Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814 2823 2897
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18372325 | INTEGRATED CIRCUIT DEVICE INCLUDING A LATERAL DIFFUSED METAL OXIDE SEMICONDUCTOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18331973 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18319135 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18299795 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18188627 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17891880 | INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES | Non-Final OA | Intel Corporation |
| 17848059 | INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE | Non-Final OA | Intel Corporation |
| 17932209 | DIE PACKAGE WITH SEALED DIE ENCLOSURES | Final Rejection | QUALCOMM Incorporated |
| 18385435 | INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18226994 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18176393 | SYSTEMS AND METHODS FOR PACKAGING A SEMICONDUCTOR DEVICE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18298819 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18303641 | CHIP PACKAGE AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
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