Prosecution Insights
Last updated: October 02, 2026
Application No. 18/651,155

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Non-Final OA §102§112
Filed
Apr 30, 2024
Priority
Dec 01, 2021 — JP 2021-195175 +1 more
Examiner
NEWTON, VALERIE N
Art Unit
Tech Center
Assignee
Rohm Co., Ltd.
OA Round
1 (Non-Final)
84%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 84% — above average
84%
Career Allowance Rate
776 granted / 922 resolved
+24.2% vs TC avg
Moderate +6% lift
Without
With
+5.9%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
33 currently pending
Career history
958
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
58.6%
+18.6% vs TC avg
§102
28.7%
-11.3% vs TC avg
§112
6.5%
-33.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 922 resolved cases

Office Action

§102 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1-12 and 15 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 1 recites the limitation "a first side" in lines 7 and 10. There is insufficient antecedent basis for this limitation in the claim. It is unclear whether the first side recited in line 7 is referring to the same first side recited in line 10 and therefore the scope of the claim is indefinite. Claims 2-12 depend from claim 1 and therefore inherit its deficiency. These claims have not been examined on the merits. Appropriate action is required. Claim 15 recites the limitation "the step of joining" in line 1. There is insufficient antecedent basis for this limitation in the claim. Claim 13 from which this claim depends has a “step of joining a die pad portion . . . “and a “step of joining a semiconductor element . . ..” It is therefore unclear which “step of joining” the limitation of claim 15 is intending to limit. Therefore, the claim is indefinite and has not been examined on the merit. Appropriate action is required. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 13 and 14 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 20200258806 (Ichinohe). Concerning claim 13, Ichinohe discloses a method for manufacturing a semiconductor device (Fig. 4), the method comprising: a step of forming a lead frame having a first terminal portion (9a and 9b) ([0028]); a step of joining a die pad portion (3) to the first terminal portion ([0028] and Fig. 4); a step of joining a semiconductor element (4) to the die pad portion (Fig. 4); a step of forming a sealing resin (7) covering the semiconductor element (Fig. 4); and a step of cutting the lead frame ([0028]). Considering claim 14, Ichinohe discloses wherein the die pad portion includes an engaging portion (3g), the first terminal portion includes an engaging hole for engagement with the engaging portion, and the step of joining includes swaging the die pad portion to the first terminal portion (Fig. 4 and [0028]). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US 20120025359 discloses a lead frame configuration with an engaging hole (Figs. 5A-5D) and US 20180061745 discloses a lad frame configuration (Fig. 2). Any inquiry concerning this communication or earlier communications from the examiner should be directed to VALERIE N NEWTON whose telephone number is (571)270-5015. The examiner can normally be reached M-F 8-5. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, CHAD DICKE can be reached at (571) 270-7996. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /VALERIE N NEWTON/Examiner, Art Unit 2897 08/22/26 /CHAD M DICKE/Supervisory Patent Examiner, Art Unit 2897
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Prosecution Timeline

Apr 30, 2024
Application Filed
Aug 27, 2026
Non-Final Rejection mailed — §102, §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12751008
3D SYNAPSE DEVICE STACK, 3D STACKABLE SYNAPSE ARRAY USING THE 3D SYNAPSE DEVICE STACKS AND METHOD OF FABRICATING THE STACK
4y 1m to grant Granted Sep 29, 2026
Patent 12735313
MEMS DIE AND MEMS-BASED VIBRATION SENSOR
4y 1m to grant Granted Sep 15, 2026
Patent 12740128
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
2y 3m to grant Granted Sep 15, 2026
Patent 12727223
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD
2y 1m to grant Granted Sep 01, 2026
Patent 12717075
DISPLAY DEVICE
3y 10m to grant Granted Aug 25, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
84%
Grant Probability
90%
With Interview (+5.9%)
2y 5m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 922 resolved cases by this examiner. Grant probability derived from career allowance rate.

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