Tech Center 1700 • Art Units: 1713
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18481904 | SELECTIVE HARDMASK ETCH FOR SEMICONDUCTOR PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18234685 | PLASMA ETCHING IN SEMICONDUCTOR PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18364249 | DOPED DIAMOND-LIKE CARBON | Final Rejection | Applied Materials, Inc. |
| 18221505 | CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE | Final Rejection | Applied Materials, Inc. |
| 18422028 | METHOD OF MANUFACTURING COMPOSITE ARTICLE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18359747 | REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18326494 | SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18315868 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PHOTORESIST COMPOSITION | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18411986 | COMPOSITIONS FOR POLISHING HARDMASKS AND RELATED SYSTEMS AND METHODS | Non-Final OA | ENTEGRIS, INC. |
| 18385340 | POSITIVELY CHARGED ABRASIVE WITH NEGATIVELY CHARGED IONIC OXIDIZER FOR POLISHING APPLICATION | Final Rejection | ENTEGRIS, INC. |
| 18620482 | ETCHING BI-METAL OXIDES WITH ALKALINE EARTH METALS | Non-Final OA | Tokyo Electron Limited |
| 18620417 | HARD MASK PROTECTION OF METAL INTERCONNECTS | Non-Final OA | Tokyo Electron Limited |
| 18585340 | Methods To Improve Etch Uniformity Across A Semiconductor Substrate When Etching With A Hydrofluoric Acid (HF) And Nitric Acid (HNO3) Solution | Non-Final OA | Tokyo Electron Limited |
| 18418757 | SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM | Non-Final OA | Tokyo Electron Limited |
| 18410031 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18406783 | METHOD AND SYSTEM FOR PLASMA PROCESS | Non-Final OA | Tokyo Electron Limited |
| 18554225 | ETCHING METHOD AND PROCESSING DEVICE | Non-Final OA | Tokyo Electron Limited |
| 18239303 | SILICON ETCHING SOLUTION AND METHOD FOR PRODUCING SILICON ETCHING SOLUTION, METHOD FOR TREATING SUBSTRATE, AND METHOD FOR PRODUCING SILICON DEVICE | Final Rejection | TOKUYAMA CORPORATION |
| 18686043 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Non-Final OA | Resonac Corporation |
| 18294889 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD | Non-Final OA | Resonac Corporation |
| 18264534 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | Final Rejection | RESONAC CORPORATION |
| 18690902 | PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18387655 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | Final Rejection | SEMES CO., LTD. |
| 18256893 | HIGH SELECTIVITY, LOW STRESS, AND LOW HYDROGEN CARBON HARDMASKS IN LOW-PRESSURE CONDITIONS WITH WIDE GAP ELECTRODE SPACING | Final Rejection | Lam Research Corporation |
| 18421013 | POLISHING COMPOSITION, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | Non-Final OA | FUJIMI INCORPORATED |
| 17442712 | POLISHING COMPOSITION | Final Rejection | FUJIMI INCORPORATED |
| 18255975 | RECESS ETCHING SOLUTION, RECESS ETCHING METHOD, AND SURFACE-TREATED SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD | Non-Final OA | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 18141530 | Polishing Compositions and Methods of Using Same | Final Rejection | Fujifilm Electronic Materials U.S.A., Inc. |
| 18534907 | SUPPRESSION OF MANGANESE DIOXIDE FORMATION IN MANGANESE (III)-BASED ETCHING SOLUTIONS | Non-Final OA | MacDermid Enthone Inc. |
| 18547497 | Semiconductor Structures and Methods of Forming Them | Non-Final OA | ChangXin Memory Technologies, Inc. |
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