Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18389847 | SELECTIVE ETCHING METHOD AND ETCHING ASSEMBLY | Non-Final OA | ASM IP Holding B.V. |
| 17899862 | TREATMENT LIQUID AND TREATMENT LIQUID CONTAINER | Non-Final OA | FUJIFILM Corporation |
| 18602986 | PRIME STEP FOR METAL ETCH IN HIGH ASPECT-RATIO FEATURES | Non-Final OA | Applied Materials, Inc. |
| 18481904 | SELECTIVE HARDMASK ETCH FOR SEMICONDUCTOR PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18234685 | PLASMA ETCHING IN SEMICONDUCTOR PROCESSING | Final Rejection | Applied Materials, Inc. |
| 18364249 | DOPED DIAMOND-LIKE CARBON | Final Rejection | Applied Materials, Inc. |
| 18221505 | CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE | Final Rejection | Applied Materials, Inc. |
| 18422028 | METHOD OF MANUFACTURING COMPOSITE ARTICLE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18326494 | SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18585340 | Methods To Improve Etch Uniformity Across A Semiconductor Substrate When Etching With A Hydrofluoric Acid (HF) And Nitric Acid (HNO3) Solution | Non-Final OA | Tokyo Electron Limited |
| 18406783 | METHOD AND SYSTEM FOR PLASMA PROCESS | Non-Final OA | Tokyo Electron Limited |
| 18385340 | POSITIVELY CHARGED ABRASIVE WITH NEGATIVELY CHARGED IONIC OXIDIZER FOR POLISHING APPLICATION | Final Rejection | ENTEGRIS, INC. |
| 18264534 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | Final Rejection | RESONAC CORPORATION |
| 18690902 | PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 17442712 | POLISHING COMPOSITION | Final Rejection | FUJIMI INCORPORATED |
| 18141530 | Polishing Compositions and Methods of Using Same | Final Rejection | Fujifilm Electronic Materials U.S.A., Inc. |
| 18547497 | Semiconductor Structures and Methods of Forming Them | Non-Final OA | ChangXin Memory Technologies, Inc. |
| 18534907 | SUPPRESSION OF MANGANESE DIOXIDE FORMATION IN MANGANESE (III)-BASED ETCHING SOLUTIONS | Non-Final OA | MacDermid Enthone Inc. |
| 18294174 | CHEMICAL-MECHANICAL COMBINED MACHINING METHOD FOR SILICON CARBIDE SURFACE | Non-Final OA | HUAQIAO UNIVERSITY |
| 18386772 | CONTINUOUS COIL PRETREATMENT PROCESS | Non-Final OA | ARCONIC TECHNOLOGIES LLC |
| 18351031 | CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING POLISHING PAD GROOVE CLOGGING | Final Rejection | DuPont Electronic Materials Holding, Inc. |
| 18537621 | ELECTRICAL INTERCONNECT STRUCTURE WITH CIRCUIT BEARING DIELECTRIC LAYERS AND RESULTANT DIELECTRIC SPACING CONTROL AND CIRCUIT PITCH REDUCTION | Non-Final OA | LCP Medical Technologies, LLC |
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