DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant's election with traverse of Group I and Species C (claims 1-13, new claims 16, 17) in the reply filed on 8/3/26 is acknowledged. The traversal is on the ground(s) that Species A-C represent the same structure in the same embodiment. This is found persuasive. However, the Species requirement between D and E is still applicable.
The requirement is still deemed proper and is therefore made FINAL.
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, “a plurality of supporting members, disposed on the first surface of the redistributed circuit structure and embedded in the redistributed circuit structure” of claim 1 must be shown or the feature(s) canceled from the claim(s). No new matter should be entered.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-13, 16, 17 is / are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, because the specification, while being enabling for the supporting structure 198 may be embedded in the opening of the topmost insulating layer 132 to be connected to the topmost conductive layer 131 ([0029]), an feature subsequently connected to the supporting member 110 may be regarded as being embedded in the first encapsulant 120 ([0056]), the supporting structure 118 may be embedded in the encapsulating material 129 ([0070]), does not reasonably provide enablement for “a plurality of supporting members, disposed on the first surface of the redistributed circuit structure and embedded in the redistributed circuit structure” as recited in claim 1. The specification does not enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and / or use the invention commensurate in scope with these claims. The supporting members 110 appear to be embedded in the first encapsulant 120 (Fig. 2) instead.
The other claims are rejected as being dependent on claim 1.
Claims 1-13, 16, 17 is/are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 1 recites a second encapsulant before reciting a first encapsulant. The order of the limitations should be changed or the label of “first” and “second” should be switched.
Claim 17 recites: “compared to other places…a portion of the supporting surface close to the first encapsulant is more concave toward a direction…” It is unclear what constitutes the claims “other places,” what portion is considered “close to,” and what objective boundary or comparison establishes “more concave.” Accordingly, the meters and bounds of the claimed surface configuration cannot be determined with reasonable certainty. Also, either claim 16 or claim 17 should depend from claim 8 which is where a first and a second encapsulating surface are claimed.
The other claims are rejected as being dependent on claim 1.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-4, 7, 8, 12, 16 is/are, to the extent taught and understood, rejected under 35 U.S.C. 102(a)(1) as being anticipated by U.S. Patent No. 9,704,790 (Wu), equivalent of TW Publication No. 2017-32970, cited by Applicant.
Wu discloses (at least Figs. 10, 11)
1. (Original) A package structure, comprising:
a redistributed circuit structure 400, having opposite first surface (bottom) and second surface (top).
a plurality of chips 420a / 420b, disposed on the second surface (top) of the redistributed circuit structure 400;
a second encapsulant 500, disposed on the second surface (top) of the redistributed circuit structure 400 and covers the chips 420a / 420b;
a plurality of supporting members 302a, disposed on the first surface (bottom) of the redistributed circuit structure 400 and embedded in the redistributed circuit structure 400 (first encapsulant 310 / 610);
a first encapsulant 310 / 610, disposed on the first surface (bottom) of the redistributed circuit structure 400 and covers the supporting members 302a; and
a plurality of connection terminals 520, connected to the supporting members 302a.
Wu discloses
2. (Original) The package structure according to claim 1, wherein a thickness of the second encapsulant 500 is greater than a thickness of the first encapsulant 310 / 610.
Wu discloses
3. (Original) The package structure according to claim 1, wherein opposite two ends of the supporting members 302a directly contact the connection terminal 520 and the redistribution circuit structure 400 / 414a respectively.
Wu discloses
4. (Original) The package structure according to claim 1, wherein a thickness of the first encapsulant 310 / 610a is greater than a thickness of the supporting members 302a.
Wu discloses
7. (Original) The package structure according to claim 1, wherein a portion of the connection terminals 520 is embedded in the first encapsulant 310 / 610a.
Wu discloses
8. (Original) The package structure according to claim 1, wherein:
the first encapsulant 500 has opposite first encapsulating surface and second encapsulating surface;
the supporting members 302a have a supporting surface;
the first encapsulating surface and the first surface of the redistributed circuit structure 400 are coplanar; and
the second encapsulating surface 310 / 610a and the supporting surface are not coplanar.
Wu discloses
12. (Original) The package structure according to claim 1, wherein a portion of the supporting members 302a overlaps the chips 420a / 420b.
Wu discloses
16. (New) The package structure according to claim 1, wherein a sidewall of the first encapsulant 310 / 610, a sidewall of the redistributed circuit structure 400, and a sidewall of the second encapsulant 500 are flush with each other.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claim(s) 5, 6 is/are, to the extent taught and understood, rejected under 35 U.S.C. 103 as being unpatentable over Wu as applied to claim 4 above and further in view of U.S. Patent Application Publication No. 2022/0246508 (Yen).
Wu fails to disclose
5. (Original) The package structure according to claim 4, wherein each of the supporting members comprises a first portion and a second portion surrounding the first portion, and a thickness of the first portion is different from a thickness of the second portion.
Yen teaches (at least Fig. 3)
A package structure comprising:
wherein each of the supporting members 140 comprises a first portion and a second portion surrounding the first portion, and a thickness of the first portion is different from a thickness of the second portion.
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide a supporting member having portions with different thicknesses in Wu. The motivation would be based on routine optimization as shown in Yen. See MPEP 2144.05.
Yen teaches
6. (Original) The package structure according to claim 5, wherein a thickness of the first portion is greater than a thickness of the second portion.
Claim(s) 9, 17 is/are, to the extent taught and understood, rejected under 35 U.S.C. 103 as being unpatentable over Wu as applied to claim 8 / 16 above and further in view of U.S. Patent Application Publication No. 2020/0381383 (Hsu).
Wu fails to disclose
9. (Original) The package structure according to claim 8, wherein the supporting surface is not planar.
Hsu teaches (at least Fig. 5G)
A package structure comprising:
wherein the supporting surface (of supporting member 144) is not planar (concave).
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide a supporting member having a nonplanar supporting surface in Wu. The motivation would be based on routine optimization or to completely encapsulate the connection terminal as shown in Hsu. See MPEP 2144.05.
Wu discloses
17. (New) The package structure according to claim 16, wherein:
the first encapsulant 310 / 610 has a second encapsulating surface (bottom) distant from the redistributed circuit structure 400;
the supporting members 302a have a supporting surface (bottom) distant from the redistributed structure 400;
Wu fails to disclose
the supporting surface is concave relative to the second encapsulating surface and is not coplanar with the second encapsulating surface; and
compared to other places in the supporting surface, a portion of the supporting surface close to the first encapsulant is more concave toward a direction of the redistributed circuit structure.
Hsu teaches
the supporting surface (of supporting member 144) is concave relative to the second encapsulating surface (of Wu) and is not coplanar with the second encapsulating surface (of Wu); and
compared to other places in the supporting surface (of supporting member 144), a portion of the supporting surface (of supporting member 144) close to the first encapsulant 115 / 210 is more concave toward a direction of the redistributed circuit structure 400 (Wu).
Claim(s) 10, 11 is/are, to the extent taught and understood, rejected under 35 U.S.C. 103 as being unpatentable over Wu as applied to claim 8 / 1 above and further in view of U.S. Patent Application Publication No. 2024/0030173 (Fang).
Wu fails to disclose
10. (Original) The package structure according to claim 8, wherein the supporting surface is an etched surface.
Fang teaches
A package structure comprising:
wherein the supporting surface 909 is an etched surface.
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide a supporting member having an etched surface in Wu. The motivation would be to facilitate placement, containment, and direct mechanical and electrical connectivity of the connection terminal as taught by Fang ([0028], [0040]).
Fang teaches (at least Fig. 9)
11. (Original) The package structure according to claim 1, wherein the first encapsulant 903 has an encapsulating surface distant from the redistributed circuit structure 130 / 823, the supporting members 819 have a supporting surface distant from the redistributed circuit structure 130 / 823, and a roughness of the encapsulating surface 903 is different from a roughness of the supporting surface.
Claim(s) 17 is/are, to the extent taught and understood, rejected under 35 U.S.C. 103 as being unpatentable over Wu as applied to claim 8 / 1 above and further in view of U.S. Patent Application Publication No. 2019/0393200 (Chang Chien).
Wu fails to disclose
13. (Original) The package structure according to claim 1, wherein a portion of the supporting members is electrically connected to the chips, and a portion of the supporting members is electrically separated from the chips.
Chang Chien teaches
A package structure comprising:
wherein a portion of the supporting members 504 is electrically connected to the chips 300 / 604, and a portion of the supporting members 504 is electrically separated from the chips 300 / 604.
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide some unconnected supporting members in Wu. The motivation would be to serve as dummy or mechanical support structures which are critical for the physical stability and manufacturing yield as shown in Chang Chien (which is well-known in the package art). See MPEP 2144.03.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. U.S. Patent No. 8,410,585 (Ahn), U.S. Patent Application Publication Nos. 2006/0097366 (Sirinorakul), 2017/0221858 (Yu) teach a package structure having a redistribution circuit structure, supporting members, and multiple encapsulants.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TERESA M ARROYO whose telephone number is (703)756-1576. The examiner can normally be reached Monday - Friday (8:30 A.M. E.T. - 5:00 P.M. E.T.).
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Sue Purvis can be reached at 571.272.1236. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/TERESA M. ARROYO/Primary Examiner, Art Unit 2893
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