Last updated: July 05, 2026

Application No. 18/629,224

HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE

Non-Final OA

Filed

Apr 08, 2024

Priority

Apr 20, 2023 — provisional 63/497,325

Examiner

CHAMBLISS, ALONZO

Art Unit

Tech Center

Assignee

Micron Technology Inc.

OA Round

1 (Non-Final)

Interview Optional

— -24.7% interview lift. Interview already conducted in this application's prosecution history. This examiner has a 90% grant rate with -24.7% interview lift. Since an interview has already been tried, recommend written response with narrowed claims based on precedent claim evolution patterns.

Based on 1184 resolved cases, 2023–2026

Examiner Intelligence

CHAMBLISS, ALONZO View full profile →

Grants 90% — above average

Career Allowance Rate

1066 granted / 1184 resolved

+30.0% vs TC avg

Minimal -25% lift

Without

With

+-24.7%

Interview Lift

resolved cases with interview

Fast prosecutor

2y 1m

Avg Prosecution

27 currently pending

Career history

1206

Total Applications

across all art units

Statute-Specific Performance

§101

4.0%

-36.0% vs TC avg

§103

52.6%

+12.6% vs TC avg

§102

12.5%

-27.5% vs TC avg

§112

8.8%

-31.2% vs TC avg

Black line = Tech Center average estimate • Based on career data from 1184 resolved cases

Prosecution Timeline

Apr 08, 2024

Application Filed

May 13, 2026

Non-Final Rejection mailed

Jun 25, 2026

Interview Requested

Jul 01, 2026

Examiner Interview Summary

Jul 01, 2026

Applicant Interview (Telephonic)

Precedent Cases

Applications granted by this same examiner with similar technology

17/749,127

Patent 12672292

SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF DIELECTRIC LAYERS STACKED ON FERROELECTRIC LAYER

4y 1m to grant Granted Jun 30, 2026

18/352,952

Patent 12672553

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

2y 11m to grant Granted Jun 30, 2026

18/397,031

Patent 12672435

DISPLAY PANEL

2y 6m to grant Granted Jun 30, 2026

17/924,273

Patent 12666546

CIRCUIT BOARD WITH A PLURALITY OF LAMINATED INSULATING LAYERS HAVING CONDUCTIVE PASTE FILLED VIAS AND MANUFACTURING METHOD THEREOF

3y 7m to grant Granted Jun 23, 2026

18/467,062

Patent 12667023

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE

2y 9m to grant Granted Jun 23, 2026

Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.

Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2

Expected OA Rounds

90%

Grant Probability

65%

With Interview (-24.7%)

2y 1m (~0m remaining)

Median Time to Grant

Low

PTA Risk

Based on 1184 resolved cases by this examiner. Grant probability derived from career allowance rate.