Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2884 2894
This examiner grants 79% of resolved cases
NGUYEN, DUY T V operates within Tech Center 2800 and Art Unit 2818, where they have managed 1081 resolved cases. This volume of cases indicates the examiner's level of experience in handling patent applications within this technology sector. The examiner maintains an allowance rate of 78.9 percent, which provides a baseline for the probability of securing a patent grant. This percentage suggests the likelihood that an application reaching a final disposition will be allowed. Practitioners can use this figure to gauge the general receptivity of the examiner to patentable subject matter.
The data shows an interview lift of 16.7 percent, indicating how direct communication correlates with the probability of success. The interview lift of 16.7 percent is lower than the 78.9 percent allowance rate, which helps determine the relative impact of verbal engagement. The median days to allowance stands at 985, providing a timeline expectation for the prosecution process from filing to grant. This duration reflects the typical pendency for successful applications. Understanding these metrics allows for a more informed strategy when navigating the examination process with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18732795 | MEMORY DEVICE HAVING COP STRUCTURE AND MEMORY PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18630149 | SEMICONDUCTOR PACKAGES AND METHODS FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18624892 | SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18616418 | SEMICONDUCTOR PACKAGE HAVING AN INORGANIC LAYER ON A MOLD LAYER AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18588089 | THREE DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18839831 | LIGHT-EMITTING ASSEMBLY AND DISPLAY PANEL | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18777340 | DISPLAY APPARATUS AND VISION INSPECTION SYSTEM | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18655098 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18624480 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18338813 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18645066 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18540413 | DISPLAY APPARATUS AND MANUFACTURING METHOD OF THE SAME | Final Rejection | LG Display Co., Ltd. |
| 18812145 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18806287 | IMPROVING SIZE AND EFFICIENCY OF DIES | Non-Final OA | Intel Corporation |
| 18123838 | BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS | Non-Final OA | Intel Corporation |
| 17473414 | PATCH PACKAGING ARCHITECTURE IMPLEMENTING HYBRID BONDS AND SELF-ALIGNED TEMPLATE | Final Rejection | Intel Corporation |
| 18188391 | VERTICAL WORDLINE DRIVER STRUCTURES AND METHODS | Final Rejection | Intel NDTM US LLC |
| 18569478 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18837718 | MEMORY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18545249 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 18063956 | STACKED AND NON-STACKED TRANSISTORS WITH DOUBLE-SIDED INTERCONNECTS | Non-Final OA | International Business Machines Corporation |
| 18086144 | STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS | Final Rejection | Marvell Asia Pte Ltd. |
| 18650124 | SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18735002 | SEMICONDUCTOR STORAGE DEVICE COMPRISING STAIRCASE PORTION | Non-Final OA | Kioxia Corporation |
| 18650795 | EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18640540 | System and Method for Devices with Dummy Metal Traces | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18672076 | SEMICONDUCTOR STRUCTURE WITH A BIT LINE IN A DIFFERENT CONFIGURATION THAN A LOCAL INTERCONNECT LINE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18153700 | GATE PROFILE TUNING FOR MULTIGATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17675558 | Methods of Manufacturing Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18195027 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
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