Prosecution Insights
Last updated: April 19, 2026
Application No. 18/686,752

HEAT-DISSIPATING MAGNETIC FIELD SHIELDING SHEET AND ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING SAME

Non-Final OA §103
Filed
Jun 14, 2024
Examiner
LEE, WILSON
Art Unit
2844
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Amosense Co. Ltd.
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
2y 9m
To Grant
90%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allow Rate
564 granted / 651 resolved
+18.6% vs TC avg
Minimal +3% lift
Without
With
+3.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
21 currently pending
Career history
672
Total Applications
across all art units

Statute-Specific Performance

§101
20.8%
-19.2% vs TC avg
§103
29.6%
-10.4% vs TC avg
§102
26.0%
-14.0% vs TC avg
§112
12.0%
-28.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 651 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections – 35 U.S.C. 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1, 3, 10, 11 is/are rejected under 35 U.S.C. 103 as being unpatentable over (2015/0116178) in view of Woo (2023/0077474). Regarding Claim 1, Kim et al. (2015/0116178) discloses a heat-dissipating magnetic field shielding sheet (heat dissipation sheet serves to dissipate heat, paragraph [0055], figs. 2-4), comprising: a heat-dissipating magnetic field shielding unit (protective sheet 130, paragraph [0070]), having: a heat-dissipating adhesive member (variety by means such as adhesive a double side tape, laminating or thermal pressing, paragraph [0053]) disposed between adjacent magnetic layers (the first absorbing sheet 110 and the second absorbing sheet 120, paragraph [0049]) to improve heat transfer (heat dissipation sheet serves to dissipate heat, paragraph [0055]) in the thickness direction (across the absorbers and other sheets, figs. 2-4) of a magnetic field shielding unit (iron sheet 140 removes eddy current loss caused by the formation of a magnetic field, paragraph [0055]). As discussed above, Kim essentially discloses the claimed invention but does not explicitly disclose a plurality of magnetic layers having at least one eddy current reduction pattern part formed thereon. However, Woo (2023/0077474) discloses a plurality of magnetically soft along with electrically conductive layer(s) (paragraph [0083]) having at least one eddy current reduction pattern part formed thereon (to reduce eddy current induced by magnetic fields to enhance transfer efficiency and/or Q factor of wireless charging system, paragraph [0083]). It would have been obvious to one of ordinary skill in the art to have provided a plurality of magnetic conductive layers to reduce eddy current induced by magnetic fields (paragraph [0083]) in Kim in order to enhance the transfer efficiency and/or Q factor of wireless charging system as taught by Woo. Regarding Claim 3, Kim discloses that magnetic layer is a magnetic alloy ribbon sheet comprising transition metals (alloy, paragraphs [0040], [0042]) but does not explicitly disclose that it is soft. However, Woo teaches soft magnetic layer (paragraphs [0126], [0128]). It would have been obvious to one of ordinary skill in the art to have provided soft magnetic alloy ribbon sheet as the magnetic layer in Kim in order to attain flexibility as taught by Woo. Regarding Claim 10, Kim discloses the heat-dissipating magnetic field shielding sheet of claim 1, wherein the heat-dissipating adhesive member is made of a heat-dissipating adhesive layer in which a heat dissipation filler in a binder matrix is dispersed, or is a heat dissipating double-sided tape having the heat-dissipating adhesive layer on both surfaces of a base material (variety by means such as adhesive a double side tape, laminating or thermal pressing, paragraph [0053]). Regarding Claim 11, Kim discloses the heat-dissipating magnetic field shielding sheet of claim 10, wherein the heat dissipation filler comprises one or more of carbon-based components, metal components (metal-based ferromagnetic material, paragraph [0040]), and ceramic components. Claim(s) 2, 4, 14, 15, 16 is/are rejected under 35 U.S.C. 103 as being unpatentable over (2015/0116178) in view of Woo (2023/0077474) further in view of Jang (2022/0368169). Regarding Claim 2, Kim in view of Woo essentially discloses the claimed invention but does not explicitly disclose the heat-dissipating magnetic field shielding sheet of claim 1, wherein the heat-dissipating magnetic field shielding sheet is a magnetic field shielding sheet arranged on one surface of an antenna (paragraph [0083]), the antenna comprising: a hollow portion having a predetermined area in the center and a pattern part surrounding the hollow portion, wherein the eddy current reduction pattern part is provided at a position corresponding to a region in which the pattern part is disposed. However, Jang discloses the heat-dissipating magnetic field shielding sheet is a magnetic field shielding sheet (magnetic field shielding sheet, abstract) arranged on one surface of an antenna, the antenna comprising: a hollow portion having a predetermined area in the center and a pattern part surrounding the hollow portion, wherein the eddy current reduction pattern part is provided at a position corresponding to a region in which the pattern part is disposed (for an antenna, which includes a hollow portion having a predetermined area in a central portion and a pattern portion configured to surround the hollow portion, abstract). It would have been obvious to one of ordinary skill in the art to have provided a structure with hollow portion of Jang in view of Kim in order to enclosure other circuits (RFIC, antennas) as taught by Jang. Regarding Claim 4, Kim in view of Woo essentially discloses the claimed invention but does not explicitly disclose the heat-dissipating magnetic field shielding sheet of claim 1, wherein the eddy current reduction pattern part is a crack part in which a magnetic material constituting a magnetic layer in a predetermined region is divided into a plurality of pieces, or is a penetration part penetrating the predetermined region However, Jang discloses the heat-dissipating magnetic field shielding sheet of claim 1, wherein the eddy current reduction pattern part is a crack part in which a magnetic material constituting a magnetic layer in a predetermined region is divided into a plurality of pieces, or is a penetration part penetrating the predetermined region (cracks are partially formed only in a partial area…, paragraph [0083]). It would have been obvious to one of ordinary skill in the art to have provided the eddy current reduction pattern part is a crack part in which a magnetic material constituting a magnetic layer in a predetermined region is divided into a plurality of pieces in Kim in view of Woo in order to enhance the heat dissipation as taught by Jang. Regarding Claim 14, as discussed above, Kim in view of Woo essentially discloses the claimed invention but does not explicitly disclose the antenna unit having an antenna including a hollow portion having a predetermined area and a pattern part surrounding the hollow portion in the central portion and a heat-dissipating magnetic field shielding sheet. However, Jang (2022/0368169) discloses an antenna module, comprising: an antenna unit having an antenna including a hollow portion having a predetermined area and a pattern part surrounding the hollow portion in the central portion (for an antenna, which includes a hollow portion having a predetermined area in a central portion and a pattern portion configured to surround the hollow portion, abstract); and a heat-dissipating magnetic field shielding sheet (magnetic field shielding sheet, abstract) according to Claim 1 disposed on one surface of the antenna unit. It would have been obvious to one of ordinary skill in the art to have provided a structure with hollow portion of Jang in Kim in view of Woo in order to enclosure other circuits as taught by Jang. Regarding Claim 15, Kim et al. discloses the antenna module of claim 14, wherein the antenna comprises one or more of an antenna for wireless power transmission (WPT), an antenna for magnetic secure transmission (MST), and an antenna for near field communication (NFC) (Near field communication, paragraph [0004]). Regarding Claim 16, Kim et al. discloses an electronic device comprising an antenna module (wireless antenna) according to claim 14 (Abstract). Allowable subject matter Claims 5-9, 12, 13 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Correspondence Any inquiry concerning this communication or earlier communications from the examiner should be directed to Examiner Wilson Lee whose telephone number is (571) 272-1824. Proposed amendment and interview agenda can be submitted to Examiner’s direct fax at (571) 273-1824. If attempts to reach the examiner by telephone are unsuccessful, examiner’s supervisor, Alexander Taningco can be reached at (571) 272-8048. Papers related to the application may be submitted by facsimile transmission. Any transmission not to be considered an official response must be clearly marked "DRAFT". The official fax number is (571) 273-8300. Information regarding the status of an application may be obtained from the Patent Center. Status information for published applications may be obtained from Patent Center. For more information about the Patent Center, see https://patentcenter.uspto.gov. Should you have questions on access to the Patent Center, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). /WILSON LEE/ Primary Examiner, Art Unit 2844
Read full office action

Prosecution Timeline

Jun 14, 2024
Application Filed
Dec 27, 2025
Non-Final Rejection — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
90%
With Interview (+3.1%)
2y 9m
Median Time to Grant
Low
PTA Risk
Based on 651 resolved cases by this examiner. Grant probability derived from career allow rate.

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