DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-7 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2014/0070300 A1 (Jang).
Re claim 1, Jang teaches a semiconductor device, comprising:
insulating layers (first insulation layer patterns 115) disposed in a first direction (first direction) and spaced apart from each other in the first direction;
pillars (vertical structures defined by semiconductor pattern 160, second insulation pattern 260 and channels 252) passing through the insulating layers;
a slit (third insulation pattern 380 and division layer pattern 130) passing through the insulating layers;
a nitrogen-containing layer (first barrier layer pattern 302 which is a conductive metal nitride [0081] and/or second barrier layer pattern 312 which is a conductive metal nitride [0091]) formed along a space between adjacent insulating layers in the first direction, the nitrogen-containing layer formed around the slit so that a gap between the pillars in the space is exposed; and
a conductive pattern (first filling layer pattern 322 [0085]) in the space to fill the gap between the pillars,
wherein the conductive pattern extends continuously from the gap to overlap the nitrogen-containing layer in the first direction (Figs. 2-5).
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Re claim 2, Jang teaches wherein each of the pillars is formed in a through-hole (plurality of holes 150), the through-hole passing through the insulating layers and being surrounded by the conductive pattern (Figs. 2-5), and wherein each of the pillar includes a memory layer (first charge storage pattern 182) over an inner-wall of the through-hole and a semiconductor pattern (channel layers 252 [0130]) over an inner-wall of the memory layer (Fig. 5).
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701
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Re claim 3, Jang teaches wherein the conductive pattern surrounds a side-wall of the memory layer (Fig. 5).
Re claim 4, Jang teaches wherein the pillars include an outer pillar adjacent to the slit (Fig. 3).
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697
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Re claim 5, Jang teaches wherein the nitrogen-containing layer partially surrounds a side-wall of the outer pillar (second barrier layer 312 Fig. 3).
Re claim 6, Jang teaches wherein a side-wall of the outer pillar includes a first portion (leftmost side) facing the slit and a second portion (rightmost side) facing the gap between the pillars, and wherein the nitrogen-containing layer is formed over the first portion of the outer pillar (second barrier layer 312 Fig. 3).
Re claim 7, Jang teaches wherein the nitrogen-containing layer entirely surrounds a side-wall of the outer pillar (first barrier layer 302 Fig. 3).
Conclusion
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BRIGITTE A. PATERSON
Primary Examiner
Art Unit 2896
/BRIGITTE A PATERSON/Primary Examiner, Art Unit 2896