim 7], wherein the trace comprises an outer segment that is outside of the bend, and the linear segment extends from the outer segment and parallel to the axis in a direction transverse to extension of the outer segment [claim 8]. Additionally, Nishio discloses, referring primarily to figure 5, an apparatus comprising: a layer of a printed circuit board; a first trace (24) routed along the layer of the printed circuit board; and a second trace (22) routed along the layer of the printed circuit board, wherein the second trace comprises a bend at least partially formed by a segment (22b), wherein the second trace comprises an extension (224) extending from the segment toward the first trace [claim 9], wherein the first trace comprises an additional extension (244) extending toward the second trace [claim 10], wherein each of the first trace and the segment of the second trace extends along an axis, and the extension of the second trace and the additional extension of the first trace overlap with one another along the axis [claim 11], wherein the first trace and the second trace are a differential pair ([0072]) [claim 12], wherein the first trace extends linearly along the bend of the second trace [claim 13], wherein the segment of the second trace is absent of a cutout [claim 14]. Moreover, Nishio discloses, referring primarily to figure 4, an apparatus comprising :a layer of a printed circuit board; and a trace (22) routed along the layer of the printed circuit board, wherein the trace comprises a bend (22b) partially formed by a linear segment extending along an axis, the linear segment comprises a cutout (222) formed into a first side of the linear segment, and the linear segment comprises an extension extending from a second side (analog to 224, but left end), opposite the first side, of the linear segment, and the cutout and the extension are offset from one another along the axis [claim 15], comprising an outer segment (22c) that is outside of the bend, wherein the outer segment extends along the axis [claim 16], comprising an additional linear segment partially forming the bend, wherein the additional linear segment extends from the outer segment to the linear segment in a direction transverse to the axis (along 16b) [claim 17], wherein the trace comprises an additional extension extending from the second side of the linear segment and overlapping with the cutout along the axis [claim 18], wherein the additional extension is offset from each end of the cutout [claim 19], wherein the linear segment comprises an additional extension extending from the second side of the linear segment, and the additional extension and the cutout are offset from one another along the axis such that ends of the cutout are positioned between the extension and the additional extension along the axis [claim 20]. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JEREMY C NORRIS whose telephone number is (571)272-1932. The examiner can normally be reached 7:15-15:15 M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571)272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. JEREMY C. NORRIS Examiner Art Unit 2847 /JEREMY C NORRIS/Primary Examiner, Art Unit 2847
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Prosecution Timeline

Apr 08, 2024
Application Filed
Jan 08, 2026
Non-Final Rejection — §102
Feb 25, 2026
Interview Requested
Mar 04, 2026
Applicant Interview (Telephonic)
Mar 21, 2026
Examiner Interview Summary

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12604416
LAMINATE FOR WIRING BOARD
2y 5m to grant Granted Apr 14, 2026
Patent 12604411
FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTRICAL AND/OR ELECTRONIC COMPONENTS
2y 5m to grant Granted Apr 14, 2026
Patent 12598703
WIRING CIRCUIT BOARD
2y 5m to grant Granted Apr 07, 2026
Patent 12598698
WIRING CIRCUIT BOARD
2y 5m to grant Granted Apr 07, 2026
Patent 12598693
THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT BONDED POWER DEVICES
2y 5m to grant Granted Apr 07, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
86%
Grant Probability
91%
With Interview (+4.4%)
2y 5m
Median Time to Grant
Low
PTA Risk
Based on 973 resolved cases by this examiner. Grant probability derived from career allow rate.

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