DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) s 1-2 are is/are rejected under 35 U.S.C. 102a1 as being anticipated by Hillman 20110089531.
a. As to claim 1, Hillman teaches A method, comprising: forming an opening extending into a passive portion of a first surface of a wafer (figures 4 and 5 items 102/402 in top of item 500/154); placing an electrical component in the opening such that a surface of the electrical component is substantially co-planar with the first surface of the wafer (figure 7 and 19 item 702 and 120 paragraph 33 the contacts being coplanar would make 120 coplanar so at least that portion of the die is coplanar); and forming a resin between sidewalls of the electrical component and sidewalls of the opening surrounding the electrical component with the resin (item 118 paragraph 25 BCB is a resin).
b. As to claim 2, Hillman teaches wherein forming the opening extending into the passive portion of the first surface of the wafer includes forming the opening extending from the first surface of the wafer to a second surface (figure 5 top part of item 500 until it reaches 502_ is the wafer of the wafer opposite to the first surface of the wafer (figure 5 and 19).
Allowable Subject Matter
Claim 3-5 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Prior art fails to teach and or suggest:
For claim 3: further comprising: forming a conductive contact on a second surface of the wafer opposite to the first surface of the wafer; forming a bonding wire on the first surface of the wafer coupling the electrical component to an electrical connection on the wafer; forming an optically transmissive material on the electrical component and on the bonding wire; forming a molding compound on the first surface of the wafer covering the optically transmissive material; and forming an opening in the molding compound exposing a surface of the optically transmissive material.
For claim 4:
further comprising: forming a contact on a second surface of the wafer opposite to the first surface of the wafer; forming a molding compound on the first surface of the wafer; forming a bonding wire in an opening of the molding compound coupling the electrical component to an electrical connection in the wafer; and forming an optically transmissive material on the electrical component, on the bonding wire, and in the opening of the molding compound.
Claim 6-20 are allowed.
AS to claim 6, prior art fails to teach and or suggest A method, comprising: positioning a light sensor at a first surface of a substrate; forming an opening in the substrate, the opening extending through the first surface of the substrate and a second surface of the substrate; positioning a light emitter in the opening in the substrate; and forming a resin in the opening and on opposite sides of the light emitter.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MATTHEW L REAMES whose telephone number is (571)272-2408. The examiner can normally be reached M-Th 6:00 am-4:00 pm EST.
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/MATTHEW L. REAMES/
Primary Examiner
Art Unit 2896
/MATTHEW L REAMES/Primary Examiner, Art Unit 2896
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