DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Priority
Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-16 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2023/0034784 A1 (Terasaki).
Terasaki discloses, referring primarily to figures 1 and 2, a copper/ceramic bonded body comprising: a copper member (12, 13) consisting of copper or a copper alloy ([0038]); and a ceramic member (11, [0038]), wherein the copper member is bonded to the ceramic member, an active metal compound layer (15)consisting of an active metal compound ([0053]) is formed on a side of the ceramic member at a bonded interface between the ceramic member and the copper member, and microcracks that extend from the bonded interface toward an inner side of the ceramic member are present in the ceramic member, and at least a part of the microcracks are filled with the active metal compound [claim 1], wherein in the microcrack filled with the active metal compound, a maximum depth H from the bonded interface is set to be in a range of 0.3 µm or more and 3.0 µm or less ([0062]) [claim 2], wherein a width W of the microcrack filled with the active metal compound is 0.3 µm or less ([0062]) [claim 3], wherein a thickness tl of the active metal compound layer is set to be in a range of 40 nm or more and 600 nm or less ([0062]) [claim 4], wherein at the bonded interface between the ceramic member and the copper member, an Ag-Cu alloy layer is formed on a side of the copper member, and a thickness t2 of the Ag-Cu alloy layer is set to be in a range of 1.5 µm or more and 30 µm or less ([0041]) [claim 5].
Terasaki, an insulated circuit board comprising: a copper sheet (12, 13) consisting of copper or a copper alloy; and a ceramic substrate (11), wherein the copper sheet is bonded to a surface of the ceramic substrate, an active metal compound layer (15) consisting of an active metal compound is formed on a side of the ceramic substrate at a bonded interface between the ceramic substrate and the copper sheet, and microcracks that extend from the bonded interface toward an inner side of the ceramic substrate are present in the ceramic substrate, where at least a part of the microcracks are filled with the active metal compound [claim 6], wherein in the microcrack filled with the active metal compound, a maximum depth H from the bonded interface, is set to be in a range of 0.3 µm or more and 3.0 µm or less ([0062]) [claim 7], wherein a width W of the microcrack filled with the active metal compound is 0.3 µm or less ([0062]) [claim 8], wherein a thickness tl of the active metal compound layer is set to be in a range of 40 nm or more and 600 nm or less ([0062]) [claim 9], wherein at the bonded interface between the ceramic substrate and the copper sheet, an Ag- Cu alloy layer is formed on a side of the copper sheet, and a thickness t2 of the Ag-Cu alloy layer is set to be in a range of 1.5 µm or more and 30 µm or less ([0041]) [claim 10], wherein a width W of the microcrack filled with the active metal compound is 0.3 m or less ([0062]) [claim 11], wherein a thickness tl of the active metal compound layer is set to be in a range of 40 nm or more and 600 nm or less ([0062]) [claim 12], wherein at the bonded interface between the ceramic member and the copper member, an Ag-Cu alloy layer is formed on a side of the copper member, and a thickness t2 of the Ag-Cu alloy layer is set to be in a range of 1.5 µm or more and 30 µm or less ([0041]) [claim 13], wherein a width W of the microcrack filled with the active metal compound is 0.3 µm or less ([0062]) [claim 14], wherein a thickness tl of the active metal compound layer is set to be in a range of 40 nm or more and 600 nm or less ([0062]) [claim 15], wherein at the bonded interface between the ceramic substrate and the copper sheet, an Ag- Cu alloy layer is formed on a side of the copper sheet, and a thickness t2 of the Ag-Cu alloy layer is set to be in a range of 1.5 µm or more and 30 µm or less ([0041]) [claim 16].
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JEREMY C NORRIS whose telephone number is (571)272-1932. The examiner can normally be reached 7:15-15:15 M-F.
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JEREMY C. NORRIS
Examiner
Art Unit 2847
/JEREMY C NORRIS/Primary Examiner, Art Unit 2847