Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814 2823 2892 2897
This examiner grants 92% of resolved cases
Long Pham is an experienced examiner in Art Unit 2814 of Tech Center 2800, having resolved 1671 cases. The allowance rate is 91.6 percent, representing a high success rate for applicants. Furthermore, the median time to allowance is 852 days, indicating an efficient prosecution timeline. These figures demonstrate a predictable and favorable environment for patent applicants in this art unit.
The interview lift is 5.5 percent. Given that the base allowance rate is already 91.6 percent, the small lift suggests that interviews are rarely necessary to achieve a grant, though they still provide a slight statistical advantage. With 1671 cases on record, the data provides a reliable forecast for future prosecution. Practitioners can expect a high likelihood of success and a 852-day path to allowance when working with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18439531 | LIGHT-EMITTING ELEMENT PACKAGE, DISPLAY DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18746857 | SEMICONDUCTOR APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18679410 | SYSTEMS AND METHODS FOR HIGH BANDWIDTH MEMORY CONFIGURATIONS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18617964 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18419098 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18319852 | CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWER MANAGEMENT INTEGRATED CIRCUIT (IC) (PMIC) TO A SECONDARY CIRCUIT BOARD, AND RELATED ASSEMBLY METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18664926 | STACKED TRANSISTORS WITH VERTICALLY STAGGERED CONTACT VIAS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18419558 | SEMICONDUCTOR DEVICE INCLUDING SIDE INTERCONNECTION | Non-Final OA | SK hynix Inc. |
| 18071972 | MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD | Final Rejection | Texas Instruments Incorporated |
| 18070708 | ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT | Final Rejection | Texas Instruments Incorporated |
| 18783147 | DEVICES COMPRISING CRYSTALLINE MATERIALS | Non-Final OA | Micron Technology, Inc. |
| 18764951 | GATE-ALL-AROUND DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18764936 | SEMICONDUCTOR DEVICE WITH DIELECTRIC STRUCTURE IN CHANNEL REGION AND MANUFACTURING METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18226994 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18441824 | STRESS INCORPORATION IN SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18176393 | SYSTEMS AND METHODS FOR PACKAGING A SEMICONDUCTOR DEVICE | Final Rejection | Advanced Micro Devices, Inc. |
| 18579934 | NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 18746087 | MAGNETORESISTIVE RANDOM ACCESS MEMORY AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18569751 | QUBIT ELEMENT | Non-Final OA | Rheinisch-Westfälische Technische Hochschule (RWTH Aachen) |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy