Tech Center 2800 • Art Units: 1784 2835 2841 2847
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18706108 | FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM | Non-Final OA | SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. |
| 18629076 | PRINTED CIRCUIT BOARD TRACE WITH FORMATIONS | Non-Final OA | Cisco Technology, Inc. |
| 18530627 | METHOD FOR MANUFACTURING LASER-INDUCED GRAPHENE BASED E-TEXTILE AND LASER SYSTEM IMPLEMENTING THE METHOD | Non-Final OA | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 18688801 | COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD | Non-Final OA | MITSUBISHI MATERIALS CORPORATION |
| 18666110 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18569878 | CIRCUIT STRUCTURE | Non-Final OA | Sumitomo Wiring Systems, Ltd. |
| 18525907 | RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME | Non-Final OA | KMW INC. |
| 18537877 | WIRING SUBSTRATE | Non-Final OA | IBIDEN CO., LTD. |
| 18670113 | VERSATILE HIGH FREQUENCY MONOLITHIC MULTI-LAYERED CIRCUIT BOARD WITH EMBEDDED COAXIAL VIAS USEFUL FOR TESTING OF HIGH FREQUENCY INTEGRATED CIRCUIT DEVICES | Non-Final OA | R&D Circuits, Inc. (dba R&D Altanova) |
| 18669313 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | UNIMICRON TECHNOLOGY CORP. |
| 18667154 | Transparent Flexible Circuits | Non-Final OA | Xiamen Compass Technology Co., Ltd. |
| 18531993 | ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN | Non-Final OA | Eastman Kodak Company |
| 18532056 | TRANSPARENT COMPOSITE ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN | Non-Final OA | Eastman Kodak Company |
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