Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2800 2813 2814 3646
This examiner grants 83% of resolved cases
Marc Anthony Armand is an examiner in Tech Center 3600 and Art Unit 2800. He has 1079 resolved cases, maintaining an allowance rate of 83.5 percent. This 83.5 percent rate provides a metric for applicants to evaluate the frequency of patent grants. With 1079 resolved cases, the data offers a historical record for practitioners to analyze when developing their prosecution strategy.
The data shows an interview lift of 4.1 percent, which is a statistic that describes the change in allowance probability following an interview. This 4.1 percent lift is a data point for practitioners to consider. The median days to allowance is 883, providing a benchmark for the expected duration of the prosecution cycle. This 883-day median is a key figure for managing the timeline for patent issuance. These figures from Tech Center 3600 and Art Unit 2800 serve as the basis for understanding the examiner's performance and efficiency.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18673973 | POLARIZING MEMBER AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18585678 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18623118 | SEMICONDUCTOR DIE HAVING A DIE INTERCONNECT AND A DIE LEVEL DISTRIBUTION (DLD) METALLIZATION LAYER INCLUDING A METAL LINE AND A METAL PAD HAVING A WIDTH GREATER THAN THE WIDTH OF THE METAL LINE FOR IMPROVED SIGNAL PATH CONDUCTIVITY BETWEEN THE DIE INTERCONNECT AND THE METAL PAD | Non-Final OA | QUALCOMM Incorporated |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Final Rejection | Intel Corporation |
| 18780059 | BOTTOM-UP METAL NITRIDE FORMATION | Non-Final OA | ASM IP Holding B.V. |
| 18834279 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18779906 | Mixed Multiple Input Multiple Output (MIMO) Radar | Non-Final OA | Aurora Operations, Inc. |
| 18584044 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18753858 | SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD | Non-Final OA | Texas Instruments Incorporated |
| 18648632 | STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION | Non-Final OA | Texas Instruments Incorporated |
| 18514770 | INTEGRATED CIRCUIT INCLUDING A PASSIVE COMPONENT IN AN INTERCONNECTION PART, AND CORRESPONDING MANUFACTURING METHOD | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18677191 | INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18582702 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18790354 | DEVICES AND METHODS FOR ENHANCING INSERTION LOSS PERFORMANCE OF AN ANTENNA SWITCH | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18822512 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18774315 | SEMICONDUCTOR MODULE | Non-Final OA | ROHM CO., LTD. |
| 18774042 | Dual Purpose Millimeter Wave Frequency Band Transmitter | Non-Final OA | Advanced Micro Devices, Inc. |
| 18811225 | GAN EPITAXIAL SUBSTRATE | Non-Final OA | Mitsubishi Chemical Corporation |
| 18886493 | SEMICONDUCTOR DEVICE | Non-Final OA | Socionext Inc. |
| 18413859 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT STRUCTURE AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18801310 | IMAGE SENSOR AND IMAGE SENSOR MANUFACTURING METHOD | Non-Final OA | OMNIVISION TECHNOLOGIES, INC. |
| 18621338 | PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18472122 | DYNAMIC RANDOM-ACCESS MEMORY DEVICE AND METHOD OF FABRICATING SAME | Final Rejection | IMEC VZW |
| 18671474 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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