Tech Center 1700 • Art Units: 1737 1746
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17219818 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | Non-Final OA | FUJIFILM Corporation |
| 17599093 | POSITIVE TYPE RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 18232717 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18133933 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 16520210 | EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 16465097 | POSITIVE PHOTOSENSITIVE COMPOSITION, PATTERN USING SAME, AND METHOD OF MANUFACTURING PATTERN | Non-Final OA | ADEKA CORPORATION |
| 18514551 | PHOTOCURABLE COMPOSITIONS | Non-Final OA | Henkel AG & Co. KGaA |
| 17927476 | RESIST UNDERLAYER FILM- FORMING COMPOSITION USING DIARYLMETHANE DERIVATIVE | Final Rejection | NISSAN CHEMICAL CORPORATION |
| 17777382 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 17754247 | NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMATION METHOD, CURED FILM, CURED FILM PRODUCTION METHOD, AND ROLLED BODY | Non-Final OA | Tokyo Ohka Kogyo Co., Ltd. |
| 17860224 | METHOD OF STRIPPING PHOTORESIST | Non-Final OA | CHIPBOND TECHNOLOGY CORPORATION |
| 17020008 | PHOTORESIST FOR EUV AND/OR E-BEAM LITHOGRAPHY | Final Rejection | IMEC VZW |
| 17462216 | PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS | Non-Final OA | ROHM AND HAAS ELECTRONIC MATERIALS LLC |
| 16731666 | POLYMERS AND PHOTORESIST COMPOSITIONS | Non-Final OA | ROHM AND HAAS ELECTRONIC MATERIALS LLC |
| 18349504 | MULTI-LAYERED MOLECULAR FILM PHOTORESIST HAVING MOLECULAR LINE STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | HUNETPLUS CO., LTD. |
| 16612962 | POLY-P-HYDROXYSTYRENE EPOXY RESINS, SYNTHESIS AND APPLICATION THEREOF | Final Rejection | HUBEI GURUN TECHNOLOGY CO., LTD |
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