DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Status
Acknowledgment is made of the amendment filed on 1/7/2026, which amended claims 14, 6-13, 15-17, and 19-20. Claims 1-20 are currently pending.
Claim Objections
Claims 7 and 9 are objected to because of the following informalities:
Claim 7, line 3, “areas” should be changed to --an area-- to correct grammar.
Claim 9, line 3, “areas” should be changed to --an area-- to correct grammar.
Appropriate correction is required to place claims in better form.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claim 20 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Regarding claim 20, the limitations “a first housing including a space to accommodate the cooling plate therein,” in lines 29-30, “a transfer mechanism accommodated in the first housing and configured to transfer the substrate from the buffer unit to the cooling chamber” in lines 35-37, and “the transfer mechanism of the buffer module” in lines 42-43 render the claim language vague and indefinite as the arrangement of the transfer mechanism in the substrate processing apparatus is unclear. Lines 35-37 require the transfer mechanism to be accommodated in the first housing (see “a transfer mechanism accommodated in the first housing and configured to transfer the substrate from the buffer unit to the cooling chamber”), which lines 14-16, 26, and 29-30 define as being arranged in the cooling chamber of the treating module (see “the cooling chamber includes…a first housing including a space to accommodate the cooling plate therein”). However, lines 31 and 42-43 appear to indicate the transfer chamber is part of the buffer module (see “the buffer module includes…a transfer mechanism” and “the transfer mechanism of the buffer module”), which is a different module from the treating module (see lines 3 and 4). It is therefore unclear in which module the transfer mechanism is intended to be arranged, and the metes and bounds of the claimed invention are indefinite. For the purposes of examination, the limitations are being interpreted as meaning a transfer mechanism accommodated in the second housing and configured to transfer the substrate from the buffer unit to the cooling chamber and the transfer mechanism of the buffer module. Thus, claim 20 is rejected as being indefinite. Appropriate correction is required.
Allowable Subject Matter
Claims 1-19 are allowed.
Claim 20 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action.
The following is a statement of reasons for the indication of allowable subject matter.
Regarding claim 1, the prior art of record, either alone or in combination, fails to teach or render obvious wherein the buffer module includes a first buffer unit configured to place the substrate thereon, a housing configured to accommodate the first buffer unit, and a first transfer mechanism accommodated in the housing and configured to transfer the substrate from the first buffer unit to a first cooling chamber, the treating module includes the first cooling chamber configured to cool the substrate to be loaded from the buffer module, a liquid treating chamber configured to liquid treat the substrate to be loaded from the first cooling changer, a heat treating chamber configured to heat treat the substrate to be loaded from the first cooling chamber, and a transfer chamber between the liquid treating chamber and the heat treating chamber, the transfer chamber provided with a transfer robot configured to transfer the substrate to each of the liquid treating chamber, the heat treating chamber, and the first cooling chamber, when viewed from above, the first cooling chamber and the first buffer unit do not overlap each other, and the first transfer mechanism of the buffer module is configured to prevent the substrate in the first cooling chamber from being unloaded. These limitations in combination with the other limitations of claim 1 render the claim non-obvious over the prior art of record.
Regarding claim 17, the prior art of record, either alone or in combination, fails to teach or render obvious the buffer module includes a buffer unit configured to place the substrate thereon, a housing configured to accommodate the buffer unit, and a first transfer mechanism accommodated in the housing and configured to transfer the substrate from the buffer unit to a cooling chamber, the treating module includes the cooling chamber configured to cool the substrate loaded from the buffer module, a liquid treating chamber configured to liquid treat the substrate loaded from the cooling chamber, and a heat treating chamber configured to heat treat the substrate loaded from the cooling chamber, a transfer chamber between the liquid treating chamber and the heat treating chamber, the transfer chamber provided with a transfer robot configured to transfer the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber, the cooling chamber is adjacent to the transfer chamber, but is on one side of the transfer chamber perpendicular to a longitudinal direction of the transfer chamber among a plurality of sides of the transfer chamber, and the first transfer mechanism of the buffer module is configured to prevent the substrate in the cooling chamber from being unloaded. These limitations in combination with the other limitations of claim 17 render the claim non-obvious over the prior art of record.
Regarding claim 20, as best understood, the prior art of record, either alone or in combination, fails to teach or render obvious the buffer module includes a buffer unit configured to place the substrate thereon, the treating module further includes a cooling chamber configured to cool the substrate loaded from the buffer module, a liquid treating chamber configured to liquid treat the substrate loaded from the cooling chamber, a heat treating chamber configured to heat treat the substrate loaded from the cooling chamber, and a transfer chamber between the liquid treating chamber and the heat treating chamber, the transfer chamber provided with a transfer robot configured to transfer the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber, the cooling chamber includes a cooling plate configured to support the substrate, and a first housing including a space to accommodate the cooling plate therein, the buffer module includes the buffer unit, a second housing configured to accommodate the buffer unit, and a transfer mechanism accommodated in the first housing and configured to transfer the substrate from the buffer unit to the cooling chamber, the cooling chamber is adjacent to each of the buffer module and the transfer chamber, the cooling chamber being on one side of the transfer chamber perpendicular to a longitudinal direction of the transfer chamber among a plurality of sides of the transfer chamber, and the transfer mechanism of the buffer module is configured to load the substrate into the cooling chamber, and the transfer robot of the transfer chamber is configured to load the substrate loaded into the cooling chamber into the liquid treating chamber or the heat treating chamber, and the transfer mechanism of the buffer module is configured to prevent the substrate in the cooling chamber from being unloaded. These limitations in combination with the other limitations of claim 20 render the claim non-obvious over the prior art of record.
The dependent claims are likewise allowable by virtue of their dependency upon an allowable independent claim as stated above.
Kang et al. (US PGPub 2019/0378750) discloses a buffer module (Figs. 1-3, 8-12, paras. [0043]-[0044], [0053], [0055]-[0059], buffer chambers 3800 includes front buffers 3802 and rear buffers 3804 and interface buffers 4400); a treating module (Figs. 1-3, 8-12, paras. [0043], [0046]-[0048], heat treatment chambers 3200, liquid treating chambers 3600); and an interface module (Figs. 1-3, 8-12, paras. [0038], [0043]-[0044], [0053], [0055]-[0056], buffer chambers 3800 includes front buffers 3802 and rear buffers 3804 and interface buffers 4400 at the interface between the index module 20 and the treatment chambers and between the treatment chambers and the external stepper 50), wherein the index module includes: a load port in which a container receiving a substrate is placed (Figs. 1-3, paras. [0039]-[0041], load ports 22 receive containers 10); and an index frame provided with an index robot for transferring the substrate between the container placed in the load port and the buffer module (Figs. 1-3, paras. [0039]-[0041], [0053], [0063], index module 20 with index frame 24 and index robot 2200 extracts substrates W from containers 10 and transfers the substrates to the front buffer 3802), the buffer module includes a buffer unit on which the substrate is placed (Figs. 1-3, 8-12, paras. [0043]-[0044], [0053], [0055]-[0059], buffer chambers 3800 includes front buffers 3802 and rear buffers 3804 and interface buffers 4400), the treating module includes: a cooling chamber for cooling the substrate loaded from the buffer module (Figs. 1-3 and 8-12, paras. [0046]-[0048], [0063], [0086], cooling unit 3220 has cooling plate 3222 in a heat treatment chamber to cool the substrate from the buffers); a liquid treating chamber for liquid treating the substrate loaded from the cooling chamber (Figs. 1-3, and 8-12, paras. [0043], [0050]-[0054], [0063]-[0068], [0084]-[0087], liquid treating chambers 3600 form liquid films on the substrate W from the cooling unit 3222 in the heat treatment chamber 3200); a heat treating chamber for heat treating the substrate loaded from the cooling chamber (Figs. 1-3, paras. [0043]-[0044], [0046]-[0054], [0063]-[0068], [0084]-[0087], the substrate W is heated on heating unit 3230 in heat treatment chamber 3200 after liquid treating chambers 3600 form liquid films on the substrate W from the cooling unit 3222 in the heat treatment chamber 3200); and a transfer chamber disposed between the liquid treating chamber and the heat treating chamber (Figs. 1-3 and 8-12, paras. [0043]-[0044], transfer chamber 3400), and provided with a transfer robot for transferring the substrate to each of the liquid treating chamber, the heat treating chamber, and the cooling chamber (Figs. 1-3 and 8-12, paras. [0043]-[0054], [0063]-[0068], [0084]-[0087], transfer chamber 3400 includes main transfer robot 3422 to transfer substrates W between liquid treating chambers 3600 and heat treatment chambers 3200 having cooling unit 3220 and heating unit 3230), and when viewed from above, the cooling chamber and the buffer unit are provided in non-overlapping positions (Figs. 1-3 and 8-12, paras. [0043]-[0045], [0053], [0055]-[0059], the cooling unit 3220 and the buffers 3802 and rear buffers 3804 and interface buffers 4400 are in non-overlapping positions as viewed from above). Kang also discloses the cooling chamber is disposed adjacent to the transfer chamber, but is disposed on a side of a side of the transfer chamber perpendicular to a longitudinal direction of the transfer chamber among the sides of the transfer chamber (Figs. 1-3 and 8-12, paras. [0043]-[0054], [0063]-[0068], [0084]-[0087], heat treatment chambers 3200 having cooling units 3220 are disposed adjacent to transfer chamber 3400 and are disposed on a side of the transfer chamber 340 perpendicular to the longitudinal direction of the transfer chamber 340). However, Kang does not describe or render obvious the buffer module includes a housing configured to accommodate the first buffer unit and a first transfer mechanism accommodated in the housing and configured to transfer the substrate from the first buffer unit to a cooling chamber, and the first transfer mechanism of the buffer module is configured to prevent the substrate in the cooling chamber from being unloaded. Additionally, Kang fails to describe or render obvious the transfer mechanism of the buffer module is configured to load the substrate into the cooling chamber, and the transfer robot of the transfer chamber is configured to load the substrate loaded into the cooling chamber into the liquid treating chamber or the heat treating chamber, and the transfer mechanism of the buffer module is configured to prevent the substrate in the cooling chamber from being unloaded.
Eum et al. (US PGPub 2016/0035601, Eum hereinafter) discloses wherein the buffer module includes: the buffer unit (Figs. 1-4, paras. [0050]-[0051], [0057], the buffer module includes buffers 320, 330); a housing for accommodating the buffer unit (Figs. 1-4, paras. [0050]-[0051], [0056]-[0058], buffer module 300 includes a frame 310 accommodating the buffer); and a transfer mechanism accommodated in the housing (Figs. 1-4, paras. [0057]-[0059], [0064]-[0067], [0080]-[0081], [0085]-[0086], [0088], buffer robot 360 is in frame 310 and transfers the substrates between buffers), and the housing accommodating the buffer unit is provided with an entrance passage through which the substrate is loaded in a region in which the transfer mechanism and the cooling chamber are adjacent to each other (Figs. 1-12, paras. [0057]-[0059], [0064]-[0067], [0080]-[0081], [0085]-[0086], [0088], openings in the housings of the buffers allow the buffer robot 360 to carry wafers through the housings, and the cooling unit 570 is arranged adjacent to buffer robot). However, Eum fails to describe or render obvious first transfer mechanism accommodated in the housing and configured to transfer the substrate from the first buffer unit to a cooling chamber and the transfer mechanism of the buffer module is configured to prevent the substrate in the cooling chamber from being unloaded.
Response to Arguments
Applicant’s arguments, see page 12, filed 1/7/2026, with respect to the 35 U.S.C. 112(b) rejections of claims 2-3, 7, 9, 13, and 19 have been fully considered and are persuasive owing to the amendments to the claims. The 112(b) rejections of claims 2-3, 7, 9, 13, and 19 have been withdrawn.
Applicant’s arguments, see page 12, filed 1/7/2026, with respect to the rejections of claims 1 and 17 under 35 U.S.C. 102(1)(1) have been fully considered and are persuasive owing to the amendments to the claims. The rejections of claims 1 and 17 under 35 U.S.C. 102(1)(1) have been withdrawn.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHRISTINA A. RIDDLE whose telephone number is (571)270-7538. The examiner can normally be reached M-Th 6:30AM-5PM.
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/CHRISTINA A RIDDLE/Primary Examiner, Art Unit 2882