Prosecution Insights
Last updated: April 19, 2026
Application No. 18/690,902

PLASMA PROCESSING METHOD

Non-Final OA §102
Filed
Mar 11, 2024
Examiner
LU, JIONG-PING
Art Unit
1713
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Hitachi High-Tech Corporation
OA Round
1 (Non-Final)
83%
Grant Probability
Favorable
1-2
OA Rounds
2y 3m
To Grant
91%
With Interview

Examiner Intelligence

Grants 83% — above average
83%
Career Allow Rate
779 granted / 935 resolved
+18.3% vs TC avg
Moderate +8% lift
Without
With
+7.9%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
54 currently pending
Career history
989
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
47.5%
+7.5% vs TC avg
§102
27.9%
-12.1% vs TC avg
§112
16.2%
-23.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 935 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. Drawings Figures 2A and 2B should be designated by a legend such as --Prior Art-- because only that which is old is illustrated. See MPEP § 608.02(g). Corrected drawings in compliance with 37 CFR 1.121(d) are required in reply to the Office Action to avoid abandonment of the application. The replacement sheet(s) should be labeled “Replacement Sheet” in the page header (as per 37 CFR 1.84(c)) so as not to obstruct any portion of the drawing figures. If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office Action. The objection to the drawings will not be held in abeyance. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office Action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 7 and 9-11 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Han et al. (US20240186149). Regarding claim 7, Han discloses a plasma processing method (abstract) comprising: a first step of forming a pattern on a molybdenum-containing film using plasma generated by a mixed gas of a gas containing oxygen and a gas containing halogen (step 304, Fig. 3A, and paragraphs 0038-0039); a second step of forming, after the first step, a protective film on the pattern using plasma generated by a gas containing carbon (step 306, Fig. 3A, and paragraph 0035); a third step of breakthrough, after the second step, the protective film at a bottom of the pattern using plasma generated by a gas containing oxygen (step 308, Fig. 3A, and paragraph 0042); and a fourth step of etching, after the third step, using plasma generated by a gas containing halogen (step 310, Fig. 3A and paragraph 0038), wherein the second to fourth steps are repeated until reaching a predetermined pattern depth (repeating cycle 312, Fig. 3A). Han is silent about the breakthrough step comprising oxidizing the molybdenum-containing film; however, Han discloses that the oxygen content and RF power may be increased to help remove the protective film (protection layer 340) in the breakthrough step (paragraph 0042). When the protection layer is removed and the molybdenum underneath the protection layer is exposed to oxygen plasma, oxidizing the molybdenum-containing film inherently takes place. Regarding claim 9, Han discloses wherein the gas containing halogen is a chlorine gas (Cl2, paragraph 0038). Regarding claim 10, Han discloses wherein the gas containing halogen is a tetrafluoromethane gas (CF4, paragraph 0038). Regarding claim 11, Han discloses wherein the gas containing carbon is a trifluoromethane gas (CHF3, paragraph 0035). Regarding claim 12, Han discloses wherein the gas containing halogen is a chlorine gas (Cl2, paragraph 0038). Allowable Subject Matter Claims 8 and 12-13 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: Regarding claim 8, the cited prior art of record, taken either alone or in combination, fails to disclose or render obvious a method comprising: a fifth step of, after the fourth step, removing the protective film and an altered layer formed on a surface of the molybdenum-containing film or an altered layer formed on the ruthenium-containing film using plasma generated by a gas containing hydrogen, in the context of the instant claim. Regarding claim 13, it is a dependent of claim 8. Regarding claim 12, the cited prior art of record, taken either alone or in combination, fails to disclose or render obvious a method comprising: wherein the method further comprises, after the second step, a step of reducing roughness of the protective film using plasm generated by an argon gas (Ar), a helium gas (He), a nitrogen gas (N2), a hydrogen gas (H2), in the context of the instant claim. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JIONG-PING LU whose telephone number is (571) 270-1135. The examiner can normally be reached on M-F: 9:00am – 5:00pm. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua L Allen, can be reached at telephone number (571)270-3176. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from Patent Center. Status information for published applications may be obtained from Patent Center. Status information for unpublished applications is available through Patent Center for authorized users only. Should you have questions about access to Patent Center, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) Form at https://www.uspto.gov/patents/uspto-automated- interview-request-air-form. /JIONG-PING LU/ Primary Examiner, Art Unit 1713
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Prosecution Timeline

Mar 11, 2024
Application Filed
Dec 27, 2025
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12600909
ETCHING SOLUTION COMPOSITION
2y 5m to grant Granted Apr 14, 2026
Patent 12598929
ATOMIC LAYER ETCHING OF MOLYBDENUM
2y 5m to grant Granted Apr 07, 2026
Patent 12595413
SILICON NITRIDE ETCHING COMPOSITIONS AND METHOD
2y 5m to grant Granted Apr 07, 2026
Patent 12593637
CHEMICAL PLANARIZATION
2y 5m to grant Granted Mar 31, 2026
Patent 12578641
PHOTORESIST AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
83%
Grant Probability
91%
With Interview (+7.9%)
2y 3m
Median Time to Grant
Low
PTA Risk
Based on 935 resolved cases by this examiner. Grant probability derived from career allow rate.

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