Prosecution Insights
Last updated: August 17, 2026

Examiner: PHAM, LONG

Tech Center 2800 • Art Units: 2814 2823 2892 2897

This examiner grants 92% of resolved cases

Performance Statistics

91.6%
Allow Rate
+23.6% vs TC avg
1,690
Total Applications
+5.5%
Interview Lift
850
Avg Prosecution Days
Based on 1660 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
39.3%
§102 Novelty
43.2%
§103 Obviousness
10.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18617964 SEMICONDUCTOR PACKAGE Non-Final OA Samsung Electronics Co., Ltd.
18419098 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18103894 IMAGE SENSOR Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18692441 Display Module Manufacturing Method And Display Module Non-Final OA Sony Group Corporation
18641809 QUANTUM DOT LIGAND, QUANTUM DOT MATERIAL AND QUANTUM DOT LIGHT EMITTING DEVICE Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
18692341 Display Substrate and Display Apparatus Non-Final OA BOE Technology Group Co., Ltd.
18189991 PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS Non-Final OA QUALCOMM Incorporated
18334188 PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES Non-Final OA Intel Corporation
17825350 INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN Non-Final OA Intel Corporation
18419558 SEMICONDUCTOR DEVICE INCLUDING SIDE INTERCONNECTION Non-Final OA SK hynix Inc.
18320102 MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT Non-Final OA Texas Instruments Incorporated
18071972 MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD Final Rejection Texas Instruments Incorporated
18070708 ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT Final Rejection Texas Instruments Incorporated
18764951 GATE-ALL-AROUND DEVICES Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18402773 POLYMER HYBRID BONDING FOR COMPOSITE PACKAGES AND METHODS OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
18175985 DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING Non-Final OA International Business Machines Corporation

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