DETAILED ACTION
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-2 and 13-15 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Lee et al. (Lee, US 2022/0310579 A1) IDS of the record.
Regarding claims 1 and 13, Lee shows a light-emitting substrate (substrate 101 in FIG. 2), comprising: a first substrate (substrate 101), wherein the first substrate comprises: a first base substrate (AS in FIG. 2); a light-emitting diode (LE in FIG. 2) arranged on the first base substrate (AS in FIG. 2); and a first conductive pad (PAD 2) arranged on the first base substrate; a second substrate (substrate 101) arranged opposite to the first substrate, wherein the second substrate comprises: a second base substrate (substrate 101); and a second conductive pad (PAD 1) arranged on the second base substrate; and a bonding wire ( wire CE) structure comprising a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate (see FIG. 2), the second conductive pad is located on a surface of the second substrate away from the first substrate (see FIG. 2), and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad (see FIG. 2); wherein the bonding wire structure further comprises a first solder joint (PD as shown in FIG 3) and a second solder joint, an end of the bonding wire is soldered to the first conductive pad at the first solder joint (PD), and another end of the bonding wire is soldered to the second conductive pad at the second solder joint; and wherein the bonding wire comprises, at each of the first solder joint and the second solder joint, a portion that has an angle with a plane in which the first base substrate is located and/or that has a curved arc (see FIG. 2).
Regarding claim 2, Lee shows a light-emitting substrate (substrate 101 in FIG. 2), comprising: a first substrate (substrate 101), further comprising a gum (CP in FIG. 2), wherein the gum is arranged between the first substrate and the second substrate and configured to attach the first substrate and the second substrate together (see FIG. 2).
Regarding claim 14, Lee shows a method of manufacturing a light-emitting substrate, comprising: providing a first substrate (substrate 101 in FIG. 2), wherein the first substrate comprises a first base substrate (AS in FIG. 2) and a first conductive pad (PAD 2) provided on the first base substrate (AS); transferring and bonding a light-emitting diode (LE) to the first substrate; providing a second substrate (substrate 101), wherein the second substrate (substrate 101) comprises a second base substrate and a second conductive pad (PAD 2) provided on the second based substrate; placing the first substrate and the second substrate on a carrier so as to maintain a relative position of the first substrate and the second substrate (see FIG. 2-3); forming a bonding wire structure to electrically connect the first conductive pad and the second conductive pad; and turning the second substrate toward the first substrate, so that a surface of the second base substrate away from the second conductive pad faces the first substrate, that the first conductive pad is located on a surface of the first substrate away from the second substrate, and that the second conductive pad is located on a surface of the second substrate away from the first substrate, wherein the bonding wire (CE in FIG. 2) structure comprises a bonding wire configured to electrically connect the first conductive pad and the second conductive pad; wherein an end of the bonding wire is soldered to the first conductive pad at a first solder joint (PD in FIG. 3), and another end of the bonding wire is soldered to the second conductive pad at a second solder joint; and wherein the bonding wire comprises, at each of the first solder joint and the second solder joint, a portion that has an angle with a plane in which the first base substrate is located and/or that has a curved arc (see FIG. 2-3).
Regarding claim 15, Lee shows a method of manufacturing a light-emitting substrate, comprising: providing a first substrate (substrate 101 in FIG. 2), wherein after placing the first substrate and the second substrate on the carrier and before forming the bonding wire structure, the method further comprises: forming a first protective adhesive layer, so that the first protective adhesive layer covers at least a first sidewall of the first substrate adjacent to the first conductive pad and a second sidewall of the second substrate adjacent to the second conductive pad (see FIG. 2-3).
Allowable Subject Matter
Claims 3-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ELIAS M ULLAH whose telephone number is (571)272-1415. The examiner can normally be reached M-F at 8AM-5PM EST.
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/ELIAS ULLAH/Primary Examiner, Art Unit 2893
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