DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 9/24/2024, 4/14/2026 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claim 5, 14-15 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Regarding claim 5, the limitation “the second via comprises a first sub-via and a second sub-via that are in communication with each other………..the second pad comprises a conductive electrode and a pad body; wherein the conductive electrode is disposed within the first sub-via and is electrically connected to the current spreading layer through the first sub-via and the pad body is disposed on the side, away from the substrate” is unclear to the examiner because of the following reasons:
Claim 1 is claiming that “a second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer; and a first pad and a second pad that are disposed on a side, away from the substrate, of the second insulative layer and spaced apart from each other, wherein the first pad is electrically connected to the conductive layer through the first via, and the second pad is electrically connected to the current spreading layer through the second via.”
However according to applicant’s own disclosure (Figs 8A-8E), a first sub-via is formed in the K21 when the current spreading layer is disposed and where conductive electrode is formed and then second insulative layer is disposed after forming the conductive electrode and then the second sub-via is formed where the pad body is formed. (Figs 8A-8E)
Claim 1 is referring to Fig 9 where the second via is successively formed in the second insulative layer and the first insulative layer exposing the current spreading layer and where the second PAD2 is formed.
Therefore Claim 1 and claim 5 are two mutually exclusive species.
Regarding claim 14, the limitation “forming the second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer comprises:
prior to forming the second insulative layer, forming a first sub-via running through the first insulative layer and exposing the current spreading layer; and after forming the second insulative layer, acquiring the second via comprising the first sub-via and a second sub-via by forming the second sub-via running through the second insulative layer and in communication with the first sub-via; and forming the second pad on the side, away from the substrate, of the second insulative layer ……” is unclear to the examiner because of the following reasons:
Claim 9 is clearly claiming forming a second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer and second pad is electrically connected to the current spreading layer through the second via as shown in Figs 9A-9B but Claim 14 is referring to Figs 8A-8E which are mutually different species.
Allowable Subject Matter
Claims 1-4, 7-13, 16-21 are allowed.
Regarding claim 1, the prior art of record, either singularly or in combination, does not disclose or suggest the combination of limitations including “the at least one second trench is disposed between the epitaxial layer and the substrate, an orthographic projection of the at least one second trench on the substrate being overlapped with an orthographic projection of the epitaxial layer on the substrate; a first insulative layer disposed on a side, away from the substrate, of the epitaxial layer and covering an inner wall of the at least one first trench; a conductive layer disposed on a side, away from the substrate, of the first insulative layer, wherein the conductive layer extends through the at least one first trench into the at least one second trench and is in contact with the substrate; a second insulative layer disposed on a side, away from the substrate, of the conductive layer; a first via running through the second insulative layer and exposing the conductive layer, and a second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer; and a first pad and a second pad that are disposed on a side, away from the substrate, of the second insulative layer and spaced apart from each other, wherein the first pad is electrically connected to the conductive layer through the first via, and the second pad is electrically connected to the current spreading layer through the second via”.
Regarding claim 9, the prior art of record, either singularly or in combination, does not disclose or suggest the combination of limitations including “forming at least one second trench that is in communication with the at least one first trench by removing at least a portion of the sacrificial layer, such that the substrate is exposed by the at least one first trench and the at least one second trench that are in communication with each other, wherein an orthographic projection of the formed at least one second trench on the substrate is overlapped with an orthographic projection of the epitaxial layer on the substrate; forming a conductive layer, wherein the formed conductive layer is disposed on a side, away from the substrate, of the first insulative layer, extends through the at least one first trench into the at least one second trench, and is in contact with the substrate; forming a second insulative layer on a side, away from the substrate, of the conductive layer; forming a first via running through the second insulative layer and exposing the conductive layer and a second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer; and forming a first pad and a second pad that are spaced apart from each other on a side, away from the substrate, of the second insulative layer, wherein the formed first pad is electrically connected to the conductive layer through the first via, and the formed second pad is electrically connected to the current spreading layer through the second via”.
Regarding claim 21, the prior art of record, either singularly or in combination, does not disclose or suggest the combination of limitations including “the at least one second trench is disposed between the epitaxial layer and the substrate, an orthographic projection of the at least one second trench on the substrate being overlapped with an orthographic projection of the epitaxial layer on the substrate; a first insulative layer disposed on a side, away from the substrate, of the epitaxial layer and covering an inner wall of the at least one first trench; a conductive layer disposed on a side, away from the substrate, of the first insulative layer, wherein the conductive layer extends through the at least one first trench into the at least one second trench and is in contact with the substrate; a second insulative layer disposed on a side, away from the substrate, of the conductive layer; a first via running through the second insulative layer and exposing the conductive layer, and a second via successively running through the second insulative layer and the first insulative layer and exposing the current spreading layer; and a first pad and a second pad that are disposed on a side, away from the substrate, of the second insulative layer and spaced apart from each other, wherein the first pad is electrically connected to the conductive layer through the first via, and the second pad is electrically connected to the current spreading layer through the second via”.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure:
Jiang et al (US 2023/0352628)
Young et al (US 2022/0285425)
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/RATISHA MEHTA/ Primary Examiner, Art Unit 2817
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