Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-4, 6-9, 11-15 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hu (US Pub App 2014/0159065).
Regarding claim 1, Hu discloses a device of mass transferring chips (Abstract), comprising:
a first substrate (200, Fig.6D), comprising a chip-connecting area (204, Fig.6D) configured to connect a chip (475);
a second substrate (300, Fig.6D), comprising a support layer (300) and a first adhesive layer (302), wherein the chip (475, Fig.6D) is between the first substrate (200, Fig.6D) and the second substrate (300, Fig.6D), and the first adhesive layer (302) comprises:
a first surface (top surface of 302) with a chip-receiving area configured to attach the chip from the first substrate;
a second surface (bottom surface of 302) opposite to the first surface and in contact with a first side of the support layer; and
a patterned recess (between each of 302), disposed on the first surface and spaced apart from the chip-receiving area (Fig.6D).
Regarding claim 2, Hu further discloses wherein the patterned recess (between each of 302) comprises a trench laterally extending to a side surface of the first adhesive layer (Fig.6D).
Regarding claim 3, Hu further discloses wherein a depth of the trench is from about 20% to about 80% of a thickness of the first adhesive layer (Fig.6D).
Regarding claim 4, Hu further discloses wherein the patterned recess comprises a first patterned through hole penetrating from the first surface to the second surface (between each of 302).
Regarding claim 6, Hu further discloses a second adhesive layer disposed on a second side of the support layer and physically contacting the support layer (Fig.1D).
Regarding claim 7, Hu further discloses wherein a thickness of the second adhesive layer is greater than a thickness of the first adhesive layer by about 20% to about 50% of the thickness of the first adhesive layer (Fig.1D).
Regarding claim 8, Hu further discloses a laser source configured to provide a laser, wherein a first absorption of the laser by the first adhesive layer is different from a second absorption of the laser by the second adhesive layer (Para.41).
Regarding claim 9, Hu further discloses wherein the laser is absorbed by the first adhesive layer and passes through the second adhesive layer (Para.41).
Regarding claim 11, Hu further discloses wherein the first adhesive layer has a first portion below the chip-receiving area and a second portion below the patterned recess, and a thickness of the first portion of the first adhesive layer is thicker than a thickness of the second portion of the first adhesive layer (Para.39).
Regarding claim 12, Hu further discloses wherein the first substrate comprises a recess, wherein a projection of the recess on the first surface is spaced apart from the chip-connecting area (Fig.6D).
Regarding claim 13, Hu further discloses wherein the first substrate comprises a through hole (207) disposed spaced apart from the chip-connecting area (Fig.6D).
Regarding claim 14, Hu further discloses wherein the through hole of the first substrate aligns with the patterned recess of the second substrate (Fig.6D).
Regarding claim 15, Hu further discloses wherein the patterned recess comprises a plurality of line structures which cross each other (Para.58).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim 10 rejected under 35 U.S.C. 103 as being unpatentable over Hu (US Pub App 2014/0159065) in view of Gardner (CN 107210293).
Regarding claim 10, Hu does not further specifically disclose wherein a wavelength of the laser is about 355 nanometers.
Gardner teaches an LED array on backplane and manufacturing method thereof wherein a wavelength of the laser is about 355 nanometers (10-400nm) (Para.4).
It would have been obvious to one of ordinary skill in the art at the time the application was filed to have modified Hu in view of Gardner to have a wavelength of the laser be about 355 nanometers in order to use light energy of the ultraviolet range.
Allowable Subject Matter
Claims 5, 16-18 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
The following is an examiner’s statement of reasons for allowance:
The prior art of record fails to disclose or render obvious the claimed invention as set forth in claim 5 and subsequent dependent claims. The prior art of record does not disclose or render obvious a second patterned through hole positioned in alignment with the first patterned through hole.
The prior art of record fails to disclose or render obvious the claimed invention as set forth in claim 16 and subsequent dependent claims. The prior art of record does not disclose or render obvious the patterned recess comprises a scattered pattern and a plurality of line structures connecting the scattered pattern to a side surface of the first adhesive layer.
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Hanajima, Li, Xie, Itou and Achi further disclose elements of a device of mass transferring chips.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ASHLEY K ROMANO whose telephone number is (571)272-9318. The examiner can normally be reached Monday - Friday.
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/SAUL RODRIGUEZ/Supervisory Patent Examiner, Art Unit 3652
/ASHLEY K ROMANO/Examiner, Art Unit 3652
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