DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of claims 1-15 in the reply filed on 8/7/26 is acknowledged.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-3,10-14 is/are rejected under 35 U.S.C. 102(a1) as being anticipated by Shih US 2018/0102311.
Regarding claim 1, Shih discloses and shows in Fig. 1-14, a method of manufacturing an electronic device (1a, Fig. 14, [0055]), the method comprising: providing internal interconnects (510, Fig. 14, [0040]) and a bridge assembly (101, Fig. 14, [0029]), wherein the bridge assembly (101, Fig. 14, [0029]) comprises a bridge base (300, Fig. 10, [0031]) and a bridge signal redistribution structure (101, Fig. 14, [0029]); encapsulating (with 550) (550, Fig. 14, [0039]) the internal interconnects (510, Fig. 14, [0040]) and the bridge assembly (200, Fig. 14, [0025]) in a lower encapsulant (550, Fig. 14, [0039]); removing the bridge base (300, Fig. 10, [0031]) from the bridge assembly; covering an upper side of the lower encapsulant with an upper substrate (700, Fig. 10, [0041]) such that an upper substrate conductive structure (700, Fig. 10, [0041]) is coupled to the internal interconnects (510, Fig. 10, [0040]) and to the bridge signal redistribution structure (200, Fig. 14, [0025]); coupling, via the upper substrate (700), first interconnects (111, Fig. 14, [0051]) of a first electronic component (11, Fig. 14, [0051]) to the bridge signal redistribution structure (200, Fig. 14, [0025]) and second interconnects (918, Fig. 14, [0051]) of the first electronic component (11, Fig. 14, [0051]) to the internal interconnects (510, Fig. 14, [0040]); and coupling, via the upper substrate, first interconnects (121, Fig. 14, [0051]) of a second electronic component (12, Fig. 14, [0051]) to the bridge signal redistribution structure (200, Fig. 14, [0025]) and second interconnects (918, Fig. 14, [0051]) of the second electronic component (12, Fig. 14, [0051]) to the internal interconnects (510, Fig. 14, [0040]).
Regarding claim 2, Shih discloses and shows in Fig. 1-14, a method, wherein the removing the bridge base (300, Fig. 10, [0031]) comprises grinding (300, Fig. 10, [0031, 0040] (grinding)) lower sides of the internal interconnects (Fig. 10, [0031, 0040] (grinding)), a lower side of the lower encapsulant, and a lower side of the bridge assembly to remove a lower portion of the internal interconnects (Fig. 10, [0031, 0040] (grinding)), a lower portion of the lower encapsulant, and a lower portion of the bridge assembly (300, Fig. 10, [0031, 0040] (grinding))
Regarding claim 3, Shih discloses and shows in Fig. 1-14, a method, wherein the lower portion of the bridge assembly includes the bridge base (300, Fig. 10, [0031, 0040]).
Regarding claim 10, Shih discloses and shows in Fig. 1-14, a method wherein coupling the first interconnects (111, Fig. 14, [0051]) of the first electronic component (11, Fig. 14, [0051]) to the bridge signal redistribution structure (200, Fig. 14, [0025]) and coupling the first interconnects (111, Fig. 14, [0051]) of the second electronic component (12, Fig. 14, [0051]) to the bridge signal redistribution structure (200, Fig. 14, [0025]) couples one or more of the first interconnects (111, Fig. 14, [0051]) of the first electronic component (11, Fig. 14, [0051]) to one or more of the first interconnects (111, Fig. 14, [0051]) of the second electronic component (12, Fig. 14, [0051]).
Regarding claim 11, Shih discloses and shows in Fig. 1-14, a method, comprising providing external interconnects (810, Fig. 14, [0052]) coupled to lower sides of the internal interconnects (510, Fig. 14, [0040]).
Regarding claim 12, Shih discloses and shows in Fig. 1-14, a method comprising covering a lower side of the lower encapsulant (550, Fig. 14, [0039]) with a lower substrate (700, Fig. 14, [0055]) such that a lower substrate (700, Fig. 14, [0055]) conductive structure is coupled to the internal interconnects (510, Fig. 14, [0040]) and the bridge signal redistribution structure (200, Fig. 14, [0025]).
Regarding claim 13, Shih discloses and shows in Fig. 1-14, a method comprising providing external interconnects (810, Fig. 14, [0052]) coupled to lower sides of the internal interconnects (510, Fig. 14, [0040]) via the lower substrate (700, Fig. 14, [0055]).
Regarding claim 14, Shih discloses and shows in Fig. 1-14, a method, comprising encapsulating (with 550) (550, Fig. 14, [0039]) the first electronic component (11, Fig. 14, [0051]) and the second electronic component (12, Fig. 14, [0051]) in an upper encapsulant (Fig. 14, [0053](electronics will be covered by a molding)).
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim(s) 4-9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Shih as applied to claims 1-3,10-14, and further in view of Wu et al., (Wu) US 2021/0098421.
Regarding claim 4, Shih discloses and shows in Fig. 1-14, a method, wherein the removing the bridge base (300, Fig. 10, [0031, 0040]).
Shih differs from the claimed invention because he does not explicitly disclose a device having a method that comprises grinding upper sides of the internal interconnects, an upper side of the lower encapsulant, and an upper side of the bridge assembly to remove an upper portion of the internal interconnects, an upper portion of the lower encapsulant, and an upper portion of the bridge assembly.
Wu discloses a method that comprises grinding upper sides of the internal interconnects (Fig. 5A-5C, [0063-0069](grinding 432,432b,140)), an upper side of the lower encapsulant (Fig. 5A-5C, [0063-0069](grinding 432,432b,140)), and an upper side of the bridge assembly to remove an upper portion of the internal interconnects (Fig. 5A-5C, [0063-0069](grinding 432,432b,140)), an upper portion of the lower encapsulant (Fig. 5A-5C, [0063-0069](grinding 432,432b,140)), and an upper portion of the bridge assembly (Fig. 5A-5C, [0063-0069](grinding 432,432b,140)).
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Regarding claim 5, Shih, in view of Wu discloses, a method wherein the upper portion of the bridge assembly (Fig. 5A-5C, [0063-0069] (assembly 432,432b,140)) includes the bridge base.
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Regarding claim 6, Shih discloses and shows in Fig. 1-14, a method, wherein the removing the bridge base (300, Fig. 10, [0031, 0040]).
Shih differs from the claimed invention because he does not explicitly disclose a device having a method of etching lower sides of the internal interconnects, a lower side of the lower encapsulant, and a lower side of the bridge assembly to remove a lower portion of the internal interconnects, a lower portion of the lower encapsulant, and a lower portion of the bridge assembly.
Wu discloses a method of etching lower sides of the internal interconnects (510, Fig. 5A-5C)[0063-0069]), a lower side of the lower encapsulant (550, Fig. 5A-5C)[0063-0069]), and a lower side of the bridge assembly (101, Fig. 9,13)[0040]) to remove a lower portion of the internal interconnects (510, Fig. 5A-5C)[0063-0069]), a lower portion of the lower encapsulant (550, Fig. 5A-5C)[0063-0069]), and a lower portion of the bridge assembly (101, Fig. 9,13)[0040]).
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Regarding claim 7, Shih, in view of Wu discloses, a method wherein the lower portion of the bridge assembly (101, Fig. 9,13) [0040]) includes the bridge base.
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Regarding claim 8, Shih discloses and shows in Fig. 1-14, a method, wherein the removing the bridge base (300, Fig. 10, [0031, 0040]).
Shih differs from the claimed invention because he does not explicitly disclose a device having a method of etching upper sides of the internal interconnects, an upper side of the lower encapsulant, and an upper side of the bridge assembly to remove an upper portion of the internal interconnects, an upper portion of the lower encapsulant, and an upper portion of the bridge assembly.
Wu discloses a method of etching upper sides of the internal interconnects (510, Fig. 5A-5C)[0063-0069]), an upper side of the lower encapsulant (550, Fig. 5A-5C)[0063-0069]), and an upper side of the bridge assembly to remove an upper portion of the internal interconnects, an upper portion of the lower encapsulant (550, Fig. 5A-5C)[0063-0069]), and an upper portion of the bridge assembly (101, Fig. 9,13)[0040]).
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Regarding claim 9, Shih, in view of Wu discloses, a method wherein the upper portion of the bridge assembly (Fig. 5A-5C, [0063-0069] (assembly 432,432b,140)) includes the bridge base (Fig. 5A-5C, [0063-0069] (assembly 432,432b,140)).
Wu is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of Wu in the device of Shih because it would improve the planarity (e.g., flatness) of the underlying structure [0044].
Claim(s) 15 is/are rejected under 35 U.S.C. 103 as being unpatentable over Shih as applied to claims 1-3,10-14, and further in view of We et al., (We) US 2016/0141234.
Regarding claim 15, Shih, in view of Wu discloses, a first (11, Fig. 14, [0051]) and second (12, Fig. 14, [0051]) electronic component.
Shih differs from the claimed invention because he does not explicitly disclose a method comprising providing an underfill between a lower side of the first electronic component and an upper side of the upper substrate.
We discloses [0069] a method comprising providing an underfill (Fig. 2, (250) [0069]) between a lower side of the first electronic component (Fig. 2, (206) [0069]) and an upper side of the upper substrate.
We is evidence that ordinary workers skilled in the art would find reasons, suggestions or motivations to modify the device of Shih. Therefore, at the time the invention was made; It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use the teaching of We in the device of Shih because it would provide a device with high density interconnects [0007].
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MARC-ANTHONY ARMAND whose telephone number is (571)272-5178. The examiner can normally be reached 8am-5pm.
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MARC - ANTHONY ARMAND
Primary Examiner
Art Unit 2813
/MARC-ANTHONY ARMAND/Primary Examiner, Art Unit 2813
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