Tech Center 2800 • Art Units: 2814 2823 2897
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18319135 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18299795 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18188627 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18082238 | Semiconductor Devices Including a Premolded Leadframe and a Semiconductor Package | Final Rejection | Infineon Technologies AG |
| 18324612 | Package Redistribution Layer Structures for Stress Mitigation and Alignment Tolerance | Non-Final OA | Apple Inc. |
| 17891880 | INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMPOSITE STRUCTURES | Non-Final OA | Intel Corporation |
| 17848059 | INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE | Non-Final OA | Intel Corporation |
| 17932209 | DIE PACKAGE WITH SEALED DIE ENCLOSURES | Final Rejection | QUALCOMM Incorporated |
| 18177725 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18226994 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18176393 | SYSTEMS AND METHODS FOR PACKAGING A SEMICONDUCTOR DEVICE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18212155 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18298819 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18368128 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18303641 | CHIP PACKAGE AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18189299 | DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18770783 | Epitaxies of a Chemical Compound Semiconductor | Final Rejection | National Chiao-Tung University |
| 18154739 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy