Detailed Action
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
Objections to the Claims, Specification and Drawings
There is a lack of correspondence between the claimed subject matter, the detailed written description, the summary of invention and the drawings as to
a. Claims 17, lines 6-7 requires “the height of the protrusion from an outer surface of the housing increases as it approaches the first guide region.” The Examiner suspects that this limitation should read “the height of the protrusion from an outer surface of the housing increases as it approaches the first heat dissipation region.” A similar correction to the specification needs to be made.
Claim Objections
Claims 14, 17-19, and 29 are objected to because of the following informalities:
Claim 14, line 2and Claim 29, line 2, “the two first heat dissipation fins” should be “two of the first heat dissipation fins”;
Claim 17. line 4, “the other” lacks antecedent basis and should be “another”; and
Claim 17, line 6; and Claim 18, line 6, “the height” lacks antecedent basis and should be “a height”.
Appropriate correction is required.
Claim Rejections - 35 USC § 112
Claims 13, 17-19, and 26-30 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 13, line 2 requires “pluralities of adjacent first heat dissipation fins” and Claim 11, line 5 requires “a plurality of first heat dissipation fins.” Are the adjacent first heat dissipation fins of claim 13 in addition to the first heat dissipation fins of claim 11?
Claim 17, line 6; and Claim 18, line 6, “the protrusion” lacks antecedent basis;
Claim 17, line 6, Claim 18, line 6 and Claim 11, line 4 each require “an outer surface.” Is the outer surface of claim 17 and 18 in addition to the outer surface of claim 11?
Claim 26, lines 8-9 requires “a plurality of adjacent first heat dissipation fins”; Clam 28, line 2 requires “pluralities of adjacent first heat dissipation fins” and Claim 26, line 6 requires “a plurality of first heat dissipation fins.” Are the adjacent first heat dissipation fins of claims 26 and 28 in addition to the first heat dissipation fins of claim 26, line 6? and
Claim 26, lines 3 and 10 each require “a lower surface.” Are these different lower surfaces?
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 11-14, 17, 19, 20, 22, 25, and 26-29 are rejected under AIA 35 U.S.C. 103 as being unpatentable over Tanka (WO 2019/208184, using US 2021/0136948 as English translation) and Takao (JP 6384793).
With respect to Claim 11, Tanka teaches a converter comprising: a housing (fig. 40A,40B); an electronic component (25,35) disposed inside the housing; and heat dissipation fins (49B) protruded from an outer surface (fig. 3, outer surface of 40A,40B) of the housing. Tanka fails to disclose the heat dissipation fins comprise a plurality of first heat dissipation fins disposed to be spaced apart from one another, and a plurality of second heat dissipation fins disposed to be spaced apart from one another and disposed between the plurality of first heat dissipation fins that are adjacent to each other, wherein based on a first direction, a lengths of the first heat dissipation fins are longer than a lengths of the second heat dissipation fins, and wherein the outer surface of the housing includes a first region where the first heat dissipation fins are disposed, and a second region where the first heat dissipation fins and the second heat dissipation fins are disposed. Takao teaches the heat dissipation fins (fig. 1, 21f) comprise a plurality of first heat dissipation fins (see annotated fig. 1, longer fins) disposed to be spaced apart (see fig. 1) from one another, and a plurality of second heat dissipation fins (see annotated fig. 1, shorter fins) disposed to be spaced apart (see fig. 1) from one another and disposed between (see fig. 1) the plurality of first heat dissipation fins that are adjacent to each other, wherein based on a first direction (see fig. 1, extending direction of fins), a lengths (fig, 1, lengths of longer fins) of the first heat dissipation fins are longer (see fig, 1) than a lengths (fig, 1, lengths of shorter fins) of the second heat dissipation fins, and wherein the outer surface of the housing includes a first region where the first heat dissipation fins are disposed, and a second region (fig. 1, region where both longer and shorter fins are disposed) where the first heat dissipation fins and the second heat dissipation fins are disposed. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the heat dissipations fins of Tanka with the fins of Takao for the purpose of providing additional heat dissipations fins to increase the surface area in order to dissipate heat from the area that generates the most heat.
PNG
media_image1.png
408
330
media_image1.png
Greyscale
With respect to Claim 26, Tanka teaches a converter comprising: a first housing (fig. 2, 40A); a second housing (40B) disposed at a lower portion (see fig, 2, when flip upside down) of the first housing; an electronic component (25,35) disposed between the first housing and the second housing; and heat dissipation fins (49B) protruded downward (protrude downward when flipped upside down) from a lower surface (fig. 2, outer surface of 40B) of the second housing. Tanka fails to disclose the heat dissipation fins comprise a plurality of first heat dissipation fins disposed to be spaced apart from one another, a plurality of second heat dissipation fins disposed to be spaced apart from one another and disposed between a plurality of adjacent first heat dissipation fins, and wherein a lower surface of the second housing comprises a first region where the first heat dissipation fins are disposed, and a second region where the first heat dissipation fins and the second heat dissipation fins are disposed. Takao teaches the heat dissipation fins (fig. 1, 21f) comprise a plurality of first heat dissipation fins (see annotated fig. 1, longer fins) disposed to be spaced apart (see fig. 1) from one another, and a plurality of second heat dissipation fins (see annotated fig. 1, shorter fins) disposed to be spaced apart (see fig. 1) from one another and disposed between (see fig. 1) a plurality of adjacent first heat dissipation fins that are adjacent to each other, and wherein a lower surface (fig. 6, outer surface of 2) of the second housing comprises a first region (fig. 1, region where only longer fins are disposed) where the first heat dissipation fins are disposed, and a second region (fig. 1, region where both longer and shorter fins are disposed) where the first heat dissipation fins and the second heat dissipation fins are disposed. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the heat dissipations fins of Tanka with the fins of Takao for the purpose of providing additional heat dissipations fins to increase the surface area in order to dissipate heat from the area that generates the most heat.
With respect to Claims 12 and 27, Tanka discloses the claimed invention except for the first and second heat dissipation fins. Takao teaches a length (fig. 1, length of region with only shorter fins) of the second region is equal to or less than a sum of a length (fig. 1, length of regions with longer fins) of the first region and the length of the second region. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the heat dissipations fins of Tanka with the fins of Takao for the purpose of providing additional heat dissipations fins to increase the surface area in order to dissipate heat from the area that generates the most heat. Tanka and Takao fail to disclose a length of the second region is equal to or less than ½ of a sum of a length of the first region and the length of the second region. It would have been an obvious matter of choice to for the size of the second region to be any size including equal to or less than the sum of the first and second regions to minimize the weight of the converter, since such a modification would have involved a mere change in the size of a component. A change in size is generally recognized as being within the level of ordinary skill in the art. In re Rose, 105 USPQ 237 (CCPA 1955).
With respect to Claims 13 and 28, Tanka discloses the claimed invention except for a first gap is formed between pluralities of adjacent first heat dissipation fins in the first region, wherein a second gap is formed between the first heat dissipation fins and the second heat dissipation fins in the second region, and wherein the first gap is larger than the second gap (claim 13) and a first gap is formed between pluralities of adjacent first heat dissipation fins in the first region, wherein a second gap is formed between the first heat dissipation fins and the second heat dissipation fins in the second region, and wherein the first gap is larger than the second gap (claim 28). Takao teaches a first gap (see annotated fig. 1, gap between longer fins) is formed between pluralities of adjacent first heat dissipation fins in the first region, wherein a second gap (see annotated fig. 1, gap between longer and shorter fins) is formed between the first heat dissipation fins and the second heat dissipation fins in the second region, and wherein the first gap is larger (see fig. 1) than the second gap (claim 13) and a first gap (see annotated fig. 1, gap between longer fins) is formed between pluralities of adjacent first heat dissipation fins in the first region, wherein a second gap (see annotated fig. 1, gap between longer and shorter fins) is formed between the first heat dissipation fins and the second heat dissipation fins in the second region, and wherein the first gap is larger (see fig. 1) than the second gap (claim 28). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the heat dissipations fins of Tanka with the fins of Takao for the purpose of providing additional heat dissipations fins to increase the surface area in order to dissipate heat from the area that generates the most heat.
With respect Claims 14 and 29, Tanka and Takao disclose the claimed invention except for a third gap is formed between the two first heat dissipation fins disposed at the center based on a second direction perpendicular to the first direction, and wherein the third gap is larger than the first gap. It would have been an obvious matter of choice of the distance between two of the first fins to be a different gap including a wider gap, where less thermal management is needed in the center of the converter , since such a modification would have involved a mere change in the size of a component. A change in size is generally recognized as being within the level of ordinary skill in the art. In re Rose, 105 USPQ 237 (CCPA 1955). Tanka further teaches the first heat dissipation fins includes a first guide region (fig. 3, region of angled right side portion of 49B) whose one end is disposed adjacent (see fig. 3) to one side surface of the housing, and a first heat dissipation region (fig. 3, rest of 49B except for region of angled right side portion of 49B) connected to the first guide region and having one end disposed adjacent (See fig. 3) to the other side surface of the housing, and wherein an inclined surface (incline on right side of 49B) is disposed on a surface of the first guide region in a shape that the height of the protrusion from an outer surface of the housing increases (see fig. 3) as it approaches the first guide region.
With respect to Claim 17, Tanka further teaches the first heat dissipation fins includes a first guide region (fig. 3, right inclined side of 490s) whose one end is disposed adjacent to one side surface (fig. 3, right side of 40B) of the housing, and a first heat dissipation region (fig. 3, rest of 490s except for right inclined side of 490) connected to the first guide region and having one end (fig. 3, left side of 490s) disposed adjacent to the other side surface of the housing, and wherein an inclined surface (see fig. 3, inclined right side portion of 490) is disposed on a surface (surface of 40B) of the first guide region in a shape that the height of the protrusion from an outer surface (outer surface of 40B) of the housing increases (see fig. 3) as it approaches the first [heat dissipation region] region.
With respect to Claim 19, Tanka disclose the claimed invention except for a connection portion having a larger cross-sectional area than other regions is disposed between the first guide region and the first heat dissipation region. Takao teaches a connection portion (21g) having a larger cross-sectional area (see fig. 1) than other regions is disposed between the first guide region (fig. 1, region of fin above uppermost 21g) and the first heat dissipation region (fig. 1, region of fin below uppermost 21g). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify the converter of Tanka with the connection portion of Takao for the purpose of providing a larger area to fasten a screw into the first heat dissipation fin.
With respect to Claim 20, Tanka and Takao fail to disclose two second heat dissipation fins are disposed in the third gap. It would have been obvious to one having ordinary skill in the art at the time the invention was made to one of the centrally located first heat dissipation fans so that there are two heat dissipation fins with the same gap (i.e., the third gap) if the omitted first heat dissipation fin is not needed for reliable operation of the converter, since it has been held that omission of an element and its function in a combination where the remaining elements perform the same functions as before involves only routine skill in the art. In re Karlson, 136 USPQ 184.
With respect to Claim 22, Tanka and Takao fail to disclose claimed invention except for the electronic components include an inductor and a FET element, wherein the inductor overlaps the first region, and wherein the FET element overlaps the second region. It would have been an obvious matter of choice to the electronic components to any components that require thermal management including an inductor and a FET element, since applicant has not disclosed that these particular electronic components solves any stated problem or is for any particular purpose and it appears that the invention would perform equally well with any electronic components that require thermal management. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the heat dissipations fins of Tanka with the fins of Takao for the purpose of providing additional heat dissipations fins to increase the surface area in order to dissipate heat from the area (i.e., area of FET) that generates the most heat.
With respect to Claim 25, Tanka and Takao fail to disclose claimed invention except for a groove coated with a heat dissipating material is disposed on an inner surface of the housing facing the second area. Official Notice is taken that a groove coated with heat dissipation material is well-known in the art. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify the converter of Tanka and Takao with a well-known filled groove for the purpose of providing increased a block with greater thermal conductivity for greater removal heat from an electronic component that faces the second area.
Claim 18 is rejected under AIA 35 U.S.C. 103 as being unpatentable over Tanka (WO 2019/208184, using US 2021/0136948 as English translation), Takao (JP 6384793) and Hui (US 9,220,186).
Tanka and Takao disclose the claimed invention except for the second heat dissipation fins includes a second guide region whose one end is disposed adjacent to one end of the second region, and a second heat dissipation region connected to the second guide region and having one end disposed adjacent to the other end of the second region, and wherein an inclined surface is disposed on a surface of the second guide region in a shape that the height of the protrusion from an outer surface of the housing increases as it approaches the second heat dissipation region (claim 18). Hui teaches the second heat dissipation fins (fig. 6, fins of 130) includes a second guide region (fig. 6 region of incline on right side or each fin) whose one end is disposed adjacent to one end of the second region (region of fins of 130), and a second heat dissipation region (fig. 6, region of rest of fins except for region with incline) connected to the second guide region and having one end disposed adjacent to the other end of the second region, and wherein an inclined surface (fig. 6, incline of fin of 130) is disposed on a surface (fig. 6, base of 130) of the second guide region in a shape that the height of the protrusion from an outer surface (top surface of fig. 5) of the housing increases (see fig. 6) as it approaches the second heat dissipation region. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the second heat dissipations fins of Takao with the fins of Hui for the purpose of providing an inclined leading edge of the second heat dissipation fins to prevent turbulent airflow entering the second heat dissipation region.
Claim 21 is rejected under AIA 35 U.S.C. 103 as being unpatentable over Tanka (WO 2019/208184, using US 2021/0136948 as English translation), Takao (JP 6384793) and Nishtura (US 8,081,465).
Tanka and Takao disclose the claimed invention except for the electronic component overlaps the second region in a vertical direction. Nishtura teaches the electronic component (fig. 2(A), rightmost 16) overlaps the second region (fig. 2(B) 11) in a vertical direction (see fig. 2(A)). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify the converter of Tanka and Takao with the second region of Nishtura for the purpose of providing increased cooling in the area above/below the electronic component that requires thermal management.
Claims 23 and 24 are rejected under AIA 35 U.S.C. 103 as being unpatentable over Tanka (WO 2019/208184, using US 2021/0136948 as English translation), Takao (JP 6384793) and Chen (CN 211210305).
Tanka and Takao disclose the claimed invention except for a printed circuit board is disposed in the housing, and the electronic component is coupled thereto, and wherein a heat dissipation pad is disposed between an inner surface of the housing and the printed circuit board (claim 23) and the heat dissipation pad is in contact with the printed circuit board (claim 24). Chen teaches a printed circuit board (fig. 1, 3) is disposed in the housing (2), and the electronic component (see fig. 1, components of 3) is coupled thereto, and wherein a heat dissipation pad (5) is disposed between an inner surface (inner surface of 2) of the housing and the printed circuit board (claim 23) and the heat dissipation pad is in contact (see fig. 1) with the printed circuit board (claim 24). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to modify the converter of Tanka and Takao with the circuit board and heat dissipation pad of Chen for the purpose of providing increased heat transfer between the circuit board and the housing.
Allowable Subject Matter
Claims 15 and 16 are allowed.
Claim 30 would be allowable if rewritten to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action and to include all of the limitations of the base claim and any intervening claims.
The following is a statement of reasons for the indication of allowable subject matter: Claims 15 and 30 and claims dependent thereon are allowable over the art of record because the prior art does not teach or suggest that “a bracket protruded outward and including a coupling hole is disposed on a side surface of the housing, and wherein a rib connecting the bracket and the first heat dissipation fins or the bracket and the second heat dissipation fins is included.” The aforementioned limitations in combination with all remaining limitations of the respective claims are believed to render said claims 15, 30 and all claims dependent thereof patentable over art of record.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US 4,765,397, 11,751,357 and 12m284,788 disclose different heat dissipation fin densities.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ROBERT J HOFFBERG whose telephone number is (571) 272-2761. The examiner can normally be reached on Mon - Fri 9 AM - 5 PM.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jayprakash Gandhi can be reached on (571) 272-3740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
RJH 3/19/2026
/ROBERT J HOFFBERG/
Primary Examiner, Art Unit 2835