Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1715 1737 1746
This examiner grants 46% of resolved cases
Richard David Champion is an examiner in Tech Center 1700 and Art Unit 1715. The data includes 127 resolved cases. The allowance rate is 45.7 percent, which indicates the frequency of granted patents. The median days to allowance is 1395, serving as a benchmark for the duration of the grant process. This 1395 day figure is a key timing metric for applicants.
The interview lift is 11.9 percent. This figure suggests that an interview is associated with an 11.9 percent change in the probability of allowance. With 127 resolved cases, this lift provides a look at the impact of verbal communication. The 45.7 percent allowance rate and the 1395 median days to allowance are the primary figures for developing a prosecution strategy.
The Art Unit 1715 designation and the Tech Center 1700 location form the basis for the current statistical profile. The 45.7 percent allowance rate provides a baseline for success, while the 11.9 percent interview lift highlights the impact of direct negotiation. These 127 resolved cases define the current data for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18483911 | POLYCARBOXYLATE COMPOUND, RESIST COMPOSITION COMPRISING THE SAME AND METHOD OF FORMING PATTERN USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17442835 | THIN FILM RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 16958769 | A NEGATIVE TONE LIFT OFF RESIST COMPOSITION COMPRISING AN ALKALI SOLUBLE RESIN AND CROSS LINKERS AND A METHOD FOR MANUFACTURING METAL FILM PATTERNS ON A SUBSTRATE | Non-Final OA | Merck Patent GmbH |
| 16757435 | METHOD OF MANUFACTURING HIGH-DEFINED PATTERN AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME | Final Rejection | Merck Patent GmbH |
| 18475635 | LAMINATE AND MANUFACTURING METHOD OF LAMINATE | Final Rejection | FUJIFILM Corporation |
| 18337931 | LAMINATE FOR FORMING IMAGE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Final Rejection | FUJIFILM Corporation |
| 17896712 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 17591943 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 18384038 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, AND COLOR FILTER | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18473132 | SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18514551 | PHOTOCURABLE COMPOSITIONS | Final Rejection | Henkel AG & Co. KGaA |
| 18580803 | TEMPLATE SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Non-Final OA | KYOCERA Corporation |
| 17737810 | PHOTORESIST COMPOSITION AND METHODS OF USE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18547637 | PHOTOCURABLE COMPOSITION AND PATTERN-FORMING METHOD | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 17777382 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18493972 | POLYMER, PHOTOSENSITIVE COMPOSITION, DRY FILM PHOTORESIST, AND LITHOGRAPHY METHOD | Final Rejection | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
| 18197234 | ONIUM SALT COMPOUND, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18271038 | PHOTO TREATMENT DEVICE | Final Rejection | Ushio Denki Kabushiki Kaisha |
| 18270256 | RADIATION-SENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN | Final Rejection | JSR CORPORATION |
| 17506740 | PHOTOSENSITIVE RESIN COMPOSITION | Final Rejection | JSR CORPORATION |
| 17020008 | PHOTORESIST FOR EUV AND/OR E-BEAM LITHOGRAPHY | Non-Final OA | IMEC VZW |
| 18348374 | PHOTOSENSITIVE COMPOSITION, AND CURED FILM | Final Rejection | JNC CORPORATION |
| 18344883 | RESIN COMPOSITION, CURED FILM AND COLOR FILTER | Final Rejection | Advanced Echem Materials Company Limited |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy