Prosecution Insights
Last updated: May 29, 2026

Examiner: CHAMPION, RICHARD DAVID

Tech Center 1700 • Art Units: 1737 1746

This examiner grants 44% of resolved cases

Performance Statistics

44.2%
Allow Rate
-20.8% vs TC avg
164
Total Applications
+9.2%
Interview Lift
1388
Avg Prosecution Days
Based on 120 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
13.5%
§102 Novelty
85.6%
§103 Obviousness
0.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17219818 CHEMICAL LIQUID AND CHEMICAL LIQUID STORAGE BODY Non-Final OA FUJIFILM Corporation
17599093 POSITIVE TYPE RESIST COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN USING THE SAME Non-Final OA Merck Patent GmbH
18232717 PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18133933 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
16870704 PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
16520210 EXTREME ULTRAVIOLET MASK AND METHOD OF MANUFACTURING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
16465097 POSITIVE PHOTOSENSITIVE COMPOSITION, PATTERN USING SAME, AND METHOD OF MANUFACTURING PATTERN Non-Final OA ADEKA CORPORATION
18514551 PHOTOCURABLE COMPOSITIONS Non-Final OA Henkel AG & Co. KGaA
17927476 RESIST UNDERLAYER FILM- FORMING COMPOSITION USING DIARYLMETHANE DERIVATIVE Final Rejection NISSAN CHEMICAL CORPORATION
17777382 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN Final Rejection TOKYO OHKA KOGYO CO., LTD.
17754247 NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIST FILM, PATTERN FORMATION METHOD, CURED FILM, CURED FILM PRODUCTION METHOD, AND ROLLED BODY Non-Final OA Tokyo Ohka Kogyo Co., Ltd.
17860224 METHOD OF STRIPPING PHOTORESIST Non-Final OA CHIPBOND TECHNOLOGY CORPORATION
17020008 PHOTORESIST FOR EUV AND/OR E-BEAM LITHOGRAPHY Final Rejection IMEC VZW
17462216 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS Non-Final OA ROHM AND HAAS ELECTRONIC MATERIALS LLC
16731666 POLYMERS AND PHOTORESIST COMPOSITIONS Non-Final OA ROHM AND HAAS ELECTRONIC MATERIALS LLC
18349504 MULTI-LAYERED MOLECULAR FILM PHOTORESIST HAVING MOLECULAR LINE STRUCTURE AND METHOD FOR MANUFACTURING SAME Non-Final OA HUNETPLUS CO., LTD.
16612962 POLY-P-HYDROXYSTYRENE EPOXY RESINS, SYNTHESIS AND APPLICATION THEREOF Final Rejection HUBEI GURUN TECHNOLOGY CO., LTD

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