Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Detailed Action
Drawings Objection
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the limitation “the heat sink extends laterally above a portion of the opening adaptor” in Claim 9 must be shown or the feature(s) canceled from the claim(s). No new matter should be entered.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections – 35 U.S.C. 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AlA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
Claims 1-8, 11-13, 22 and 28 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Song (U.S. Patent Pub. No. 2014/0126150).
Regarding Claim 1
FIG. 1 of Song discloses an integrated cooling assembly comprising: a semiconductor device (112); an opening adaptor (134) comprising an inlet opening (154), an outlet opening (168), sidewalls, and a divider between the sidewalls; and a cold plate [0021] attached between the semiconductor device and the opening adaptor, the cold plate comprising a first opening (158) and a second opening (164) spaced apart by a first distance and in fluid communication with a coolant channel (166), wherein: at least a portion of a first side of the cold plate is spaced apart from the semiconductor device to define the coolant channel therebetween; the sidewalls and the divider of the opening adaptor extend downwardly to a second side of the cold plate to define an inlet chamber volume and an outlet chamber volume therebetween [0022]; the inlet and outlet openings of the opening adaptor are spaced apart by a second distance different from the first distance; and the coolant channel is in fluid communication with the inlet chamber volume and the outlet chamber volume via the first and second openings of the cold plate [0023].
Regarding Claim 2
FIG. 1 of Song discloses the inlet chamber volume at least partially overlaps and is in fluid communication with the first opening of the cold plate; and the outlet chamber volume at least partially overlaps and is in fluid communication with the second opening of the cold plate.
Regarding Claim 3
FIG. 1 of Song discloses the inlet chamber volume and the outlet chamber volume are separated from the coolant channel by portions of an upper surface of the cold plate.
Regarding Claim 4
FIG. 1 of Song discloses an integrated cooling assembly comprising: a semiconductor device (112); a cold plate [0021] attached to the semiconductor device, and an opening adaptor (134) comprising a first side, a second side opposite the first side, an inlet fluid chamber volume, and an outlet fluid chamber volume, wherein: the first side of the opening adaptor comprises a first inlet opening (154) and a first outlet opening (168) spaced apart by a second distance; the second side of the opening adaptor comprises a second inlet opening and a second outlet opening spaced apart by a first distance different from the second distance; the cold plate comprises a coolant channel (166), a third inlet opening (158) and a third outlet opening (164) spaced apart by the first distance; the second side of the opening adaptor is attached to a side of the cold plate comprising the third inlet opening and the third outlet opening; and the coolant channel is in fluid communication with the inlet fluid chamber volume and the outlet fluid chamber volume [0022].
Regarding Claim 5
FIG. 1 of Song discloses the second inlet opening at least partially overlaps and is in fluid communication with the third outlet opening and the second outlet opening at least partially overlaps and is in fluid communication with the third inlet opening.
Regarding Claim 6
FIG. 1 of Song discloses the inlet and outlet fluid chamber volumes are separated by a divider.
Regarding Claim 7
FIG. 1 of Song discloses the first distance is greater than the second distance.
Regarding Claim 8
With respect to “the first distance is between 1 to 10 cm”, said distance is related to the physical properties of the heat dissipation fluid ([0025] of Song) and the device size. Therefore, said distance is considered to be a result effective variable. The claim to a specific distance therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05).
Regarding Claim 11
With respect to “a gap between the first semiconductor device and the second semiconductor device is between 50 to 300 μm”, said gap is related to the device size and heat dissipation. Therefore, said gap is considered to be a result effective variable. The claim to a specific distance therefore constitutes an optimization of ranges. In re Huang, 100 F.3d 135, 40 USPQ2d 1685, 1688 (Fed. Cir. 1996). It would have been obvious to one of ordinary skill in the art at the time of the invention to use the parameters as claimed, since it has been held that where the general conditions of a claim are disclosed in the prior art, discovering the optimum or workable ranges involves only routine skill in the art (MPEP 2144.05).
Regarding Claim 12
FIG. 7 of Song discloses the semiconductor device comprises a plurality of integrated circuit dies.
Regarding Claim 13
FIG. 7 of Song discloses the opening adaptor comprises silicon, a metal, or a plastic material [0028].
Regarding Claim 22
FIG. 7 of Song discloses a backside of the semiconductor device is exposed to the coolant channel.
Regarding Claim 28
FIG. 7 of Song discloses the cold plate comprises a cavity divider to define a plurality of coolant channels (158).
Claims 1 and 4 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Campbell (U.S. Patent Pub. No. 2010/0142150).
Regarding Claim 1
FIG. 1 of Campbell discloses an integrated cooling assembly comprising: a semiconductor device (120); an opening adaptor (170) comprising an inlet opening (162), an outlet opening (172), sidewalls, and a divider between the sidewalls; and a cold plate (160) attached between the semiconductor device and the opening adaptor, the cold plate comprising a first opening [0029] and a second opening (164) spaced apart by a first distance and in fluid communication with a coolant channel [0040], wherein: at least a portion of a first side of the cold plate is spaced apart from the semiconductor device to define the coolant channel therebetween; the sidewalls and the divider of the opening adaptor extend downwardly to a second side of the cold plate to define an inlet chamber volume and an outlet chamber volume therebetween [0034]; the inlet and outlet openings of the opening adaptor are spaced apart by a second distance different from the first distance; and the coolant channel is in fluid communication with the inlet chamber volume and the outlet chamber volume via the first and second openings of the cold plate [0029].
Regarding Claim 4
FIG. 1 of Campbell discloses an integrated cooling assembly comprising: a semiconductor device (120); a cold plate (160) attached to the semiconductor device, and an opening adaptor (170) comprising a first side, a second side opposite the first side, an inlet fluid chamber volume, and an outlet fluid chamber volume, wherein: the first side of the opening adaptor comprises a first inlet opening (162) and a first outlet opening (172) spaced apart by a second distance; the second side of the opening adaptor comprises a second inlet opening and a second outlet opening spaced apart by a first distance different from the second distance; the cold plate comprises a coolant channel [0040], a third inlet opening [0029] and a third outlet opening (164) spaced apart by the first distance; the second side of the opening adaptor is attached to a side of the cold plate comprising the third inlet opening and the third outlet opening; and the coolant channel is in fluid communication with the inlet fluid chamber volume and the outlet fluid chamber volume [0029].
Claims 1 and 4 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Park (U.S. Patent Pub. No. 2023/0298969).
Regarding Claim 1
FIG. 3 of Park discloses an integrated cooling assembly comprising: a semiconductor device (320); an opening adaptor (360) comprising an inlet opening (332), an outlet opening (334), sidewalls, and a divider between the sidewalls; and a cold plate (306) attached between the semiconductor device and the opening adaptor, the cold plate comprising a first opening (330) and a second opening (330) spaced apart by a first distance and in fluid communication with a coolant channel (FIG. 5), wherein: at least a portion of a first side of the cold plate is spaced apart from the semiconductor device to define the coolant channel therebetween; the sidewalls and the divider of the opening adaptor extend downwardly to a second side of the cold plate to define an inlet chamber volume and an outlet chamber volume therebetween [0032]; the inlet and outlet openings of the opening adaptor are spaced apart by a second distance different from the first distance; and the coolant channel is in fluid communication with the inlet chamber volume and the outlet chamber volume via the first and second openings of the cold plate [0038].
Regarding Claim 4
FIG. 3 of Park discloses an integrated cooling assembly comprising: a semiconductor device (320); a cold plate (306) attached to the semiconductor device, and an opening adaptor (360) comprising a first side, a second side opposite the first side, an inlet fluid chamber volume, and an outlet fluid chamber volume, wherein: the first side of the opening adaptor comprises a first inlet opening (332) and a first outlet opening (334) spaced apart by a second distance; the second side of the opening adaptor comprises a second inlet opening and a second outlet opening spaced apart by a first distance different from the second distance; the cold plate comprises a coolant channel (FIG. 5), a third inlet opening (330) and a third outlet opening (330) spaced apart by the first distance; the second side of the opening adaptor is attached to a side of the cold plate comprising the third inlet opening and the third outlet opening; and the coolant channel is in fluid communication with the inlet fluid chamber volume and the outlet fluid chamber volume [0032].
Claim Rejections – 35 U.S.C. 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claim 9 rejected under 35 U.S.C. 103 as being unpatentable over Song, in view of Lu (U.S. Patent Pub. No. 2006/0042825).
Regarding Claim 9
Song discloses Claim 1, further comprises: a second semiconductor device disposed horizontally adjacent to the first semiconductor (FIG. 7).
Song is silent with respect to “a heat sink disposed above the second semiconductor device, wherein the heat sink extends laterally above a portion of the opening adaptor”.
FIG. 1 of Lu discloses a similar integrated cooling assembly, comprising a heat sink (24) disposed above the second semiconductor device, wherein the heat sink extends laterally above a portion of the opening adaptor (31).
It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Song, as taught by Lu. The ordinary artisan would have been motivated to modify Song in the above manner for purpose of more efficient cooling of a semiconductor chip ([0006] of Lu).
Claim 10 rejected under 35 U.S.C. 103 as being unpatentable over Song and Lu, in view of Hsiso (U.S. Patent Pub. No. 2022/0037231).
Regarding Claim 10
Song as modified by Lu discloses Claim 9.
Song as modified by Lu is silent with respect to “the integrated cooling assembly further comprises a third semiconductor device disposed horizontally adjacent to the first semiconductor device, wherein: the first semiconductor device is disposed between the second and third semiconductor devices; a first portion of the heat sink is disposed above the second semiconductor device and a second portion of the heat sink is disposed above the third semiconductor device; and the first distance is less than a distance between the first and second portions of the heat sink”.
FIG. 21 of Hsiso discloses a similar integrated cooling assembly, comprising a third semiconductor device disposed horizontally adjacent to the first semiconductor device (118), wherein: the first semiconductor device is disposed between the second and third semiconductor devices; a first portion of the heat sink (140) is disposed above the second semiconductor device and a second portion of the heat sink is disposed above the third semiconductor device; and the first distance (between 142) is less than a distance between the first and second portions of the heat sink.
It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Song, as taught by Hsiso. The ordinary artisan would have been motivated to modify Song in the above manner for purpose of improving cooling capacity ([0009] of Hsiso).
Claim 16 rejected under 35 U.S.C. 103 as being unpatentable over Song, in view of Teng (U.S. Patent Pub. No. 2020/0105644).
Regarding Claim 16
Song discloses Claim 1.
Song is silent with respect to “the opening adaptor is attached the cold plate by an adhesive and the adhesive forms a fluid seal between the opening adaptor and the cold plate”.
FIG. 11 of Hsiso discloses a similar integrated cooling assembly, wherein: the opening adaptor (121) is attached the cold plate (117) by an adhesive (122) and the adhesive forms a fluid seal between the opening adaptor and the cold plate [0030].
It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Song, as taught by Hsiso. The ordinary artisan would have been motivated to modify Song in the above manner for purpose of improving cooling capacity ([0009] of Hsiso).
Claims 17-20 rejected under 35 U.S.C. 103 as being unpatentable over Song, in view of Colgan (U.S. Patent Pub. No. 2009/0284921).
Regarding Claim 17
Song discloses Claim 1.
Song is silent with respect to “the cold plate comprises silicon and the opening adaptor is attached to the cold plate by direct dielectric bonds”.
FIG. 1 of Colgan discloses a similar integrated cooling assembly, wherein: the cold plate (30) comprises silicon and the opening adaptor (50) is attached to the cold plate by direct dielectric bonds [0043].
It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Song, as taught by Colgan. The ordinary artisan would have been motivated to modify Song in the above manner for purpose of CTE matching and providing a rigid thermal bond ([0043] of Colgan).
Regarding Claim 18
FIG. 1 of Colgan discloses the cold plate comprises silicon and the opening adaptor (50) is attached to the cold plate (40) by direct hybrid bonds [0045].
Regarding Claim 19
FIG. 1 of Colgan discloses the cold plate and the semiconductor device are attached by direct dielectric bonds [0043].
Regarding Claim 20
FIG. 1 of Colgan discloses the cold plate and the semiconductor device (13) are attached by direct hybrid bonds [0045].
Pertinent Art
Malouin (U.S. Patent Pub. No. 2022/0230937), 20180166359, 20210074608, 20220210949 and 20240038633.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHENG-BAI ZHU whose telephone number is (571)270-3904. The examiner can normally be reached on 11am – 7pm EST.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Chad Dicke can be reached on (571)270-7996. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/SHENG-BAI ZHU/Primary Examiner, Art Unit 2897
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