DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Specification
1. The specification is objected because of the following reasons:
The title of the invention is not descriptive. A new title is required that is clearly indicative of the invention to which the claims are directed.
In par. [0001]: insert US Patent no. 12,021,010.
Appropriate correction is required.
Double Patenting
2. The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969).
A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b).
The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13.
The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer.
Claims 1-20 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-17 of U.S. Patent No. 12,021,010 (application 17/717,875). Although the claims at issue are not identical, they are not patentably distinct from each other because they both require similar limitations such as device including electronic component, die pad, first-tenth leads, first lead with first extended portion, first edge being closer to the die pad than second edge & third edge, connection member(s), SOP, intermediate portions and molding resin, etc.
Claims 1-5 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-16 of U.S. Patent No. 11,404,356 (application 16/827,049). Although the claims at issue are not identical, they are not patentably distinct from each other because they both require similar limitations such as device including electronic component, die pad, first-fifth leads, first lead with first extended portion, first connection member, etc.
Current Application 18/667,282
1. An electronic device comprising:
an electronic component provided with a first electrode pad;
a die pad including an obverse surface perpendicular to a first direction, the electronic component being mounted on the obverse surface;
a first lead spaced apart from the die pad in a second direction perpendicular to the first direction;
a second lead separated from the die pad and the first lead; and
a first connection member electrically connecting the first electrode pad and the first lead to each other,
wherein the first lead and the second lead are disposed on a same side of the die pad in the second direction,
as viewed in the first direction, the first lead includes a first extended portion extending in a third direction, the first lead including a first edge and a second edge that are spaced apart from each other in the third direction, the first edge belonging to the first extended portion and being closer to the die pad than is the second edge in the second direction, the first edge being smaller in length than the second edge in the second direction,
the first connection member is bonded to the first lead,
as viewed in the first direction, the second lead includes a third edge and a fourth edge that are spaced apart from each other in the third direction, the third edge being smaller in length than the fourth edge in the second direction, and
the first edge of the first extended portion is placed closer to the die pad than is the third edge of the second lead in the second direction.
2. The electronic device according to claim 1, wherein the die pad comprises a protrusion extending in the third direction.
3. The electronic device according to claim 2, further comprising a third lead formed with a plurality of external terminals.
4. The electronic device according to claim 3, wherein the third lead is placed closer to the die pad than is the second lead in the second direction.
5. The electronic device according to claim 4, further comprising a fourth lead and a fifth lead that are spaced apart from the die pad by a mutually equal distance in the second direction.
US Patent no. 12,021,010
1. An electronic device comprising:
an electronic component provided with a first electrode pad;
a die pad including an obverse surface perpendicular to a first direction, the electronic component being mounted on the obverse surface;
a first lead spaced apart from the die pad in a second direction perpendicular to the first direction;
a second lead separated from the die pad and the first lead; and
a first connection member electrically connecting the first electrode pad and the first lead to each other,
wherein the first lead and the second lead are disposed on a same side of the die pad in the second direction,
as viewed in the first direction, the first lead includes a first extended portion extending in a third direction perpendicular to the first direction and the second direction, the first extended portion including a first edge and a second edge that are spaced apart from each other in the second direction, the first edge being closer to the die pad than is the second edge in the second direction,
the first connection member is bonded to the first lead,
as viewed in the first direction, the second lead includes a third edge and a fourth edge that are spaced apart from each other in the second direction, the third edge being greater in length than the fourth edge in the third direction, and
the first edge of the first extended portion is placed closer to the die pad than is the third edge of the second lead in the second direction.
US Patent no. 11,404,356
3. An electronic device comprising: an electronic component provided with a first electrode pad; a die pad including an obverse surface facing in a first direction, the electronic component being mounted on the obverse surface; a first lead spaced apart from the die pad; a second lead spaced apart from the die pad and the first lead; and a first connection member electrically connecting the first electrode pad and the first lead to each other, wherein the first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction, the first lead includes a first pad portion and a first extended portion, the first connection member is bonded to the first pad portion, and the first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction, the electronic device further comprising a second connection member and a third lead spaced apart from the die pad, the first lead and the second lead, wherein the electronic component is provided with a second electrode pad, and the second connection member electrically connects the second electrode pad and the third lead to each other, the third lead is disposed on a same side of the die pad as the first lead and the second lead as viewed in the first direction, the third lead includes a second pad portion and a second extended portion, the second connection member is bonded to the second pad portion, and the second extended portion extends from the second pad portion up to a position between the die pad and the second lead as viewed in the first direction, the second pad portion includes a second pad obverse surface to which the second connection member is bonded, the second extended portion includes a second extended surface facing in a same direction as the second pad obverse surface, and the second extended surface is formed with a pressing mark recessed in the first direction.
Allowable Subject Matter
3. Claims 1-20 would be allowable if rewritten or amended to overcome the rejection(s) under Double Patenting, set forth in this Office action.
The allowable subject matter includes: “a first lead spaced apart from the die pad in a second direction perpendicular to the first direction;
a second lead separated from the die pad and the first lead; and
a first connection member electrically connecting the first electrode pad and the first lead to each other,
wherein the first lead and the second lead are disposed on a same side of the die pad in the second direction,
as viewed in the first direction, the first lead includes a first extended portion extending in a third direction, the first lead including a first edge and a second edge that are spaced apart from each other in the third direction, the first edge belonging to the first extended portion and being closer to the die pad than is the second edge in the second direction, the first edge being smaller in length than the second edge in the second direction,
the first connection member is bonded to the first lead,
as viewed in the first direction, the second lead includes a third edge and a fourth edge that are spaced apart from each other in the third direction, the third edge being smaller in length than the fourth edge in the second direction, and
the first edge of the first extended portion is placed closer to the die pad than is the third edge of the second lead in the second direction” (claim 1).
The closest prior arts include: Haga (US 2018/0108597, Figs. 1-2, directed to wiring bonding structure and electronic device); Ko et al. (US 2008/0315408, Figs. 4-9, directed to semiconductor package having plurality of chips and leads connected to pads of the chips); Tiu et al. (US 2015/0206834, Figs. 1-2, directed to semiconductor device with lead farm and integrated circuit die & bond wires); Otremba (US 2012/0068186, Figs. 6 & 7A, directed to electronic device with carrier, pins and semiconductor chips) & Nishimura (US 2001/0002723, Fig. 1, directed to motor driving device with IC chip, diode chip & lead frame), individually or in combination with the cited prior arts of record, do not meet all required limitations cited in claim 1.
Conclusion
4. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DUY T.V. NGUYEN whose telephone number is (571)270-7431. The examiner can normally be reached Monday-Friday, 7AM-4PM, alternative Friday off.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, EVA MONTALVO can be reached at (571) 270-3829. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/DUY T NGUYEN/Primary Examiner, Art Unit 2818 7/26/26
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