Tech Center 1700 • Art Units: 1715 1737 1746
This examiner grants 45% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18476975 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18337931 | LAMINATE FOR FORMING IMAGE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Final Rejection | FUJIFILM Corporation |
| 17896712 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 17591943 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Final Rejection | FUJIFILM Corporation |
| 17219818 | CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY | Non-Final OA | FUJIFILM Corporation |
| 18509184 | METAL CONTAINING PHOTORESIST DEVELOPER COMPOSITION, AND METHOD OF FORMING PATTERNS INCLUDING STEP OF DEVELOPING USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 19191989 | LITHOGRAPHICALLY PATTERNED ELECTRICALLY CONDUCTIVE HYDROGELS, PHOTO-CURABLE COMPOSITIONS, AND ELASTOMERS FORMED FROM SUCH COMPOSITIONS | Non-Final OA | The Board of Trustees of the Leland Stanford Junior University |
| 18580803 | TEMPLATE SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD AND MANUFACTURING APPARATUS THEREOF, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Non-Final OA | KYOCERA Corporation |
| 18197234 | ONIUM SALT COMPOUND, POLYMER, RESIST COMPOSITION, AND PATTERNING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18232717 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17737810 | PHOTORESIST COMPOSITION AND METHODS OF USE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 16870704 | PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18030668 | PHOTOSENSITIVE RESIN MULTILAYER BODY | Final Rejection | ASAHI KASEI KABUSHIKI KAISHA |
| 17599093 | POSITIVE TYPE RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 17442835 | THIN FILM RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST FILM USING THE SAME | Non-Final OA | Merck Patent GmbH |
| 16958769 | A NEGATIVE TONE LIFT OFF RESIST COMPOSITION COMPRISING AN ALKALI SOLUBLE RESIN AND CROSS LINKERS AND A METHOD FOR MANUFACTURING METAL FILM PATTERNS ON A SUBSTRATE | Non-Final OA | Merck Patent GmbH |
| 16651110 | POSITIVE TYPE PHOTOSENSITIVE SILOXANE COMPOSITION AND CURED FILM USING THE SAME | Final Rejection | Merck Patent GmbH |
| 18514551 | PHOTOCURABLE COMPOSITIONS | Final Rejection | Henkel AG & Co. KGaA |
| 18271038 | PHOTO TREATMENT DEVICE | Final Rejection | Ushio Denki Kabushiki Kaisha |
| 18014130 | FILM FORMING COMPOSITION FOR LITHOGRAPHY, RESIST PATTERN FORMATION METHOD, AND CIRCUIT PATTERN FORMATION METHOD | Non-Final OA | Mitsubishi Gas Chemical Company, Inc. |
| 18560234 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Non-Final OA | Resonac Corporation |
| 17020008 | PHOTORESIST FOR EUV AND/OR E-BEAM LITHOGRAPHY | Non-Final OA | IMEC VZW |
| 18445668 | PHOTOSENSITIVE RESIN LAMINATE AND APPLICATION THEREOF | Final Rejection | CHANG CHUN PLASTICS CO., LTD. |
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