Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
1. In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
2. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
3. A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
4. Claims 1-6 and 8-13 is rejected under 35 U.S.C. 102(a)(2) as being anticipated by Ide et al. (World Intellectual Property Organization (WIPO) WO 2020/196764 A1), hereinafter Ide.
5. Regarding Claims 1-6 and 8-13, Ide teaches (Paragraphs [0123 and 0131-0168], Table 1, Claims 1-15) a photosensitive resin composition, therein a negative photosensitive resin composition. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition comprising a polyimide resin. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) wherein, in a case where a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours is subjected to a dynamic viscoelasticity measurement under the following conditions, a storage elastic modulus E'220 at 220°C is 0.5 to 3.0 GPa, [conditions] frequency: 1 Hz, temperature: 30°C to 300°C, heating rate: 5 °C/min, measurement mode: tensile mode. Herein, MPEP § 2112.01(I) states: “Where the claimed and prior art products are identical or substantially identical in structure or composition, or are produced by identical or substantially identical processes, a prima facie case of either anticipation or obviousness has been established. In re Best, 562 F.2d 1252, 1255, 195 USPQ 430, 433 (CCPA 1977).” Furthermore, MPEP § 2112.01(II) states: “’Products of identical chemical composition can not have mutually exclusive properties.’ In re Spada, 911 F.2d 705, 709, 15 USPQ2d 1655, 1658 (Fed. Cir. 1990). A chemical composition and its properties are inseparable. Therefore, if the prior art teaches the identical chemical structure, the properties applicant discloses and/or claims are necessarily present. Id.” Thus, given that the photosensitive resin composition of Claim 1 of the chemical composition merely comprises a polyimide resin and/or polyamide resin and Ide teaches a photosensitive resin composition comprising a polyimide resin, a prima facie case of anticipation has been established with regards to wherein a cured film from the photosensitive resin composition and its subsequent dynamic viscoelasticity measurement. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) wherein, in a case where a glass transition temperature of the cured film is denoted as Tg [°C], a coefficient of thermal expansion of the cured film in a temperature region from Tg - 50 [°C] to Tg - 20 [°C] is denoted as CTE1, and a coefficient of thermal expansion of the cured film in a temperature region from Tg + 20 [°C] to Tg + 50 [°C] is denoted as CTE2, a value of CTE2/CTE1 is 1 to 10. See above with regards to the dynamic viscoelasticity measurement of a cured film formed from a photosensitive resin composition and said rationale extends to the measurement of glass transition temperature. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) wherein the photosensitive resin composition contains a polyimide resin having an imide ring structure, therein a maleimide structure or any of diamine compounds 1-3. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition further comprising a polyfunctional (meth)acrylate compound, therein tris (2-acryloyloxyethyl) isocyanurate. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition further comprising a photosensitizing agent, therein a photopolymerization initiator (C) and a photoradical polymerization initiator, such as ("Omnirad 184"). Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitizing agent includes a photoradical generator, therein a photopolymerization initiator (C) and a photoradical polymerization initiator, such as ("Omnirad 184"). Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition further comprising an epoxy resin, therein 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition wherein the polyamide resin and/or the polyimide resin is dissolved in a solvent, therein propylene glycol-1-monomethyl ether-2-acetate (PGMEA), to be in a form of a varnish. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the photosensitive resin composition is used for forming an insulating layer in an electronic device, therein an insulating cured film in a semiconductor, a display, an electronic circuit board, or the like. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) a manufacturing method of an electronic device. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the manufacturing method of an electronic device comprising a film forming step of forming a photosensitive resin film over a substrate using the photosensitive resin composition. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the manufacturing method of an electronic device comprising an exposure step of exposing the photosensitive resin film. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the manufacturing method of an electronic device comprising a development step of developing the exposed photosensitive resin film. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the manufacturing method of an electronic device comprising a thermosetting step of heating and curing the exposed photosensitive resin film after the development step, therein post-baking. Ide teaches (Paragraphs [0123 and 0131-0171], Table 1, Claims 1-15) the manufacturing method of an electronic device comprising a cured film of the photosensitive resin composition.
Claim Rejections - 35 USC § 103
6. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
7. A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
8. Claim 17 is rejected under 35 U.S.C. 103 as being unpatentable over Ide et al. (World Intellectual Property Organization (WIPO) WO 2020/196764 A1), hereinafter Ide, in view of Kawabata et al. (World Intellectual Property Organization (WIPO) WO 2017/104672 A1), hereinafter Kawabata.
9. Regarding Claim 7, Ide teaches all limitations of Claim 1 above. However, Ide fails to explicitly teach the photosensitive resin composition further comprising a thermal radical initiator.
10. Ide teaches (Abstract, Claim 15) a photosensitive resin composition comprising a polyimide that coats a substrate, irradiated, and developed. Kawabata teaches (Paragraphs [0084 and 0264]) a photosensitive resin composition comprising a polyimide that coats a substrate, irradiated, and developed. Kawabata teaches (Paragraphs [0197-0198]) a thermal radical initiator, therein a thermal radical polymerization initiator. Kawabata teaches (Paragraph [0197]) the use of a thermal radical initiator results in an increased heat resistance.
11. It would have been prima facie obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified Ide to incorporate the teachings of Kawabata wherein the photosensitive resin composition further comprises a thermal radical initiator. Doing so would result in improved heat resistance, as recognized by Kawabata.
Conclusion
12. Any inquiry concerning this communication should be directed to RICHARD D CHAMPION at telephone number (571) 272-0750. The examiner can normally be reached on 8 a.m. - 5 p.m. Mon-Fri EST.
13. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, KEITH D HENDRICKS can be reached at (571) 272-1401. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/RICHARD DAVID CHAMPION/Examiner, Art Unit 1737
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