Prosecution Insights
Last updated: August 17, 2026

Examiner: REAMES, MATTHEW L

Tech Center 2800 • Art Units: 1737 2891 2893 2896

This examiner grants 77% of resolved cases

Performance Statistics

77.0%
Allow Rate
+9.0% vs TC avg
1,128
Total Applications
+18.0%
Interview Lift
997
Avg Prosecution Days
Based on 1101 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
18.1%
§102 Novelty
43.2%
§103 Obviousness
33.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18641488 SEMICONDUCTOR MEMORY DEVICE INCLUDING A VERTICAL CHANNEL TRANSISTOR Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18406265 SEMICONDUCTOR DEVICE INCLUDING A BURIED CELL ARRAY TRANSISTOR (BCAT) STRUCTURE AND MANUFACTURING METHOD THEREOF Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18481872 SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18692796 DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Non-Final OA BOE Technology Group Co., Ltd.
18800342 IMAGE SENSOR Non-Final OA Commissariat à I'Énergie Atomique et aux Énergies Alternatives
18430982 Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device Final Rejection Huawei Technologies Co., Ltd.
18522042 SEMICONDUCTOR DEVICE MANUFACTURING METHOD Non-Final OA CANON KABUSHIKI KAISHA
18734281 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18420045 DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME Non-Final OA Samsung Display Co., Ltd.
18419993 LIGHT EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF Final Rejection TOYODA GOSEI CO., LTD.
18611681 SEMICONDUCTOR PACKAGE HAVING MOISTURE PASSING GAP IN POWER OR GROUND METAL PLANE OF A PACKAGE SUBSTRATE Non-Final OA MEDIATEK INC.
18643789 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18624151 SEMICONDUCTOR DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18596404 3D IC POWER GRID Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18406246 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18401771 HIGH PERFORMANCE STACKING PIXEL Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18346267 METHOD AND SYSTEM OF ARRANGING PATTERNS OF SEMICONDUCTOR DEVICE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18649723 FABRICATING SOLAR CELL DEVICES TO REDUCE ACTIVE LAYER DAMAGE Non-Final OA Applied Materials, Inc.
18649789 EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING Non-Final OA STMICROELECTRONICS PTE LTD
18447412 CONTROLLING CROSS-TALK AND BUS LOSSES IN RABI-DRIVEN SUPERCONDUCTING QUBITS WITH MULTI-MODE INTERCONNECTS Non-Final OA International Business Machines Corporation
18736847 OPTICAL SEMICONDUCTOR DEVICE WITH COMPOSITE INTERVENING STRUCTURE Non-Final OA NANYA TECHNOLOGY CORPORATION

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