Tech Center 3600 • Art Units: 2800 2813 2814 3646
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18636601 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18582847 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18585678 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18623118 | SEMICONDUCTOR DIE HAVING A DIE INTERCONNECT AND A DIE LEVEL DISTRIBUTION (DLD) METALLIZATION LAYER INCLUDING A METAL LINE AND A METAL PAD HAVING A WIDTH GREATER THAN THE WIDTH OF THE METAL LINE FOR IMPROVED SIGNAL PATH CONDUCTIVITY BETWEEN THE DIE INTERCONNECT AND THE METAL PAD | Non-Final OA | QUALCOMM Incorporated |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Final Rejection | Intel Corporation |
| 18834279 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18753858 | SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD | Non-Final OA | Texas Instruments Incorporated |
| 18648632 | STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION | Non-Final OA | Texas Instruments Incorporated |
| 18010011 | MICRO-ELECTROMECHANICAL SYSTEM (MEMS) INCLUDING TANTALUM AS A STRUCTURAL MATERIAL | Non-Final OA | Carnegie Mellon University |
| 18582702 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18774042 | Dual Purpose Millimeter Wave Frequency Band Transmitter | Non-Final OA | Advanced Micro Devices, Inc. |
| 18698955 | MONOLITHIC MULTI-WAVELENGTH OPTICAL DEVICES | Non-Final OA | Analog Devices, Inc. |
| 18514770 | INTEGRATED CIRCUIT INCLUDING A PASSIVE COMPONENT IN AN INTERCONNECTION PART, AND CORRESPONDING MANUFACTURING METHOD | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
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