Tech Center 1700 • Art Units: 1737 1746
This examiner grants 44% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18337931 | LAMINATE FOR FORMING IMAGE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Non-Final OA | FUJIFILM Corporation |
| 17591943 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 17219818 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | Final Rejection | FUJIFILM Corporation |
| 18133933 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 19191989 | LITHOGRAPHICALLY PATTERNED ELECTRICALLY CONDUCTIVE HYDROGELS, PHOTO-CURABLE COMPOSITIONS, AND ELASTOMERS FORMED FROM SUCH COMPOSITIONS | Non-Final OA | The Board of Trustees of the Leland Stanford Junior University |
| 17599093 | POSITIVE TYPE RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 18212764 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 16465097 | POSITIVE PHOTOSENSITIVE COMPOSITION, PATTERN USING SAME, AND METHOD OF MANUFACTURING PATTERN | Non-Final OA | ADEKA CORPORATION |
| 17777382 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Non-Final OA | TOKYO OHKA KOGYO CO., LTD. |
| 18514551 | PHOTOCURABLE COMPOSITIONS | Non-Final OA | Henkel AG & Co. KGaA |
| 17860224 | METHOD OF STRIPPING PHOTORESIST | Non-Final OA | CHIPBOND TECHNOLOGY CORPORATION |
| 18268800 | RESIST UNDERLAYER FILM FORMATION COMPOSITION | Non-Final OA | NISSAN CHEMICAL CORPORATION |
| 17927476 | RESIST UNDERLAYER FILM- FORMING COMPOSITION USING DIARYLMETHANE DERIVATIVE | Final Rejection | NISSAN CHEMICAL CORPORATION |
| 17020008 | PHOTORESIST FOR EUV AND/OR E-BEAM LITHOGRAPHY | Final Rejection | IMEC VZW |
| 17506740 | PHOTOSENSITIVE RESIN COMPOSITION | Non-Final OA | JSR CORPORATION |
| 17440238 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD | Final Rejection | Showa Denko Materials Co., Ltd. |
| 16612962 | POLY-P-HYDROXYSTYRENE EPOXY RESINS, SYNTHESIS AND APPLICATION THEREOF | Final Rejection | HUBEI GURUN TECHNOLOGY CO., LTD |
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