Tech Center 2800 • Art Units: 2823 2829 2897
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18335487 | LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL CHANNEL LAYER, METHODS OF MANUFACTURING THE SAME, ELECTRONIC DEVICES INCLUDING 2D CHANNEL LAYER, AND ELECTRONIC APPARATUSES INCLUDING ELECTRONIC DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18239151 | DISPLAY DEVICE AND METHOD FOR REPAIRING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18072400 | LIGHT EMITTING DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | LG Display Co., LTD. |
| 18392862 | SOLID-STATE IMAGE PICKUP DEVICE AND IMAGE PICKUP APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 17225988 | DISPLAY DEVICE, AND METHOD OF MANUFACTURING A DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18552200 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17987269 | DISPLAY ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18357781 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING TRENCH SUPPORT BRIDGE STRUCTURES AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18497311 | BOTTOM ISOLATION EXTENSION REGION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18461636 | ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18497435 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18332792 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 17858970 | DOPANT PROFILE CONTROL IN GATE STRUCTURES FOR SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17892964 | STACKED ARCHITECTURE FOR THREE-DIMENSIONAL NAND | Non-Final OA | Adeia Semiconductor Inc. |
| 18523109 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17892348 | DRIVER CHIP, PACKAGING METHOD FOR OPTICAL FILTER STRUCTURE, OPTICAL SENSOR DEVICE AND PACKAGING METHOD THEREOF | Non-Final OA | OIP Technology Pte Ltd |
| 17213665 | GaN HEMT DEVICE STRUCTURE AND METHOD OF FABRICATION | Non-Final OA | Infineon Technologies Canada Inc. |
| 18370752 | High-Crystallinity Barium Titanate Film Structure, Method of Preparation and Application Thereof | Non-Final OA | LoMaRe Technologies Limited |
| 17817857 | GAP-FILL FOR 3D NAND STAIRCASE | Non-Final OA | Intel NDTM US LLC |
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