Prosecution Insights
Last updated: October 04, 2026
Application No. 18/747,462

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

Final Rejection §102
Filed
Jun 19, 2024
Priority
Jan 20, 2022 — CN 202210068308.4 +1 more
Examiner
KIM, TONG-HO
Art Unit
Tech Center
Assignee
CXMT Corporation
OA Round
2 (Final)
95%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 95% — above average
95%
Career Allowance Rate
1040 granted / 1092 resolved
+35.2% vs TC avg
Minimal +1% lift
Without
With
+0.7%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 8m
Avg Prosecution
53 currently pending
Career history
1103
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
46.2%
+6.2% vs TC avg
§102
30.9%
-9.1% vs TC avg
§112
8.7%
-31.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1092 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Amendment The amendment filed on 8/24/2026 has been considered. Response to Arguments Applicant's arguments filed on 8/24/2026 have been considered but they are not persuasive. Regarding the rejected claim 16 under 35 USC 102(a)(1), the applicant does not argue and amend. Therefore, the examiner maintains the rejection. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 16 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Nam (US 2021/0159178). Regarding claim 16, Nam discloses, in at least figure 1 and related text, a semiconductor packaging structure, comprising: a first semiconductor chip (C0, [18], [21]); wherein first-contact-pads (540, [20]) are formed on a surface of the first semiconductor chip (C0, [18], [21]); a dielectric layer (150, [48]) located on the first semiconductor chip (C0, [18], [21]); wherein second-contact-pads (160, [18]) are formed within the dielectric layer (150, [48]); a second semiconductor chip stacking structure (C1/C2/C3, [18]) located on the dielectric layer (150, [48]); wherein the second semiconductor chip stacking structure (C1/C2/C3, [18]) comprises a plurality of layers (110/210/210/310, [32], [42], [44]) of second semiconductor chips (C1/C2/C3, [18]) stacked in sequence; and third-contact-pads (120, [32]) are formed on a surface of a first layer (110, [32]) of the plurality of layers (110/210/210/310, [32], [42], [44]) of the second semiconductor chips (C1/C2/C3, [18]); and the first semiconductor chip (C0, [18], [21]) and the first layer (110, [32]) of the plurality of layers (110/210/210/310, [32], [42], [44]) of the second semiconductor chips (C1/C2/C3, [18]) are bonded to each other in an one-to-one correspondence manner through the first-contact-pads (540, [20]), the second-contact-pads (160, [18]) and the third-contact-pads (120, [32]); and, wherein, a width of each of the second-contact-pads (160, [18]) is inconsistent with a width of each of corresponding first-contact-pads (540, [20]) and a width of each of corresponding third-contact-pads (120, [32]). Allowable Subject Matter Claims 1-4, 6, 8, and 17-19 are allowed because the prior art of record neither anticipates nor render obvious the limitations of the base claims 1 that recite "widths of corresponding fourth-contact-pads between adjacent two layers of the multiple layers of the plurality of layers of the second semiconductor chips are inconsistent" in combination with other elements of the base claims 1. Claim 5 is allowed because the prior art of record neither anticipates nor render obvious the limitations of the base claims 5 that recite " the width of the first second-contact-pad is larger than a width of the first first-contact- pad or the first third-contact-pad corresponded thereto; and the width of the second second-contact-pad is smaller than a width of the second first-contact-pad or the second third-contact- pad corresponded thereto" in combination with other elements of the base claims 5. Claims 9-12, 14-15, and 20 are allowed because the prior art of record neither anticipates nor render obvious the limitations of the base claims 9 that recite "widths of corresponding fourth-contact-pads between adjacent two layers of the multiple layers of the plurality of layers of the second semiconductor chips are inconsistent" in combination with other elements of the base claims 9. Conclusion THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to TONG-HO KIM whose telephone number is (571)270-0276. The examiner can normally be reached Monday thru Friday; 8:30 AM to 5PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Lynne Gurley can be reached at 571-272-1670. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TONG-HO KIM/ Primary Examiner, Art Unit 2811
Read full office action

Prosecution Timeline

Jun 19, 2024
Application Filed
Jun 24, 2026
Non-Final Rejection mailed — §102
Aug 24, 2026
Response Filed
Sep 23, 2026
Final Rejection mailed — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
95%
Grant Probability
96%
With Interview (+0.7%)
1y 8m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 1092 resolved cases by this examiner. Grant probability derived from career allowance rate.

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