Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18242597 | IMAGE SENSOR AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18300009 | IMAGE SENSOR INCLUDING A BLOCKING BAR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18540413 | DISPLAY APPARATUS AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 17680981 | INTEGRATED CIRCUIT WITH A GALVANICALLY-ISOLATED COMMUNICATION CHANNEL USING A BACK-SIDE ETCHED CHANNEL | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17584070 | FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES | Final Rejection | Texas Instruments Incorporated |
| 18577245 | ORGANIC ELECTROLUMINESCENT DEVICE, DISPLAY PANEL, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18123953 | WIDE COLOR GAMUT LIGHT-EMITTING ELEMENT | Non-Final OA | Seoul Semiconductor Co., Ltd |
| 18338813 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18082538 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17957504 | OPTICAL MEMBER INCLUDING LIGHT CONTROL LAYER AND DISPLAY PANEL INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18464201 | SYSTEMS AND METHODS FOR IMPROVED DISPLAYS | Non-Final OA | Meta Platforms Technologies, LLC |
| 18140179 | LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATERIALS WITH IMPROVED RESISTIVITY | Non-Final OA | Applied Materials, Inc. |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | Final Rejection | Intel Corporation |
| 17357767 | SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES | Non-Final OA | Intel Corporation |
| 17882441 | MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIATED SYSTEMS AND DEVICES | Non-Final OA | Micron Technology, Inc. |
| 18180442 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Kioxia Corporation |
| 18171156 | SEMICONDUCTOR DEVICE WITH WIRING LAYER AND CONDUCTIVE PORTION WITH PROTRUDING PORTION | Final Rejection | Rohm Co., Ltd. |
| 18299419 | INTEGRATED CIRCUIT DEVICE THAT INCLUDES A PROTECTIVE LAYER AND AN INSULATING LAYER | Non-Final OA | Nagravision SARL |
| 18298206 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18188196 | Metal-Insulator-Metal Capacitors And Methods Of Forming The Same | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18168259 | VIA IN SEMICONDUCTOR DEVICE STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18162318 | SEMICONDUCTOR DIE PACKAGE WITH SEAL RING DISCHARGE PATHS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17649381 | 3D INTEGRATED CIRCUIT (3DIC) STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18467071 | BONDING APPARATUS AND BONDING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18128129 | Passive Device Dies With Measurement Structures | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17675558 | Methods of Manufacturing Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17651615 | Method of Forming a Semiconductor Device with a Low Dielectric Constant Dielectric Layer | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18338293 | CARRIER ASSEMBLY FOR PROCESSING PACKAGED MODULES | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18117630 | MULTIPLE-LAYERED COVER STRUCTURE FOR BEAMSHAPING FOR LIGHT-EMITTING DIODE DEVICES | Final Rejection | CreeLED, Inc. |
| 18030516 | PREPARATION METHOD OF DOUBLE-T-SHAPED GATE BASED ON DOUBLE-LAYER PASSIVATION ACCURATE ETCHING | Non-Final OA | SOUTH CHINA UNIVERSITY OF TECHNOLOGY |
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