DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of claims 1, 3-15 in the reply filed on 12/26/24 is acknowledged.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Campbell et al. (US pat 9113581).
With respect to claim 1, Campbell et al. teach a semiconductor apparatus comprising (see figs. 1-14, particularly figs. 5A, 8, and 11 and associated text):
a semiconductor chip 500 comprising a semiconductor integrated circuit 511;
a cooling channel 821, 822, 811 at least partially in the semiconductor chip and comprising a fine pattern (parts between 822) on at least a portion of a wall surface of the cooling channel, the fine pattern configured to generate inherently a capillary pressure that induces a flow of a liquid coolant (via 810); and
a temperature controller (col. 5, lines 30-45) configured to control a supply temperature of the liquid coolant supplied to the cooling channel.
Claim(s) 14 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Campbell et al. (US pat 9113581).
With respect to claim 14, Campbell et al. teach a semiconductor apparatus comprising (see figs. 1-14, particularly figs. 5A, 8, and 11 and associated text):
a semiconductor chip 500 comprising a semiconductor integrated circuit 511;
a plurality of cooling channels 821, 822, 811 at least partially in the semiconductor chip, each of the plurality of cooling channels comprising a fine pattern (parts between 822) on at least a portion of a wall surface of a respective cooling channel of the plurality of cooling channels, each of the fine patterns being configured to generate inherently a capillary pressure that induces a flow of a liquid coolant; and
a temperature controller (col. 5, lines 40-45) configured to control a supply temperature of the liquid coolant supplied to the plurality of cooling channels.
With respect to claim 15, Campbell et al. teach a package housing at least partially surrounding the semiconductor chip, the package housing comprising at least one first opening 830, 111, 1122 configured to discharge vapor coolant and a plurality of second openings 810,820, 1110, 1120 respectively corresponding to the plurality of cooling channels and configured to apply the liquid coolant to respective cooling channels of the plurality of cooling channels. See figs. 5A, 8, and 11 and associated text.
Allowable Subject Matter
Claims 3-13 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Examiner’s Cited References
The cited references generally show the similar or related structure having a package having an IC, a cooling unit having a cooling channel and a fine pattern on wall of channel, and a liquid coolant, and a temperature controller for liquid coolant as presently claimed by applicant.
Conclusion
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LONG . PHAM
Examiner
Art Unit 2823
/LONG PHAM/Primary Examiner, Art Unit 2897
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