DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-16 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2018/0027646 A1 (Sumida).
Sumida discloses, referring primarily to figure 1, a circuit board (24), comprising: a substrate portion comprising at least one circuit wire ([0037]); an adhesive layer (31) disposed on a first side of the substrate portion; and a metal reinforcing layer (34) disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer comprises a first surface which has a convex portion (35) , and a second surface disposed opposite to the first surface [claim 1], wherein the second surface of the metal reinforcing layer has a recess portion (37) [claim 2], wherein a position of the convex portion of the first surface of the metal reinforcing layer and a position of the recess portion of the second surface of the metal reinforcing layer correspond to each other (figure 1) [claim 3], wherein the convex portion is disposed in a quantity of at least two (figure 1) [claim 4], wherein the first surface of the metal reinforcing layer contacts a first surface of the adhesive layer (figure 1) [claim 5], wherein the first surface of the adhesive layer has a recess portion (31A) that corresponds to the convex portion of the first surface of the metal reinforcing layer [claim 6], wherein the convex portion of the metal reinforcing layer has a dome shape (figure 1) [claim 7], wherein the convex portion of the metal reinforcing layer has a rectangular pillar shape [claim 8], wherein the substrate portion comprises: a first protective layer disposed on a first surface of the adhesive layer; a first connection pad disposed in the first protective layer; a first insulation layer disposed on the first protective layer; and a first circuit wire disposed in the first insulation layer ([0037]) [claim 9], wherein the substrate portion further comprises a first via layer disposed in the first insulation layer and connected to the first circuit wire ([0037]-[0039]) [claim 10], wherein the substrate portion further comprises a cavity (29A, 29B), and at least a portion of the cavity (29A) is disposed in the first insulation layer [claim 11], wherein the cavity extends to the first protective layer [claim 12], wherein the substrate portion comprises: a core layer (27) disposed opposite to the metal reinforcing layer with respect to the adhesive layer; a first insulation layer disposed between the adhesive layer and the core layer; a second insulation layer disposed opposite to the first insulation layer with respect to the core layer; a first circuit wire disposed in the first insulation layer; and a second circuit wire disposed in the second insulation layer ([0037]-[0039]) [claim 13], wherein the substrate portion further comprises: a first connection pad disposed opposite to the core layer with respect to the first insulation layer, and disposed on a surface of the first insulation layer; and a second connection pad disposed opposite to the core layer with respect to the second insulation layer, and disposed on a surface of the second insulation layer ([0037]-[0039]) [claim 14], wherein the substrate portion further comprises: a first via layer (29A) disposed in the first insulation layer; and a second via layer (29B) disposed in the second insulation layer [claim 15], wherein the substrate portion further comprises: a first protective layer disposed opposite to the core layer with respect to the first insulation layer, and disposed to embed at least a portion of the first connection pad; and a second protective layer disposed opposite to the core layer with respect to the second insulation layer, and disposed to embed at least a portion of the second connection pad [claim 16].
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JEREMY C NORRIS whose telephone number is (571)272-1932. The examiner can normally be reached 7:15-15:15 M-F.
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JEREMY C. NORRIS
Examiner
Art Unit 2847
/JEREMY C NORRIS/Primary Examiner, Art Unit 2847